Semiconductor Wafer, Semiconductor Chip And Method Of Fabricating A Semiconductor Wafer

Patent No. EP3557610 (titled "Semiconductor Wafer, Semiconductor Chip And Method Of Fabricating A Semiconductor Wafer") was filed by Infineon Austria on Apr 17, 2018. The application was issued on Oct 23, 2019.

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EP3557610

INFINEON AUSTRIA
Application Number
EP18167785A
Filing Date
Apr 17, 2018
Status
Intended To Grant
May 25, 2025
Publication Date
Oct 23, 2019