Patent No. EP3557610 (titled "Semiconductor Wafer, Semiconductor Chip And Method Of Fabricating A Semiconductor Wafer") was filed by Infineon Austria on Apr 17, 2018. The application was issued on Oct 23, 2019.

The dossier documents provide a comprehensive record of the patent's prosecution history - including filings, correspondence, and decisions made by patent offices - and are crucial for understanding the patent's legal journey and any challenges it may have faced during examination.
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