Multilayer Composites With Reduced Bond Line Read Through

Patent No. EP3600870 (titled "Multilayer Composites With Reduced Bond Line Read Through") was filed by Sika Technology on Mar 29, 2018. The application was issued on Feb 26, 2025.

Patent Summary

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L & L PRODUCTS EUROPESep 29, 2021KUTZENBERGER WOLFF & PARTNER

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EP3600870

SIKA TECHNOLOGY
Application Number
EP18712922A
Filing Date
Mar 29, 2018
Status
Patent Maintained As Amended
Jan 24, 2025
Publication Date
Feb 26, 2025