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Ceramic-Copper Circuit Substrate And Semiconductor Device Using Same

Patent No. EP3606299 (titled "Ceramic-Copper Circuit Substrate And Semiconductor Device Using Same") was filed by Kabushiki Kaisha Toshiba on Mar 23, 2018. The application was issued on Jul 30, 2025.

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STRAWMANMay 25, 2023VOSSIUS & PARTNER PATENTANWALTE RECHTSANWALTE MBB

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EP3606299

KABUSHIKI KAISHA TOSHIBA
Application Number
EP18774710A
Filing Date
Mar 23, 2018
Status
Patent Maintained As Amended
Jun 27, 2025
Publication Date
Jul 30, 2025
External Links
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