IP Verse

High Temperature Epoxy Adhesive Formulations

Patent No. EP3642292 (titled "High Temperature Epoxy Adhesive Formulations") was filed by DDP Specialty Electronic Materials on Apr 10, 2018. The application was issued on Jul 2, 2025.

Patent Summary

Patent Family

Patent Family

Patent Oppositions

Patent oppositions filed by competitors challenge the validity of a granted patent. These oppositions are typically based on claims of prior art, lack of novelty, or non-obviousness. They are a key part of the process for determining a patent's strength and enforceability.

CompanyOpposition DateRepresentative
L & L PRODUCTS EUROPEDec 17, 2021KUTZENBERGER WOLFF & PARTNER

Dossier Documents

The dossier documents provide a comprehensive record of the patent's prosecution history - including filings, correspondence, and decisions made by patent offices - and are crucial for understanding the patent's legal journey and any challenges it may have faced during examination.

  • Date

    Description

  • Get instant alerts for new documents

EP3642292

DDP SPECIALTY ELECTRONIC MATERIALS
Application Number
EP18721912A
Filing Date
Apr 10, 2018
Status
Patent Maintained As Amended
May 29, 2025
Publication Date
Jul 2, 2025
External Links
Slate, Register , Google Patents