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Thermally-Conductive Silicone Gel Composition, Thermally-Conductive Member, And Heat Dissipation Structure

Patent No. EP3660099 (titled "Thermally-Conductive Silicone Gel Composition, Thermally-Conductive Member, And Heat Dissipation Structure") was filed by DOW Toray on Jul 11, 2018. The application was issued on Sep 11, 2024.

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CompanyOpposition DateRepresentative
HENKELJun 11, 2025LKGLOBAL LORENZ & KOPF

Dossier Documents

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  • Date

    Description

EP3660099

DOW TORAY
Application Number
EP18838000A
Filing Date
Jul 11, 2018
Status
Granted And Under Opposition
Aug 8, 2024
Publication Date
Sep 11, 2024
External Links
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