Resin Composition, Prepreg, Laminate, Metal Foil-Clad Laminate, Printed Wiring Board, And Multilayer Printed Wiring Board

Patent No. EP3733746 (titled "Resin Composition, Prepreg, Laminate, Metal Foil-Clad Laminate, Printed Wiring Board, And Multilayer Printed Wiring Board") was filed by Mitsubishi GAS Chemical on Dec 25, 2018. The application was issued on Aug 27, 2025.

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EP3733746

MITSUBISHI GAS CHEMICAL
Application Number
EP18894398A
Filing Date
Dec 25, 2018
Status
Granted And Under Opposition
Jul 25, 2025
Publication Date
Aug 27, 2025