Patent No. EP3733746 (titled "Resin Composition, Prepreg, Laminate, Metal Foil-Clad Laminate, Printed Wiring Board, And Multilayer Printed Wiring Board") was filed by Mitsubishi GAS Chemical on Dec 25, 2018. The application was issued on Aug 27, 2025.

The dossier documents provide a comprehensive record of the patent's prosecution history - including filings, correspondence, and decisions made by patent offices - and are crucial for understanding the patent's legal journey and any challenges it may have faced during examination.
Date
Description
Get instant alerts for new documents