Vacuum Pump With Thermal Insulation
Patent No. EP3808982 (titled "Vacuum Pump With Thermal Insulation") was filed by Ebara on Oct 13, 2020. The application was issued on Dec 4, 2024.
Patent Summary
A vacuum pump apparatus for semiconductor manufacturing that prevents temperature drop in the pump casing due to heat transfer. The apparatus includes a pump casing with a rotor chamber, a pump rotor, and an electric motor. A side cover forms the end surface of the rotor chamber and houses a side heater. A heat insulator, comprising a heat insulating plate and spacers, is sandwiched between the side cover and the housing structure. The heat insulator maintains a high temperature in the rotor chamber while preventing heat transfer from the pump casing.
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Date
Description
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EP3808982
- Application Number
- EP20201640A
- Filing Date
- Oct 13, 2020
- Status
- Granted And Under Opposition
- Nov 1, 2024
- Publication Date
- Dec 4, 2024
- External Links
- Slate, Register , Google Patents