Heat-Sealable Barrier Paper

Patent No. EP3821074 (titled "Heat-Sealable Barrier Paper") was filed by Mitsubishi Hitec Paper Europe on Jul 10, 2019. The application was issued on Jan 11, 2023.

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EP3821074

MITSUBISHI HITEC PAPER EUROPE
Application Number
EP19739964A
Filing Date
Jul 10, 2019
Status
Revoked
Apr 25, 2025
Publication Date
Jan 11, 2023