Method Of Manufacturing Semiconductor Chips Having A Side Wall Sealing

Patent No. EP3987565 (titled "Method Of Manufacturing Semiconductor Chips Having A Side Wall Sealing") was filed by Infineon Austria on Jun 18, 2020. The application was issued on Aug 20, 2025.

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EP3987565

INFINEON AUSTRIA
Application Number
EP20732936A
Filing Date
Jun 18, 2020
Status
Granted And Under Opposition
Jul 18, 2025
Publication Date
Aug 20, 2025