Patent No. EP3987565 (titled "Method Of Manufacturing Semiconductor Chips Having A Side Wall Sealing") was filed by Infineon Austria on Jun 18, 2020. The application was issued on Aug 20, 2025.

The dossier documents provide a comprehensive record of the patent's prosecution history - including filings, correspondence, and decisions made by patent offices - and are crucial for understanding the patent's legal journey and any challenges it may have faced during examination.
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