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High-Strength Solder-Plated Al-Mg-Si Aluminum Material

Patent No. EP4132743 (titled "High-Strength Solder-Plated Al-Mg-Si Aluminum Material") was filed by Speira on Apr 8, 2021. The application was issued on Nov 29, 2023.

Patent Summary

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Patent Oppositions (2)

Patent oppositions filed by competitors challenge the validity of a granted patent. These oppositions are typically based on claims of prior art, lack of novelty, or non-obviousness. They are a key part of the process for determining a patent's strength and enforceability.

CompanyOpposition DateRepresentative
GRANGESAug 28, 2024VALEA
C TEC CONSTELLIUM TECHNOLOGY CENTER CONSTELLIUM NEUF BRISACHAug 26, 2024CONSTELLIUM PROPRIETE INDUSTRIELLE

Dossier Documents

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EP4132743

SPEIRA
Application Number
EP21717430A
Filing Date
Apr 8, 2021
Status
Granted And Under Opposition
Oct 27, 2023
Publication Date
Nov 29, 2023
External Links
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