Patent No. EP4279265 (titled "Conductive Paste, Laminate Body, Method Of Bonding Copper Laminate/Copper Electrode And Conductor") was filed by Senju Metal Industry on Sep 30, 2020. The application was issued on Dec 25, 2024.

The dossier documents provide a comprehensive record of the patent's prosecution history - including filings, correspondence, and decisions made by patent offices - and are crucial for understanding the patent's legal journey and any challenges it may have faced during examination.
Date
Description
Get instant alerts for new documents