Conductive Paste, Laminate Body, Method Of Bonding Copper Laminate/Copper Electrode And Conductor

Patent No. EP4279265 (titled "Conductive Paste, Laminate Body, Method Of Bonding Copper Laminate/Copper Electrode And Conductor") was filed by Senju Metal Industry on Sep 30, 2020. The application was issued on Dec 25, 2024.

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EP4279265

SENJU METAL INDUSTRY
Application Number
EP23200616A
Filing Date
Sep 30, 2020
Status
Granted And Under Opposition
Nov 22, 2024
Publication Date
Dec 25, 2024