Solder Alloy, Solder Ball, Solder Paste, And Solder Joint
Patent No. EP4309841 (titled "Solder Alloy, Solder Ball, Solder Paste, And Solder Joint") was filed by Senju Metal Industry on Jul 21, 2023. The application was issued on Dec 11, 2024.
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EP4309841
- Application Number
- EP23186981A
- Filing Date
- Jul 21, 2023
- Status
- Granted And Under Opposition
- Nov 8, 2024
- Publication Date
- Dec 11, 2024
- External Links
- Slate, Register , Google Patents