A Method For Forming A Semiconductor Device With A Buried Power Rail
Patent No. EP4379784 (titled "A Method For Forming A Semiconductor Device With A Buried Power Rail") was filed by Imec VZW on Nov 30, 2022. The application was issued on Sep 17, 2025.
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EP4379784
- Application Number
- EP22210562A
- Filing Date
- Nov 30, 2022
- Status
- Granted And Under Opposition
- Aug 15, 2025
- Publication Date
- Sep 17, 2025
- External Links
- Slate, Register , Google Patents