Method For Forming A Terminal Element, Terminal Element, And Power Semiconductor Module Arrangement Comprising A Terminal Element

Patent No. EP4411995 (titled "Method For Forming A Terminal Element, Terminal Element, And Power Semiconductor Module Arrangement Comprising A Terminal Element") was filed by Infineon on Feb 6, 2023. The application was issued on Aug 7, 2024.

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EP4411995

INFINEON
Application Number
EP23155082A
Filing Date
Feb 6, 2023
Status
Intended To Grant
May 7, 2025
Publication Date
Aug 7, 2024