Vertical Interconnect Micro-Component And Method For Producing A Vertical Interconnect Micro-Component
Patent No. EP4573592 (titled "Vertical Interconnect Micro-Component And Method For Producing A Vertical Interconnect Micro-Component") was filed by Schott on Aug 19, 2022. The application was issued on Jun 25, 2025.
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EP4573592
- Application Number
- EP22955381A
- Filing Date
- Aug 19, 2022
- Status
- Request For Examination Was Made
- May 23, 2025
- Publication Date
- Jun 25, 2025
- External Links
- Slate, Register , Google Patents