Methods And Systems For Welding Copper Using Blue Laser

Patent No. US10940562 (titled "Methods And Systems For Welding Copper Using Blue Laser") was filed by Blue 425 Llc on Jan 31, 2018.

What is this patent about?

’562 is related to the field of laser welding, specifically addressing the challenges of welding copper-based materials . Copper's high reflectivity and thermal conductivity make it difficult to weld using traditional infrared lasers, often leading to defects like spatter and micro-explosions. Current solutions, such as ultrasonic welding, also have limitations in terms of weld quality and process variability, especially when joining thin copper foils in applications like battery manufacturing.

The underlying idea behind ’562 is to use a blue laser (wavelengths between 400 nm and 500 nm) to weld copper. This exploits the significantly higher absorption rate of copper at these wavelengths (around 65%), enabling more efficient and stable energy coupling into the material. By using a blue laser, the process minimizes or eliminates common welding defects, allowing for both conduction and keyhole welding modes with improved control and reduced spatter.

The claims of ’562 focus on a method for welding copper-based materials using a blue laser beam. The method involves placing two pieces of copper-based material in contact and directing the blue laser beam at the workpiece to form a weld. A key aspect of the claims is the resulting weld's characteristics, specifically that the microstructure of the copper material, the heat-affected zone (HAZ), and the resolidification zone are essentially identical, indicating a high-quality, homogenous weld.

In practice, the blue laser system allows for stable welding of copper in both conduction and keyhole modes. In conduction mode, the laser heats the copper to its melting point, creating a weld pool that solidifies with a microstructure similar to the base material. In keyhole mode, the laser vaporizes the copper, creating a deep, narrow weld with minimal spatter. The laser power and spot size are carefully controlled to optimize the welding process and minimize defects. Shielding gases like Argon or Helium can be used to prevent oxidation during welding.

The differentiation from prior approaches lies in the use of the blue laser's wavelength to achieve superior energy coupling with copper. Unlike infrared lasers, which struggle with copper's high reflectivity, the blue laser efficiently heats the material, leading to more controlled melting and reduced vaporization. This results in welds with improved microstructure, hardness, and reduced defects, particularly in applications involving thin copper foils and stacks, where traditional methods like ultrasonic welding often fall short.

How does this patent fit in bigger picture?

Technical landscape at the time

In the late 2010s when ’562 was filed, laser welding was a well-established technique, but welding highly reflective materials like copper remained challenging. At a time when infrared lasers were commonly used for welding, the high reflectivity of copper at these wavelengths made it difficult to efficiently couple energy into the material. This often necessitated high laser power and techniques to initiate and maintain a keyhole weld, when systems commonly relied on these keyhole techniques rather than conduction mode welding for copper.

Novelty and Inventive Step

The examiner allowed the claims because the combination of using a blue laser to weld two copper materials, resulting in a weld with a heat-affected zone (HAZ) and a resolidification zone where the microstructure of the copper base, HAZ, and resolidification zone are identical, was not disclosed or rendered obvious by the prior art.

Claims

This patent contains 83 claims, of which claims 1, 23, 48, and 70 are independent. The independent claims are directed to methods of welding copper-based materials using a blue laser beam. The dependent claims generally elaborate on and refine the parameters and conditions of the welding methods described in the independent claims, such as specific laser power densities, wavelengths, shielding gases, and material compositions.

Key Claim Terms New

Definitions of key terms used in the patent claims.

Term (Source)Support for SpecificationInterpretation
Blue laser beam
(Claim 1, Claim 23, Claim 48, Claim 70)
“As used herein, unless expressly stated otherwise, the terms “blue laser beams”, “blue lasers” and “blue” should be given their broadest meaning, and in general refer to systems that provide laser beams, laser beams, laser sources, e.g., lasers and diodes lasers, that provide, e.g., propagate, a laser beam, or light having a wavelength from about 400 nm to about 500 nm.”A laser beam having a wavelength from about 400 nm to about 500 nm.
Copper based material
(Claim 1, Claim 23, Claim 48, Claim 70)
“The term “copper based material” unless expressly provided otherwise, should be given it broadest possible meaning and would include copper, copper materials, copper metal, materials electroplated with copper, metallic materials that contain from at least about 10% copper by weight to 100% copper, metals and alloys containing from at least about 10% copper by weight to 100% copper by weight, metals and alloys containing from at least about 20% copper by weight to 100% copper by weight, metals and alloys containing from at least about 10% copper by weight to 100% copper by weight, metals and alloys containing from at least about 50% copper by weight to 100% copper by weight, metals and alloys containing from at least about 70% copper by weight to 100% copper by weight, and metals and alloys containing from at least about 90% copper by weight to 100% copper by weight.”Copper, copper materials, copper metal, materials electroplated with copper, metallic materials that contain from at least about 10% copper by weight to 100% copper, metals and alloys containing from at least about 10% copper by weight to 100% copper by weight, metals and alloys containing from at least about 20% copper by weight to 100% copper by weight, metals and alloys containing from at least about 10% copper by weight to 100% copper by weight, metals and alloys containing from at least about 50% copper by weight to 100% copper by weight, metals and alloys containing from at least about 70% copper by weight to 100% copper by weight, and metals and alloys containing from at least about 90% copper by weight to 100% copper by weight.
Haz
(Claim 1, Claim 23, Claim 48, Claim 70)
“There is further provided these welds, systems and methods having one or more of the following systems; wherein the identical microstructures shows no discernable difference in the weld that would indicate a weakness in the weld; wherein the identical microstructure includes crystal growth regions of similar size; wherein the weld is formed by conduction mode welding; wherein the weld is formed by keyhole mode welding; wherein the first and second pieces have a thickness of from about 10 μm to about 500 μm; wherein the first piece includes a plurality of layers of copper foil; wherein the first piece is copper metal; wherein the first piece is a copper alloy, having from about 10 to about 95 weight percent copper; wherein the laser beam is directed to the work piece as a focused spot having power density is less than 800 kW/cm2.”Heat Affected Zone of the weld.
Keyhole mode weld
(Claim 70)
“When using an IR laser source at 1030 nm, the high reflectivity of the copper at this wavelength makes it difficult to couple power into the material to heat and weld it. One method to overcome the high reflectivity is to use a high-power level (>1 kW) IR laser to initiate a keyhole weld which then couples the power into the material. The problems with this method of welding, among other things, is that the vapor in the keyhole can lead to a micro-explosion, spraying molten copper all over the parts being welded or the micro-explosion can cause a hole completely through the parts being welded.”A weld formed by a process where the laser beam creates a keyhole in the material.
Resolidification zone
(Claim 1, Claim 23, Claim 48, Claim 70)
“There is further provided these welds, systems and methods having one or more of the following systems; wherein the identical microstructures shows no discernable difference in the weld that would indicate a weakness in the weld; wherein the identical microstructure includes crystal growth regions of similar size; wherein the weld is formed by conduction mode welding; wherein the weld is formed by keyhole mode welding; wherein the first and second pieces have a thickness of from about 10 μm to about 500 μm; wherein the first piece includes a plurality of layers of copper foil; wherein the first piece is copper metal; wherein the first piece is a copper alloy, having from about 10 to about 95 weight percent copper; wherein the laser beam is directed to the work piece as a focused spot having power density is less than 800 kW/cm2.”The zone of the weld where the material has resolidified after being melted by the laser.

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US10940562

BLUE 425 LLC
Application Number
US15884672
Filing Date
Jan 31, 2018
Status
Granted
Expiry Date
Oct 22, 2038
External Links
Slate, USPTO, Google Patents