Electronic Module

What is this patent about?

’207 is related to the field of electronic module manufacturing, specifically addressing the challenge of embedding components, such as microcircuits, within an installation base like a circuit board. Traditional methods like flip-chip technology suffer from reliability issues due to mechanical stress, while other approaches involving feed-throughs in insulation layers face alignment and manufacturing precision problems. The patent aims to provide a more reliable and economical method for embedding unpackaged components.

The underlying idea behind ’207 is to embed a component within a cavity in an insulating base, and then connect the component's contact pads directly to a conductive layer that covers the cavity. This eliminates the need for complex feed-throughs through insulating layers. The conductive layer is then patterned to create the necessary electrical connections. By aligning both the component and the conductive patterns relative to the installation base, precise electrical connections can be achieved.

The claims of ’207 focus on an electronic module comprising a first and second conductive-pattern layer, an insulating-material layer with at least one installation cavity, and a component with aluminum contact zones disposed within the cavity. First contact bumps are disposed on the first surface of the second conductive-pattern layer, and second contact bumps are disposed on the contact zones, both electrically connected. At least one of the conductive-pattern layers comprises at least two layers of at least two different materials.

In practice, the invention involves creating a cavity in an insulating base material, placing a component within the cavity such that its contact pads face a conductive layer, and then using methods like ultrasonic welding or thermo-compression to create a metallurgical bond between the contact pads and the conductive layer. The space around the component is then filled with a polymer filler for mechanical support and protection. Finally, the conductive layer is patterned to form the necessary electrical connections.

This approach differentiates itself from prior art by avoiding the need for feed-throughs and by providing a more mechanically robust connection. By embedding the component within the installation base, the resulting module is better able to withstand mechanical stress. Furthermore, the use of solderless connection methods , such as ultrasonic welding, reduces the formation of undesirable intermetallics, improving long-term reliability and enabling the creation of smaller, denser electronic modules.