Techniques For Pain Relief

Patent No. US11380985 (titled "Techniques For Pain Relief") was filed by Ncap Licensing Llc on Jul 6, 2020.

What is this patent about?

’985 is related to the field of pain relief, specifically addressing the need for effective, safe, and non-invasive techniques to mitigate pain without hindering the body's natural healing processes. Current methods often rely on pharmaceuticals or invasive procedures, which can have limitations, side effects, or interfere with the body's ability to heal.

The underlying idea behind ’985 is to leverage a reactive capacitance material to enhance the body's natural nerve impulse communication, particularly in the context of pain signals. Instead of blocking or distracting from pain signals, the invention aims to facilitate clearer reception of these signals by the brain, potentially enabling the brain to better assist in the body's healing processes.

The claims of ’985 focus on a patch comprising a first non-conductive outer layer, a reactive capacitance layer, and a second non-conductive outer layer. The reactive capacitance layer is encased and electrically isolated between the outer layers and is composed of conductive particles dispersed in a binder , with the majority of particles being adjacent but not touching each other. The claims also cover a method of using this patch by placing it either at the source of pain or between the pain source and the brain.

In practice, the patch is applied to the skin near the source of pain or along the nerve pathway leading to the brain. The capacitively coupled conductive particles within the reactive capacitance layer are believed to interact with the body's bioelectrical signals, enhancing nerve impulse communication. This enhanced communication allows the brain to more effectively process the pain signals and initiate appropriate healing responses.

The differentiation from prior approaches lies in the mechanism of action. Unlike TENS devices that introduce external electrical stimulation or pharmaceuticals that chemically interfere with nerve signals, this invention passively enhances the body's own communication pathways. The non-ohmic conduction and the specific arrangement of conductive particles within the binder are crucial for achieving this effect, creating a unique interaction with the body's bioelectrical field.

How does this patent fit in bigger picture?

Technical landscape at the time

In the early 2010s when ’985 was filed, pain relief was typically achieved through pharmaceutical interventions or electrical stimulation devices. At a time when implantable medical devices commonly relied on established biocompatible materials and power sources, hardware or software constraints made non-invasive, passive pain relief solutions non-trivial.

Novelty and Inventive Step

The claims were rejected in a non-final office action. The rejection was based on nonstatutory double patenting over claims of U.S. Patent No. 10,707,570. The prosecution record does not describe the technical reasoning or specific claim changes that led to allowance.

Claims

This patent contains 23 claims, with independent claims 1 and 13. Independent claim 1 focuses on a method for using a pain relief patch, while independent claim 13 focuses on the pain relief patch itself. The dependent claims generally elaborate on the method and patch, adding details regarding the body type, reactive capacitance layer, flexibility, resistance, materials, additional layers, and attachment mechanisms.

Key Claim Terms New

Definitions of key terms used in the patent claims.

Term (Source)Support for SpecificationInterpretation
Conductive particles
(Claim 1, Claim 13)
“The conductive particles may be any conductive material, such as silver, copper, nickel, aluminum, steel, metal alloys, carbon nanotubes, any other conductive material, and any combination thereof. For example, in one exemplary embodiment, the conductive particles are silver coated copper. Alternatively, the conductive particles may be a combination of a conductive material and a non-conductive material.”Particles made of a conductive material that are dispersed within a binder in the reactive capacitance material.
First non-conductive outer layer
(Claim 1, Claim 13)
“The binder is used to substantially fix the conductive particles relative to each other and should be a non-conductive or semi-conductive substance. Any type of conventional or novel binder that meets these criteria may be used. The non-conductive or semi-conductive material of the binder may be chosen to function as a dielectric with a given permittivity.”A non-conductive layer that encases the reactive capacitance layer.
Reactive capacitance layer
(Claim 1, Claim 13)
“The reactive capacitance material includes at least two constituent components, namely conductive particles and a binder. However, the reactive capacitance material may include additional components, such as at least one of graphite, carbon (e.g., carbon black), titanium dioxide, etc.”A layer within the patch, encased and electrically isolated by non-conductive outer layers, and formed of a reactive capacitance material.
Reactive capacitance material
(Claim 1, Claim 13)
“The reactive capacitance material includes at least two constituent components, namely conductive particles and a binder. However, the reactive capacitance material may include additional components, such as at least one of graphite, carbon (e.g., carbon black), titanium dioxide, etc.”A material comprising conductive particles dispersed in a binder, where a majority of the conductive particles are adjacent to, but not touching, each other.
Second non-conductive outer layer
(Claim 1, Claim 13)
“The binder is used to substantially fix the conductive particles relative to each other and should be a non-conductive or semi-conductive substance. Any type of conventional or novel binder that meets these criteria may be used. The non-conductive or semi-conductive material of the binder may be chosen to function as a dielectric with a given permittivity.”A non-conductive layer that encases the reactive capacitance layer.

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US11380985

NCAP LICENSING LLC
Application Number
US16921814
Filing Date
Jul 6, 2020
Status
Granted
Expiry Date
Nov 22, 2031
External Links
Slate, USPTO, Google Patents