Chip Package

What is this patent about?

’763 is related to the field of display technology and microelectronic packaging, specifically addressing the challenges of miniaturization and high-density interconnections in display devices. The background acknowledges the trend towards thinner and smaller microelectronic devices, highlighting the increasing importance of metal connections and their impact on circuit performance due to parasitic capacitance and resistance. Flip-chip technology is mentioned as an existing solution, but challenges remain in pre-testability, visual inspection, and thermal expansion matching.

The underlying idea behind ’763 is to use a glass substrate with through-glass vias (TGVs) as an interposer to bridge between integrated circuit chips and a display panel. The key insight is to leverage the advantages of glass, such as its lower material cost and CTE matching to silicon, to create a high-density interconnection platform. This involves forming metal plugs within the glass substrate to provide electrical pathways for connecting components on either side of the substrate.

The claims of ’763 focus on a chip package comprising a solid layer of silicon and oxygen (glass) with copper plugs in through vias. The claims specify dimensions (100-300 micrometers thickness), material composition, and the arrangement of the copper plugs in relation to the edge of the solid layer. The claims also cover interconnection schemes on both surfaces of the glass substrate, including metal interconnects, polymer layers, and metal bumps for connecting to semiconductor chips.

The implementation involves creating a glass substrate with embedded metal plugs that act as vertical interconnects. This is achieved through processes like forming metal traces within a glass matrix and then slicing the matrix into individual substrates. The metal plugs are then connected to metal interconnects on both the top and bottom surfaces of the substrate, allowing for the mounting of chips and other components. The use of a polymer layer over the metal interconnects provides insulation and mechanical support.

This approach differentiates itself from traditional flip-chip packaging by using a glass interposer with TGVs instead of ceramic or plastic. The close proximity of the metal plugs to the edge of the glass substrate (less than 100 micrometers) enables the creation of near-borderless displays . The use of copper plugs and copper interconnects aims to minimize resistance and improve signal integrity. The ability to mount components on both sides of the glass substrate further increases the integration density and functionality of the chip package.