Plasma Processing Apparatus

Patent No. US11756808 (titled "Plasma Processing Apparatus") was filed by Tokyo Electron Ltd on Jul 28, 2021.

What is this patent about?

’808 is related to the field of plasma processing, specifically addressing the challenge of maintaining a vacuum seal around pins that move vertically through a mounting table within a plasma processing apparatus. These pins are used to lift and separate wafers from the mounting table during transfer. The background highlights that temperature variations can cause the mounting table to expand or contract, leading to misalignment between the pins and their insertion holes, which compromises the seal and degrades the vacuum within the processing chamber.

The underlying idea behind ’808 is to introduce a movable member within a recess in the pin insertion hole, positioned between the pin and the wall of the hole. This movable member is sealed both to the pin and to the recess wall using two separate sealing elements. The key inventive insight is that this arrangement allows the movable member to shift slightly in response to forces caused by pin misalignment, thereby relieving localized compression on the primary seal and maintaining a more consistent and reliable vacuum seal.

The claims of ’808 focus on a plasma processing apparatus that includes a wafer stage with through-holes for pins. Each through-hole assembly features an annular recess, a pin, an annular member within the recess, a first annular sealing member between the pin and the annular member, and a second annular sealing member between the annular member and the recess. The apparatus also includes actuators to vertically move the pins.

In practice, the mounting table, which supports the wafer, experiences temperature fluctuations during plasma processing. These fluctuations cause the table to expand or contract, leading to a deviation between the axis of the pin and the axis of the pin insertion hole. Without compensation, this deviation would compress the primary seal unevenly, creating a leak path. However, the movable member, sealed with two O-rings (or similar seals), can shift slightly within its recess, accommodating the misalignment. This ensures that the primary seal remains relatively uniformly compressed against the pin, preventing vacuum leaks.

This design differs from prior approaches that rely on a single, fixed seal around the pin. The conventional approach is vulnerable to leaks when misalignment occurs due to thermal expansion. By introducing the movable member and the secondary sealing element, ’808 provides a more robust and reliable sealing solution that maintains the vacuum integrity of the plasma processing chamber, even under varying temperature conditions and mechanical stresses. This is particularly important for achieving consistent and high-quality plasma processing results.

How does this patent fit in bigger picture?

Technical landscape at the time

In the late 2010s when ’808 was filed, plasma processing equipment commonly relied on vacuum chambers and robotic wafer handling systems to perform precise material processing steps. At a time when wafer handling was typically implemented using lift pins and complex mechanical linkages, maintaining vacuum integrity around moving parts was a significant engineering constraint.

Novelty and Inventive Step

The examiner approved the application because the prior art did not disclose or suggest all the features of the claims, specifically the combination of an annular recess with upper and lower surfaces, a pin in the through-hole, an annular member within the recess having specific inner and outer surface configurations, and first and second annular sealing members positioned in particular locations between the pin, annular member, and recess surfaces.

Claims

There are 14 claims in total, with independent claims 1 and 11 directed to a plasma processing apparatus. The independent claims focus on the structure of a wafer stage having through holes with a specific assembly including annular recesses, pins, annular members, and sealing members. The dependent claims generally elaborate on specific features, arrangements, and materials of the elements described in the independent claims.

Key Claim Terms New

Definitions of key terms used in the patent claims.

Term (Source)Support for SpecificationInterpretation
Annular member
(Claim 1, Claim 11)
“In accordance with an aspect, there is provided a plasma processing apparatus comprising: an insertion member having a first surface facing a vacuum space, a second surface facing a non-vacuum space, and an insertion hole penetrating through the first surface and the second surface; a pin that is inserted into the insertion hole and moved vertically; a movable member that is provided in a recess formed on a wall surface of the insertion hole which faces the pin, the movable member having an opening into which the pin is inserted and being movable in the recess along a surface of the recess which intersects with an axial direction of the pin; a first sealing member provided between the movable member and the pin; and a second sealing member provided between the movable body and the surface of the recess and configured to allow, when a pressing force of the pin that locally compresses the first sealing member acts on the first sealing member, the movable member to move in a direction in which the pressing force is released.”A ring-shaped component disposed within the annular recess, having inner and outer surfaces with upper, horizontal, and lower sections, and positioned between the upper and lower surfaces of the annular recess.
Annular recess
(Claim 1, Claim 11)
“A sealing member such as an O-ring or the like is provided along a circumferential direction of the insertion hole on a wall surface of the insertion hole which faces the pin. The sealing member is brought into contact with the pin, thereby sealing the insertion hole. In the plasma processing apparatus, the airtightness of the vacuum space in the processing chamber is maintained by sealing the insertion hole with the sealing member (see, e.g., Japanese Patent Application Publication No. 2013-42012).”A groove or cavity that extends from a side surface of the through hole, having an upper and lower surface, and housing the annular member.
First annular sealing member
(Claim 1, Claim 11)
“The sealing member is brought into contact with the pin, thereby sealing the insertion hole. In the plasma processing apparatus, the airtightness of the vacuum space in the processing chamber is maintained by sealing the insertion hole with the sealing member (see, e.g., Japanese Patent Application Publication No. 2013-42012).”A ring-shaped sealing component positioned between the pin and the inner lower surface of the annular member.
Second annular sealing member
(Claim 1, Claim 11)
“The sealing member is brought into contact with the pin, thereby sealing the insertion hole. In the plasma processing apparatus, the airtightness of the vacuum space in the processing chamber is maintained by sealing the insertion hole with the sealing member (see, e.g., Japanese Patent Application Publication No. 2013-42012).”A ring-shaped sealing component positioned between the outer horizontal surface of the annular member and the upper surface of the annular recess.
Through hole assembly
(Claim 1, Claim 11)
“Conventionally, there is known a plasma processing apparatus for performing plasma processing on a target object such as a wafer or the like by using plasma. Such a plasma processing apparatus includes a mounting table for mounting thereon a target object serving as an electrode in a processing chamber where a vacuum space can be formed, for example. The plasma processing apparatus perform the plasma processing on the target object mounted on the mounting table by applying a predetermined high frequency power to the mounting table in the vacuum space formed in the processing chamber.”A component of the wafer stage that includes an annular recess, a pin, an annular member, a first annular sealing member, and a second annular sealing member.

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US11756808

TOKYO ELECTRON LTD
Application Number
US17386645
Filing Date
Jul 28, 2021
Status
Granted
Expiry Date
Mar 26, 2039
External Links
Slate, USPTO, Google Patents