Cryogenic Cooling System

Patent No. US12320557 (titled "Cryogenic Cooling System") was filed by Oxford Nanoscience Ltd on May 23, 2024.

What is this patent about?

’557 is related to the field of cryogenic cooling systems , particularly those used in demanding applications like superconducting quantum computing. Existing dilution refrigerators, while effective in academic settings, are limited in scalability and adaptability for industrial quantum information processing (QIP). The increasing heat loads from larger quantum computers and the need for more experimental space necessitate a more flexible and commercially viable solution.

The underlying idea behind ’557 is to create a modular cryogenic cooling system . Instead of a single, fixed-size refrigerator, the system comprises multiple interconnected modules. Each module contains its own cooling stages and can be connected to others via side faces. This allows for incremental scaling of the system's cooling power and internal volume, addressing the limitations of traditional designs.

The claims of ’557 focus on a cryogenic cooling system with a modular architecture . It includes a cryogenic refrigerator assembly and two or more connected modules. Each module has a housing with multiple side faces and internal cooling stages. The modules connect at their side faces, and a stage in one module is thermally coupled to a stage in another module using extension plates.

In practice, the modular design allows users to build a cryogenic system incrementally. By connecting modules, the shared internal volume and total cooling power increase. The extension plates facilitate thermal coupling between stages of different modules, enabling the sharing of cooling power and balancing of heat loads. This modularity also simplifies servicing, as individual modules can be accessed and maintained independently.

This modular approach differs significantly from prior art cylindrical dilution refrigerators. The orthogonal side faces of the modules allow for efficient space utilization and close packing. Furthermore, the system enables the integration of diverse cooling technologies across different modules, such as combining cryocoolers, liquid cryogen reservoirs, and dilution units. This flexibility allows for customized cooling solutions tailored to specific experimental needs, particularly in the context of scaling up quantum computing systems.

How does this patent fit in bigger picture?

Technical landscape at the time

In the early 2020s when ’557 was filed, cryogenic cooling systems for quantum computing were typically implemented using dilution refrigerators with vertically-spaced copper plates inside a cylindrical vacuum vessel. At a time when scaling up cooling power was non-trivial, systems commonly relied on single, large dilution units rather than modular architectures. When hardware or software constraints made balancing heat loads across multiple devices non-trivial.

Novelty and Inventive Step

The examiner approved the application because the prior art failed to teach or make obvious the use of extension plates to thermally couple stages of different modules in a cryogenic cooling system. Specifically, the examiner stated that the prior art references, while disclosing cryogenic cooling systems with connected modules and multiple dilution units, did not disclose or suggest the claimed limitation of "one or more extension plates; and wherein a first said stage of the plurality of stages of a first said module is thermally coupled to a first stage of the plurality of stages of a second said module by the one or more extension plates."

Claims

This patent contains 26 claims, with claim 1 being the only independent claim. The independent claim focuses on a cryogenic cooling system comprising a cryogenic refrigerator assembly and two or more connected modules. The dependent claims generally elaborate on specific features, configurations, and components of the cryogenic cooling system described in the independent claim.

Key Claim Terms New

Definitions of key terms used in the patent claims.

Term (Source)Support for SpecificationInterpretation
Connected modules
(Claim 1)
“A first aspect of the invention is a cryogenic cooling system comprising a cryogenic refrigerator assembly comprising one or more cryogenic refrigerators; and two or more connected modules, each said connected module comprising: a housing defining an internal volume for the module, the housing having a plurality of side faces; and a plurality of stages arranged within the internal volume for the module, wherein one or more of the plurality of stages is thermally coupled to the cryogenic refrigerator assembly; wherein the two or more said modules are mutually connected at respective side faces; and wherein a first said stage of a first said module is thermally coupled to a first said stage of a second said module.”Two or more modules that are mutually connected at respective side faces to form a shared internal volume.
Cryogenic refrigerator assembly
(Claim 1)
“A first aspect of the invention is a cryogenic cooling system comprising a cryogenic refrigerator assembly comprising one or more cryogenic refrigerators; and two or more connected modules, each said connected module comprising: a housing defining an internal volume for the module, the housing having a plurality of side faces; and a plurality of stages arranged within the internal volume for the module, wherein one or more of the plurality of stages is thermally coupled to the cryogenic refrigerator assembly;”One or more cryogenic refrigerators that provide cooling to the stages within the modules.
Extension plates
(Claim 1)
“The system preferably further comprises one or more extension plates, each said extension plate arranged to connect adjacent stages of different modules in the system. The system may hence be arranged so that one or more stages of a first said module are thermally coupled to respective stage(s) of a second said module by one or more extension plates mechanically connecting the said thermally coupled stages. The extension plate(s) may hence enhance the thermal conductivity between stages of adjacent modules.”Plates that mechanically connect adjacent stages of different modules, enhancing thermal conductivity between them.
Internal volume
(Claim 1)
“A first aspect of the invention is a cryogenic cooling system comprising a cryogenic refrigerator assembly comprising one or more cryogenic refrigerators; and two or more connected modules, each said connected module comprising: a housing defining an internal volume for the module, the housing having a plurality of side faces; and a plurality of stages arranged within the internal volume for the module, wherein one or more of the plurality of stages is thermally coupled to the cryogenic refrigerator assembly;”The space defined by the housing of each module, within which the stages are arranged. When modules are connected, they form a shared internal volume.
Side faces
(Claim 1)
“A first aspect of the invention is a cryogenic cooling system comprising a cryogenic refrigerator assembly comprising one or more cryogenic refrigerators; and two or more connected modules, each said connected module comprising: a housing defining an internal volume for the module, the housing having a plurality of side faces; and a plurality of stages arranged within the internal volume for the module, wherein one or more of the plurality of stages is thermally coupled to the cryogenic refrigerator assembly; wherein the two or more said modules are mutually connected at respective side faces; and wherein a first said stage of a first said module is thermally coupled to a first said stage of a second said module.”The faces of the housing of each module that allow the modules to be mutually connected.

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US12320557

OXFORD NANOSCIENCE LTD
Application Number
US18673039
Filing Date
May 23, 2024
Status
Granted
Expiry Date
May 10, 2043
External Links
Slate, USPTO, Google Patents