Wearable Computing Device
Patent No. US12393227 (titled "Wearable Computing Device") was filed by Jpmorgan Chase Bank Na on Dec 16, 2024.
What is this patent about?
’227 is related to the field of wearable electronic devices, specifically those in the form factor of a ring. The background acknowledges that existing wearable electronics can be bulky and intrusive, leading to discomfort and limited wear time. The patent addresses this by providing a compact, ring-shaped wearable computing device (WCD) designed for extended wear and continuous monitoring.
The underlying idea behind ’227 is to create a comfortable and unobtrusive wearable device by miniaturizing electronic components and arranging them within a ring-shaped housing. This involves using a flexible printed circuit board (PCB) to conform to the ring's curvature and strategically placing components to maximize functionality while maintaining a small form factor. A key aspect is the use of potting material to seal and protect the internal components, creating a robust and potentially waterproof device.
The claims of ’227 focus on a method of manufacturing a wearable ring device. The method involves constructing an external housing, inserting a curved battery, a printed circuit board, and one or more components into the internal space of the external housing. The method further includes applying an internal potting to at least partially fill the internal space of the external housing and cover the curved battery, the printed circuit board, and the one or more components, wherein the internal potting adheres to the external housing. The method also includes polymerizing the internal potting, wherein at least a layer of the internal potting forms an interior surface of the wearable ring device that is configured to contact tissue of the user when the wearable ring device is worn by the user, wherein the external housing and the internal potting form a housing for the wearable ring device, wherein the housing has an interior diameter between 12 mm and 24 mm, an exterior diameter between 18 mm and 30 mm, a width between 3 mm and 8 mm, and a thickness between 1.5 mm and 3 mm.
In practice, the invention involves assembling the electronic components onto the flexible PCB, shaping the PCB to fit within the ring housing, and then using a potting material, such as epoxy or silicone, to encapsulate the components. This potting process not only secures the components but also provides environmental protection and structural integrity. The dimensions of the ring are carefully controlled to ensure a comfortable fit on the user's finger.
The differentiation from prior approaches lies in the specific combination of form factor, component arrangement, and manufacturing process. By using a flexible PCB and potting material, the invention achieves a high level of miniaturization and durability in a ring-shaped wearable device. The use of transparent potting also allows for the integration of light-based sensors and indicators, further enhancing the device's functionality. The controlled dimensions ensure comfort and usability, addressing a key limitation of existing wearable devices.
How does this patent fit in bigger picture?
Technical landscape at the time
In the early 2010s when ’227 was filed, wearable computing devices were gaining traction, but hardware miniaturization and power management remained significant challenges. At a time when flexible circuit boards were becoming more common, integrating multiple sensors and communication capabilities into a small form factor, such as a ring, was non-trivial. Efficiently harvesting and managing power, especially for continuous monitoring applications, was typically implemented using larger batteries or wired charging solutions, rather than integrated photovoltaic cells.
Novelty and Inventive Step
The examiner stated that a prior art reference (Flake et al.) discloses a system that facilitates interaction with a device and/or data using a ring component. However, Flake et al. does not teach or suggest a method of manufacturing a wearable ring device that includes applying an internal potting to partially fill the internal space of the external housing and cover the curved battery, printed circuit board, and other components, where the internal potting adheres to the external housing. The examiner also stated that Flake et al. does not teach or suggest solidifying the epoxy, wherein at least a layer of solidified epoxy forms an interior surface of the wearable ring device that is configured to contact tissue of the user when the wearable ring device is worn by the user, wherein the external housing and the solidified epoxy form a housing having a width between 3 mm and 8 mm, and a thickness between 1.5 mm and 3 mm, in combination with all the other limitations in the claim.
Claims
This patent contains 16 claims, with independent claims 1 and 9 directed to methods of manufacturing a wearable ring device. The independent claims focus on constructing an external housing, inserting components like a battery and printed circuit board, applying a potting or epoxy material, and solidifying the material to form the interior surface of the ring. The dependent claims generally elaborate on the composition of the potting material or epoxy, the arrangement of components within the housing, and the shape and material of the external housing.
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Date
Description
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US12393227
- Application Number
- US18982887
- Filing Date
- Dec 16, 2024
- Status
- Granted
- Expiry Date
- Nov 28, 2034
- External Links
- Slate, USPTO, Google Patents