Compact multi-direction proximity sensor device and method

Patent No. US8575537 (titled "Compact multi-direction proximity sensor device and method") on Dec 9, 2010. The application was issued on Nov 5, 2013.

What is this patent about?

’537 is related to the field of optical proximity sensing and, more specifically, to integrated sensor modules capable of multi-directional detection. Traditional sensors often require separate units for different axes of monitoring, leading to increased costs and complex alignment requirements during assembly. This invention addresses the need for a miniaturized, self-contained device that can monitor multiple spatial planes simultaneously without the bulk of discrete components.

The underlying idea behind ’537 is the integration of two independent optical transceiver pairs onto a single, sub-centimeter substrate to achieve orthogonal sensing paths. By orienting one pair to monitor a horizontal axis and a second pair to monitor a vertical axis, the device creates a three-dimensional detection field from a single point of origin. This spatial arrangement allows the system to distinguish between different types of motion or presence, such as determining the rotation direction of a motor or detecting a user approaching from various angles.

The claims of ’537 focus on a compact proximity sensor assembly featuring a substrate with a footprint smaller than 10mm by 5mm, housing two distinct transmitting and receiving pairs. The independent claims specifically require that the second transmission signal is oriented perpendicular and non-intersecting relative to the first transmission signal. Furthermore, the claims cover the integration of control logic on the same substrate, which manages the signal timing and detection processing for both sensing channels.

In practice, the invention utilizes modular LEDs and photodiodes, each equipped with its own molded lens to focus or capture light for specific range requirements. A central integrated circuit manages the pulse width and frequency of the emitters while providing signal conditioning to filter out ambient light interference. To maintain the integrity of the signals in such a small form factor, a metal shield or device cover is employed to act as an optical barrier, effectively eliminating crosstalk between the adjacent transmitters and receivers.

This approach differs from prior solutions by consolidating multi-axis sensing into a single, surface-mountable package rather than relying on the manual alignment of multiple discrete sensors. By fixing the geometry of the emitters and detectors on a single PCB, the invention ensures fixed-axis precision that is inherent to the manufacturing process. This allows for sophisticated applications like human presence detection for ATMs or power-saving modes in mobile electronics to be implemented with significantly reduced design effort and physical space.

How does this patent fit in bigger picture?

Technical Landscape

In the early 2010s when ’537 was filed, optical proximity sensing was typically implemented using discrete transmitter and receiver components that required precise mechanical alignment during assembly to ensure functional reflection paths. At a time when systems commonly relied on external integrated circuits to manage signal processing and driver logic, the physical separation between the sensing elements and the control electronics necessitated complex board-level integration and increased the overall footprint of the sensor module. Furthermore, when hardware constraints made multi-directional sensing non-trivial, achieving detection across both horizontal and vertical axes generally required the deployment of multiple independent sensing units, leading to higher manufacturing costs and increased power consumption.

Prosecution Position

The disclosed invention represents a technical advancement through the architectural integration of dual transmitting/receiving pairs and a control integrated circuit onto a single printed circuit board. This structural shift enables multi-directional sensing—specifically across both vertical and horizontal axes—within a compact, modular package. By incorporating modular light-emitting diodes and photodiodes with molded lenses alongside a metal shield, the system overcomes the technical constraints of crosstalk and alignment sensitivity. The resulting integration achieves a high-gain, wide-angle sensing capability that allows a single device to perform complex presence and direction detection tasks that previously required multiple discrete sensor assemblies.

Claims

This patent contains a total of 18 claims, with claims 1, 9, and 14 serving as the independent claims. The independent claims focus on a compact proximity sensor and related sensing methods that utilize a small substrate equipped with two adjacent transmitting units and two receiving units, where the signals are transmitted in perpendicular, non-intersecting directions and processed by logic to detect signal reception. The dependent claims serve to further define the hardware components and operational parameters, such as specifying the use of LEDs and photodetectors, describing the construction of molded lenses and integrated circuits, detailing protective covers with cut-outs, and refining the detection logic to include object reflection analysis and the timing of signal reception between the different units.

Key Claim Terms New

Definitions of key terms used in the patent claims.

Term (Source)Support for SpecificationInterpretation
First receiving unit
(Claim 1, Claim 9, Claim 14)
An embodiment of the receiver is a modular photodiode with a molded lens. The receiver is configured such that if an object enters into the area to be monitored at least part of the transmitted light is reflected by the object and can be detected by the receiver.A modular sensing component, such as a photodiode with a molded lens, configured to detect reflected portions of a signal emitted by a corresponding transmitting unit.
First transmitting unit
(Claim 1, Claim 9, Claim 14)
An illustrative embodiment of a proximity sensor system is an optical proximity sensor, and the preferred transmitter is a modular light-emitting diode (LED) with a molded lens for ease of manufacture. By providing modular transmitters and receivers, the optical sensor system can be easily assembled into a compact package.A modular component, such as a light-emitting diode (LED) with a molded lens, mounted on a substrate and configured to emit a signal in a specific direction for proximity detection.
Logic
(Claim 1, Claim 9)
The proximity sensor system includes an integrated circuit to control the transmitters and receivers, as well as, in some embodiments, to provide signal filtering, amplification or other desired features. These IC controllers are typically connected to the transmitting/receiving unit at installation of the optical sensor system.An integrated circuit (IC) or controller in communication with the transmitting and receiving units to manage signal transmission, detect received signals, and potentially provide filtering or amplification.
Second signal in the second direction is perpendicular and does not intersect to the first signal in the first direction
(Claim 1, Claim 9, Claim 14)
In a preferred embodiment, the proximity sensor system includes a first transmitting/receiving pair and a second transmitting/receiving pair on a printed circuit board along with an integrated circuit to control the transmitters and receivers. This provides the ability to sense or monitor in both the vertical and horizontal directions. Such a compact, dual directional optical sensor system has broad applications, such as detecting individuals approaching from various angles or determining clockwise versus counterclockwise motion.A spatial arrangement where two separate sensing signals are oriented at a 90-degree angle relative to one another and travel along paths that do not cross, enabling dual-axis or multi-directional monitoring.
Substrate
(Claim 1, Claim 9, Claim 14)
In a preferred embodiment, the proximity sensor system includes a first transmitting/receiving pair and a second transmitting/receiving pair on a printed circuit board. The integrated proximity sensor device is provided in an easy to manufacture, compact unit.A physical mounting base, such as a printed circuit board, having specific compact dimensions (length less than 10mm and width less than 5mm) upon which the sensor components are integrated.

Litigation Cases New

US Latest litigation cases involving this patent.

Case NumberFiling DateTitle
4:25-cv-00503May 22, 2025Simplehuman Llc V. Hms Manufacturing Company Llc

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US8575537

Application Number
US12964227A
Filing Date
Dec 9, 2010
Publication Date
Nov 5, 2013
External Links
Slate, USPTO , Google Patents