SK hynix Inc et al. vs Elm 3DS Innovations, LLC

Petitioners' Notice of Appeal

Termination Decision Document

Record of Oral Hearing

Revised Trial Order

Order - Trial Hearing

Petitioner's Reply to Patent Owner's Response

Deposition Transcript of Alexander D. Glew

U.S. Patent No. 6,204,174

Glew Thesis

Chanana, et al., Effect of Annealing and Plasma

U.S. Patent No. 8,907,499

Schubert, P.J., Confined Lateral Selective

U.S. Patent No. 7,485,571

Wang et al., Characteristics of CMOS Devices

Milton Ohring, The Materials Science of Thin Films

Guldi, R.L., Source Drain Dislocations

Notice of Deposition of Dr. Alexander D. Glew

Patent Owner's Response

S. Wolfe ¿¿¿Silicon Processing for the VLSI Era Volume 2 ¿¿¿ Process Integration"

PETER VAN ZANT, MICROCHIP FABRICATION (4th ed., 2000)

(Part 1) W. R. RUNYAN & K. E. BEAN, SEMICONDUCTOR INTEGRATED CIRCUIT PROCESSING TECHNOLOGY (1990)

SILICON NITRIDE AND SILICON DIOXIDE THIN INSULATING FILMS (M.J. Dean, et al. eds., 1997)

(Part 3) MULTICHIP MODULE TECHNOLOGIES AND ALTERNATIVES: THE BASICS (Daryl Ann Doane & Paul D. Franzon eds., 1993)

(Part 4) MULTICHIP MODULE TECHNOLOGIES AND ALTERNATIVES: THE BASICS (Daryl Ann Doane & Paul D. Franzon eds., 1993)

Silicon dioxide - Wikipedia

Transcript of Deposition of Paul D. Franzon, Ph.D. ¿¿¿ October 6, 2016

Flexible and Substantial excerpts from the Oxford American Dictionary of Current English (1999)

Prosecution History of U.S. Application 12/497,652 ¿¿¿ Response to Office Action dated July 17, 2012

Prosecution History of U.S. Application 12/497,652 ¿¿¿ Office Action mailed on May 20, 2014

HANDBOOK SEMICONDUCTOR MANUFACTURING TECHNOLOGY (Robert Doering & Yoshio Nishi eds., 2nd ed. 2008)

(Part 2) W. R. RUNYAN & K. E. BEAN, SEMICONDUCTOR INTEGRATED CIRCUIT PROCESSING TECHNOLOGY (1990)

(Part 1) MULTICHIP MODULE TECHNOLOGIES AND ALTERNATIVES: THE BASICS (Daryl Ann Doane & Paul D. Franzon eds., 1993)

(Part 2) MULTICHIP MODULE TECHNOLOGIES AND ALTERNATIVES: THE BASICS (Daryl Ann Doane & Paul D. Franzon eds., 1993)

(Part 5) MULTICHIP MODULE TECHNOLOGIES AND ALTERNATIVES: THE BASICS (Daryl Ann Doane & Paul D. Franzon eds., 1993)

Declaration of Alexander D. Glew, PH.D.

Patent Owner's Updated Exhibit List

Petitioner's Updated Mandatory Notices

Ex. 1079

Petitioner's Updated Exhibit List

Patent Owner's Updated Mandatory Notices

Order - Petitioner's Motion for Pro Hac Vice Admission of Mr. Harold Davis

Order - Petitioner's Pro Hac Vice Motion for Mr. Andrew B. Grossman

Power of Attorney for Petitioner SK Hynix Inc.

Power of Attorney for Petitioner Micron Technology, Inc.

Power of Attorney for Petitioner Samsung Electronics Co., Ltd.

Petitioner's Motion for Admission Pro Hac Vice of Andrew B. Grossman

Petitioner's Updated Exhibit List

Petitioner's Motion for Admission Pro Hac Vice of Harold H. Davis, Jr.

Ex. 1077

Ex. 1078

Decision - Patent Owner's Motion for Withdrawal and Substitution of Counsel

Patent Owners Motion for Withdrawal and Substitution of Counsel

Notice of Deposition of Dr. Paul D. Franzon

Decision - Patent Owner's Mot. Pro Hac Vice Admis. Mr. Michael C. Newman

Patent Owner's Objections to Evidence

Petitioner's Objections to Patent Owner's Evidence

Exhibit 2157 - Declaration of Michael C. Newman in Support of PHV

Unopposed Motion for Pro Hac Vice Admission of Michael C. Newman

Patent Owners Supplemental Mandatory Notices

Patent Owners Power of Attorney

Trial Instituted Document

Scheduling Order

Petitioner's Updated Mandatory Notices

Order - Patent Owners Motion for Pro Hac Vice Admission of Samuel L. Walling

Patent Owner's Preliminary Response

Ex. 2122

Ex. 2123

Ex. 2125

Ex. 2127

Ex. 2131

Ex. 2132

Ex. 2133

Ex. 2134

Ex. 2135

Ex. 2136

Ex. 2137

Ex. 2146

Ex. 2147

Elm 3DS Innovations LLC's Motion for Pro Hac Vice Admission of Samuel L. Walling and Declaration of Samuel L. Walling in Support of Motion

Power of Attorney

Power of Attorney

Related Matters

Notice of Filing Date Accorded to Petition

Petition for IPR of U.S. Patent No. 7,474,004

Power of Attorney

Power of Attorney

Power of Attorney

U.S. Patent No. 7,474,004

Declaration of Dr. Paul D. Franzon

Curriculum Vitae of Dr. Paul D. Franzon

U.S. Patent No. 5,354,695

Yu et al., Real-Time Microvision System

U.S. Patent No. 5,426,072

Matsumoto et al., Three-Dimensional Integration Technology

Lim et al., The Impact of Wafer Back Surface Finish

Prosecution History for U.S. Patent No. 7,474,004

Prosecution History of U.S. Patent No. 8,907,499 - Office Action (05.29.2013)

Prosecution History of U.S. Patent No. 8,907,499 - Response to Office Action (06.20.2013)

Prosecution History of U.S. Patent No. 8,907,499 - As-Filed Patent Application

Prosecution History of U.S. Patent App. No. 12/497,652 - Response to Office Action (09.26.2013)

Prosecution History of U.S. Patent App. No. 12/497,65 2- Response to Office Action (04.05.2013)

Prosecution History of U.S. Patent No. 5,915,167 - Response to Office Action (04.28.1998)

Prosecution History of U.S. Patent No. 5,915,167- Response to Office Action (09.08.1998)

Prosecution History of U.S. Patent No. 8,629,542 - Response to Office Action (07.30.2012)

Prosecution History of U.S. Patent No. 7,705,466 - Response to Office Action (02.16.2009)

Prosecution History of U.S. Patent No. 7,705,466 - Response to Office Action (06.25.2009)

Prosecution History of U.S. Patent No. 8,928,119 - Response to Office Action (09.04.2012)

Prosecution History of U.S. Patent No. 8,928,119 - Appeal Brief (06.03.2013)

Prosecution History of U.S. Patent No. 8,410,617 - Response to Office Action (12.14.2010)

Prosecution History of U.S. Patent App. No. 12/497,652 - Final Office Action (08.27.2014)

Prosecution History of U.S. Patent App. No. 12/497,652 - Express Abandonment (11.20.2014)

Prosecution History of U.S. Patent App. No. 12/497,653 - Advisory Action (08.27.2014)

Prosecution History of U.S. Patent App. No. 12/497,653 - Express Abandonment (11.20.2014)

Declaration of Gerard P. Grenier

Hirano et al., A New Three-Dimensional Multipart Memory

Concept One CVD System Process Specifications from Novellus

Wolf et al., Processing for the VLSI Era

U.S. Patent No. 3,508,980

U.S. Patent No. 3,044,909

Fahey et al., Stress-induced dislocations in silicon integrated circuits

Hass et al., Physics of Thin Films

EerNisse, E.P., Stress in thermal Si02 during growth

Klokholm, E., Delamination and Fracture of Thin Films

U.S. Patent No. 4,948,482

Isobe et al., Dielectric Film Influence on Stress-Migration

Van de Ven, et al., Advantages of Dual Frequency PECVD

U.S. Patent No. 5,160,998

Garrou, P., Polymer Dielectrics for Multichip Module Packaging

Grief et al., Warpage and Mechanical Strength Studies

Tatsuno, S., Japan's Push into Creative Semiconductor Research

Akasaka, Y., Three-Dimensional IC Trends

Hayashi, Y., Evaluation of Cubic (Cumulatively Bonded IC) Devices

Williams et al., Future WSI Technology

Crowley et al., 3-D Multichip Packaging for Memory Modules

Malinak, D., Memory-Chip Stacks Send Density Skyward

Kuhn et al., Interconnect Capacitances, Crosstalk, and Signal Delay

WorldCat Entry for Yu et al., Real-Time Microvision System

U.S. Patent No. 4,937,653