IP Verse

Broadcom Corporation vs Tessera, Inc.

The detailed information for PTAB case with proceeding number IPR2017-01470 filed by Broadcom Corporation against Tessera, Inc. on May 24, 2017. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.

Case Details

Proceeding Number: IPR2017-01470
Filing Date: May 24, 2017
Petitioner: Broadcom Corporation
Respondent: Tessera, Inc.
Status: Terminated-Settled
Respondent Application Number: 10210160
Respondent Tech Center: 2800
Respondent Patent Number: 6856007
Institution Decision Date: Dec 4, 2017
Termination Date: Jan 2, 2018

Proceeding Documents

The table below shows documents filed in the case, listing each document name, filing date, document type, and filing party. Tracking these filings indicates the activity of the parties involved in the case, and the types of documents filed can provide insights into the legal strategies being employed.

Show Exhibit Documents

Document Name	Filing Date	Category	Filing Party
Alert me when new update on this case
Settlement After Institution of Trial	Jan 2, 2018	PAPER	BOARD
Joint Request to File Business Confidential Information	Dec 21, 2017	PAPER	PATENT OWNER
Patent Owner's Updated Exhibit List	Dec 21, 2017	PAPER	PATENT OWNER
Joint Motion to Terminate	Dec 21, 2017	PAPER	PATENT OWNER
Ex 2010 - Agreement 5	Dec 21, 2017	EXHIBIT	PATENT OWNER
Ex 2006 - Agreement 1	Dec 21, 2017	EXHIBIT	PATENT OWNER
Ex 2007 - Agreement 2	Dec 21, 2017	EXHIBIT	PATENT OWNER
Ex 2008 - Agreement 3	Dec 21, 2017	EXHIBIT	PATENT OWNER
Ex 2009 - Agreement 4	Dec 21, 2017	EXHIBIT	PATENT OWNER
Ex 2011 - Agreement 6	Dec 21, 2017	EXHIBIT	PATENT OWNER
Scheduling Order	Dec 4, 2017	PAPER	BOARD
Trial Instituted Document	Dec 4, 2017	PAPER	BOARD
Patent Owner's Notice of Statutory Disclaimer	Nov 29, 2017	PAPER	PATENT OWNER
Patent Owner's Updated Exhibit List	Nov 29, 2017	PAPER	PATENT OWNER
Ex 2004 - 007 Disclaimer	Nov 29, 2017	EXHIBIT	PATENT OWNER
Ex 2005 - PTAB email, dated November 17, 2017	Nov 29, 2017	EXHIBIT	PATENT OWNER
Patent Owner Preliminary Response	Sep 7, 2017	PAPER	PATENT OWNER
Ex 2001 - Inv. No. 337-TA-1010 Initial Determination (Public Version)	Sep 7, 2017	EXHIBIT	PATENT OWNER
Ex 2002 - US 5869887	Sep 7, 2017	EXHIBIT	PATENT OWNER
Ex 2003 - US 5285352	Sep 7, 2017	EXHIBIT	PATENT OWNER
Patent Owner's Updated Mandatory Notice	Jul 18, 2017	PAPER	PATENT OWNER
Patent Owner's Mandatory Notices	Jun 9, 2017	PAPER	PATENT OWNER
Power of Attorney from Patent Owner Tessera, Inc.	Jun 9, 2017	PAPER	PATENT OWNER
Notice of Accord Filing Date	Jun 7, 2017	PAPER	BOARD
Non-final Office Action, May 11, 2004, File History of Application 10/210,160	May 24, 2017	EXHIBIT	PETITIONER
PETITION FOR INTER PARTES REVIEW UNDER 35 U.S.C. Sections 311-319 AND 37 C.F.R. Sections 42.100 et seq.	May 24, 2017	PAPER	PETITIONER
U.S. Patent No. 6,856,007	May 24, 2017	EXHIBIT	PETITIONER
Declaration of Jeffrey C. Suhling	May 24, 2017	EXHIBIT	PETITIONER
Notice of Allowance, Oct. 7, 2004, File History of Application 10/210,160	May 24, 2017	EXHIBIT	PETITIONER
Information Disclosure Statement, July 26, 2004, File History of Application 10/210,160	May 24, 2017	EXHIBIT	PETITIONER
U.S. Patent No. 6,521,987 (Glenn et al.)	May 24, 2017	EXHIBIT	PETITIONER
Excerpts from Ken Gilleo, ¿¿¿Area Array Packaging Handbook,¿¿¿ 2001	May 24, 2017	EXHIBIT	PETITIONER
Response to Non-final Office Action, Aug. 12, 2004, File History of Application 10/210,160	May 24, 2017	EXHIBIT	PETITIONER
Jean-Paul Clech, ¿¿¿Solder Reliability Solutions: A PC-Based Design-for-Reliability,¿¿¿ ESPI (Sept. 1996)	May 24, 2017	EXHIBIT	PETITIONER
Gunnar Gustafsson, ¿¿¿Solder Joint Reliability of a Lead-Less RF-transistor¿¿¿ (June, 1998)	May 24, 2017	EXHIBIT	PETITIONER
Xiangcheng Luo et al., ¿¿¿Effect of the Thickness of a Thermal Interface Material (Solder) on Heat Transfer Between Copper Surfaces,¿¿¿ 24(2) Int¿¿¿l J. of Microcircuits and Electronic Packaging 141-147 (2nd Q 2001)	May 24, 2017	EXHIBIT	PETITIONER
Peter Hall et al., ¿¿¿Thermal Deformations Observed in Leadless Ceramic Chip Carriers Surface Mounted to Printed Wiring Boards,¿¿¿ IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-6, No. 4 (Dec. 1983)	May 24, 2017	EXHIBIT	PETITIONER
Amkor MicroLeadframe Package Product Development Announcement (February 1999)	May 24, 2017	EXHIBIT	PETITIONER
Amkor MicroLeadframe Data Sheet (June 2000)	May 24, 2017	EXHIBIT	PETITIONER
Application Notes for Surface Mount Assembly of Amkor¿¿¿s MicroLeadFrame (MLF) Packages, Amkor Technology (March, 2001)	May 24, 2017	EXHIBIT	PETITIONER
Amkor Technology: Products: Application Notes & White Papers webpage from April 2001	May 24, 2017	EXHIBIT	PETITIONER
Information Disclosure Statement, Aug. 20, 2001, Application 09/606,428	May 24, 2017	EXHIBIT	PETITIONER
Syed et al., ¿¿¿LGA vs. BGA: What is more reliable? A 2nd Level Reliability Comparison,¿¿¿ Surface Mount Technology Association (SMTA) International Conference Proceedings, September 24, 2000	May 24, 2017	EXHIBIT	PETITIONER
Order No. 63: Markman Order (Public), In the Matter of Certain Semiconductor Devices, Semiconductor Device Packages, And Products Containing Same, Inv. No. 337-TA-1010 (Feb. 6, 2017)	May 24, 2017	EXHIBIT	PETITIONER
U.S. Patent No. 6,420,779 (Sharma)	May 24, 2017	EXHIBIT	PETITIONER
Petitioner's Power of Attorney	May 24, 2017	PAPER	PETITIONER