Other: Fed Circuit mandate | Dec 9, 2022 | PAPER | BOARD |
GENERAL ORDER | Oct 26, 2021 | PAPER | BOARD |
GENERAL ORDER | May 4, 2020 | PAPER | BOARD |
Notice of Appeal | Dec 23, 2019 | PAPER | PATENT OWNER |
JUDGMENT
Final Written Decision
Determining All Challenged Claims Unpatentable
35 U.S.C. § 318(a) | Oct 24, 2019 | PAPER | BOARD |
Hearing Transcript | Sep 5, 2019 | PAPER | BOARD |
ORDER Granting Joint Request for Oral Argument | Jul 22, 2019 | PAPER | BOARD |
Joint Request for Oral Hearing | Jul 19, 2019 | PAPER | PATENT OWNER |
PATENT OWNER¿¿¿S SUR-REPLY TO PETITIONER¿¿¿S REPLY TO
PATENT OWNER¿¿¿S RESPONSE | Jun 28, 2019 | PAPER | PATENT OWNER |
Ex. 2010 | Jun 28, 2019 | EXHIBIT | PATENT OWNER |
Ex. 2011 | Jun 28, 2019 | EXHIBIT | PATENT OWNER |
Ex. 2012 | Jun 28, 2019 | EXHIBIT | PATENT OWNER |
2019.05.31 [Petitioner] Reply to Response IPR2018-01000 | May 31, 2019 | PAPER | PETITIONER |
Ex. 1037 | May 31, 2019 | EXHIBIT | PETITIONER |
Ex. 1038 | May 31, 2019 | EXHIBIT | PETITIONER |
Ex. 1039 | May 31, 2019 | EXHIBIT | PETITIONER |
Ex. 1040 | May 31, 2019 | EXHIBIT | PETITIONER |
Ex. 1041 | May 31, 2019 | EXHIBIT | PETITIONER |
Ex. 1042 | May 31, 2019 | EXHIBIT | PETITIONER |
Revised Scheduling Order
37 C.F.R. ¿¿ 42.5 | Apr 15, 2019 | PAPER | BOARD |
Joint Notice of Stipulation to Revised Schedule | Apr 11, 2019 | PAPER | PETITIONER |
ORDER
Conduct of the Proceeding
37 C.F.R. § 42.5 | Mar 25, 2019 | PAPER | BOARD |
Transmittal Letter for Supplemental Glew Declaration | Mar 25, 2019 | PAPER | PATENT OWNER |
North Star Ex. 2009 | Mar 25, 2019 | EXHIBIT | PATENT OWNER |
2019.03.20 [Micron] Updated Mandatory Notices | Mar 20, 2019 | PAPER | PETITIONER |
Order Granting Petitioner's Motions for Admission Pro Hac Vice of Jared Bobrow | Mar 19, 2019 | PAPER | BOARD |
Petitioner's Motion for Admission Pro Hac Vice of Jared Bobrow | Mar 11, 2019 | PAPER | PETITIONER |
Declaration of Jared Bobrow In Support of Petitioner's Motion of Admission Pro Hac Vice | Mar 11, 2019 | PAPER | PETITIONER |
Corrected Notice of Depo of Alexander D. Glew | Mar 1, 2019 | PAPER | PETITIONER |
2019.02.28 [Petitioner] Notice of Depo of Andrew Glew | Feb 28, 2019 | PAPER | PETITIONER |
North Star Ex. 2001 | Feb 26, 2019 | EXHIBIT | PATENT OWNER |
Petitioner's Objections to Patent Owner's Response Evidence | Feb 7, 2019 | PAPER | PETITIONER |
Patent Owner's Response | Jan 31, 2019 | PAPER | PATENT OWNER |
North Star Ex. 2002 | Jan 31, 2019 | EXHIBIT | PATENT OWNER |
North Star Ex. 2003 | Jan 31, 2019 | EXHIBIT | PATENT OWNER |
North Star Ex. 2004 | Jan 31, 2019 | EXHIBIT | PATENT OWNER |
EXPUNGED | Jan 31, 2019 | EXHIBIT | PATENT OWNER |
North Star Ex. 2005 | Jan 31, 2019 | EXHIBIT | PATENT OWNER |
North Star Ex. 2006 | Jan 31, 2019 | EXHIBIT | PATENT OWNER |
North Star Ex. 2007 | Jan 31, 2019 | EXHIBIT | PATENT OWNER |
North Star Ex. 2008 | Jan 31, 2019 | EXHIBIT | PATENT OWNER |
Order - Granting Patent Owner's Motions for Admission Pro Hac Vice of Edward C. Flynn - 37 CFR 42.10(c) | Dec 21, 2018 | PAPER | BOARD |
Declaration of Edward C. Flynn in Support of PHV | Dec 11, 2018 | PAPER | PATENT OWNER |
Pro Hac Vice - Edward C. Flynn | Dec 11, 2018 | PAPER | PATENT OWNER |
Certificate of Service of PHV and Declaration | Dec 11, 2018 | PAPER | PATENT OWNER |
JOINT STIPULATION TO REVISE SCHEDULE | Nov 19, 2018 | PAPER | PATENT OWNER |
Trial Instituted Document | Oct 26, 2018 | PAPER | BOARD |
Scheduling Order | Oct 26, 2018 | PAPER | BOARD |
PATENT OWNER¿¿¿S UPDATED MANDATORY NOTICES | Aug 22, 2018 | PAPER | PATENT OWNER |
WAIVER OF PATENT OWNER¿¿¿S PRELIMINARY RESPONSE | Jul 30, 2018 | PAPER | PATENT OWNER |
Petitioner's Updated Mandatory Notices | Jun 1, 2018 | PAPER | PETITIONER |
Mandatory Notice | May 21, 2018 | PAPER | PATENT OWNER |
Power of Attorney | May 21, 2018 | PAPER | PATENT OWNER |
Notice of Accord Filing Date | May 15, 2018 | PAPER | BOARD |
PETITION FOR INTER PARTES REVIEW OF U.S. PATENT NO. 6,465,743 UNDER 35 U.S.C. ¿¿¿¿ 311-319 AND 37 C.F.R. ¿¿¿¿ 42.1-.80, 42.100-.123 | May 1, 2018 | PAPER | PETITIONER |
Ex. 1002 File History for U.S. Patent No. 6,465,743 (¿¿¿743 Patent FH¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1010 U.S. Patent No. 5,635,671 (¿¿¿Freyman¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1013 JEDEC Standard No. MO-151A, ¿¿¿S-PXGA-X/PBGA Plastic Ball Grid Array Family Registration¿¿¿ (¿¿¿JEDEC Standard¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1001 U.S. Patent No. 6,465,743 (¿¿¿743 Patent¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1003 Declaration of Philip Garrou, Ph.D. (Garrou Decl.¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1004 Curriculum Vitae of Philip Garrou, Ph.D. | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1005 U.S. Patent No. 5,285,352 (¿¿¿Pastore¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1006 PCT Application Publication No. WO 90/07792 (¿¿¿Altman¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1007 U.S. Patent No. 5,435,482 (¿¿¿Variot¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1008 W. Engelmaier, ¿¿¿Thermo-Mechanical Effects,¿¿¿ Electronic Materials Handbook, Vol. 1, Packaging (1989) (¿¿¿Engelmaier¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1009 Declaration of Rachel J. Watters regarding W. Engelmaier, ¿¿¿Thermo-Mechanical Effects,¿¿¿ Electronic Materials Handbook,
Vol. 1, Packaging (1989) (¿¿¿Watters Decl.¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1011 J. Lau et al., ¿¿¿No Clean Mass Reflow of Large Over Molded Plastic Pad Grid Array Carrier (OMPAC),¿¿¿ Proceedings of IEEE/CHMT Int¿¿¿l Elec. Mfg. Tech. Symp., 1993, pp. 63-75 (¿¿¿Lau¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1012 Declaration of Mel DeSart regarding J. Lau et al., ¿¿¿No Clean Mass Reflow of Large Over Molded Plastic Pad Grid Array Carrier (OMPAC),¿¿¿ Proceedings of IEEE/CHMT Int¿¿¿l Elec. Mfg. Tech. Symp., 1993, pp. 63-75 (¿¿¿DeSart Decl.¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1014 Declaration of Julie Carlson regarding JEDEC Standard No. MO-151A, ¿¿¿S-PXGA-X/PBGA Plastic Ball Grid Array Family
Registration,¿¿¿ issued November 1993 (¿¿¿Carlson Decl.¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1015 U.S. Patent No. 4,753,863 (¿¿¿Spanjer¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1016 J. Houghten, ¿¿¿New Package Takes on QFPS,¿¿¿ Advanced Packaging, Winter 1993 Volume 2, No. 1, pp. 38-39 (¿¿¿Houghten¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1017 Declaration of James L. Mullins regarding J. Houghten, ¿¿¿New Package Takes on QFPS,¿¿¿ Advanced Packaging, Winter 1993
Volume, pp. 38-39 (¿¿¿Mullins Decl.¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1018 F.F. Cappo, et al., ¿¿¿Highly Manufacturable Muli-Layered Ceramic Surface Mounted Package,¿¿¿ IEEE/CHMT ¿¿¿91 Symposium, pp. 424-428 (¿¿¿Cappo¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1020 J. Lau, Ball Grid Array Technology, McGraw-Hill, Inc., 1995 (¿¿¿Lau II¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1021 W. Van Den Bogert et al., Thermal Stress in Semiconductor Encapsulating Materials, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. II, No. 3, September 1988 (¿¿¿Bogert¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1022 L.T. Nguyen et al., ¿¿¿Molding Compound Trends in a Denser Packaging World: Part III ¿¿¿ Property Optimization for Minimum Stress,¿¿¿ EEP-Vol. 6, Electronic Packaging Reliability, ASME 1998 (¿¿¿Nguyen¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1024 J. Shimizu, ¿¿¿Plastic Ball Grid Arrary Coplanrity,¿¿¿ Apart from the Crowd, Proceedings of the Technical Program, Surface Mount Int¿¿¿l Conf. & Expo., San Jose, California, August 29 ¿¿¿ September 2, 1993, pp. 86-91 (¿¿¿Shimizu¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1025 F. Martin, C-5 Solder Sphere Robotic Placement Cell For Overmolded Pad Array Carrier, Motorola Inc., Austin, TX
(¿¿¿Martin¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1026 J. Lau, et al., ¿¿¿No Clean Mass Reflow of Large Over Molded Plastic Pad Array Carriers (OMPAC),¿¿¿ Fifteenth IEEE/CHMT Int¿¿¿l Elec. Mfg. Tech. Symp., 1993 (¿¿¿Lau III¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1019 Electronic Materials Handbook, Vol. 1, Packaging, ASM International (First Printing, November 1989) (¿¿¿Electronic
Materials Handbook¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1023 N. Chidambaram (Raj), et al., ¿¿¿Stress and Coplanarity Analysis of 225 BGA Package,¿¿¿ 1994 IEE/CPMT Int¿¿¿l Elec. Mfg. Tech. Symp. (¿¿¿Chidambaram¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1031 U.S. Patent No. 4,504,435 (¿¿¿Orcutt¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1032 P. Lin and M. McShane, ¿¿¿Approaches to High Pin Count and High Power Surface Mount Packages,¿¿¿ 1991, VLSITSA, pp. 141-146 (¿¿¿Lin¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1034 E.J. Vardaman, ¿¿¿Ball Grid Array Packages: Market and Technology Developments,¿¿¿ TechSearch Int¿¿¿l, Inc., Dec. 1994
(¿¿¿Vardaman¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1035 Array Package Users Guidelines, HDP User Group Int¿¿¿l, 1995 (¿¿¿Array Package Users Guidelines¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1036 B. Freyman and R. Pennisi, ¿¿¿Overmolded Plastic Pad Array Carriers (OMPAC): A Low Cost, High Interconnect Density IC Packaging Solution for Consumer and Industrial Electronics,¿¿¿ 41st Elec. Comp. & Tech. Conf., 1991 (¿¿¿Freyman II¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Power of Attorney | May 1, 2018 | PAPER | PETITIONER |
Ex. 1027 Excerpts from McGraw Hill Dictionary of Chemical Terms, McGraw Hill Book Co., San Francisco, CA (¿¿¿1984 McGraw Hill
Dictionary¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1028 EP Patent Application No. 0 102 456 A2 (¿¿¿Christie¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1029 Excerpts from CRC Handbook of Chemistry and Physics, 74th Edition, The Chemical Rubber Co. (CRC) Press, 1993 (¿¿¿CRC Handbook¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1030 Japanese Patent Application No. H5-226792 (¿¿¿Sakai¿¿¿) with certified translation | May 1, 2018 | EXHIBIT | PETITIONER |
Ex. 1033 R. Johnson et al., ¿¿¿A Feasibility Study of Ball Grid Array Packaging,¿¿¿ pp. 413-422 (¿¿¿Johnson¿¿¿) | May 1, 2018 | EXHIBIT | PETITIONER |