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Samsung Electronics Co., Ltd. et al. vs Invensas Corporation et al.

The detailed information for PTAB case with proceeding number IPR2018-01266 filed by Samsung Electronics Co., Ltd. et al. against Invensas Corporation et al. on Jun 15, 2018. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.

Case Details

Proceeding Number: IPR2018-01266
Filing Date: Jun 15, 2018
Petitioner: Samsung Electronics Co., Ltd. et al.
Respondent: Invensas Corporation et al.
Status: Terminated-Settled
Respondent Application Number: 09919284
Respondent Tech Center: 2800
Respondent Patent Number: 6566167
Termination Date: Jan 4, 2019

Proceeding Documents

The table below shows documents filed in the case, listing each document name, filing date, document type, and filing party. Tracking these filings indicates the activity of the parties involved in the case, and the types of documents filed can provide insights into the legal strategies being employed.

Show Exhibit Documents

Document Name	Filing Date	Category	Filing Party
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Notice of Refund	Feb 1, 2019	PAPER	BOARD
Petitioner's Request for Refund of Fees	Jan 9, 2019	PAPER	PETITIONER
Termination Decision Document	Jan 4, 2019	PAPER	BOARD
Joint Request to File Settlement Agreement and Consent Letter As Business Confidential Information Under 35 U.S.C. 317 and 37 C.F.R. 42.74	Dec 13, 2018	PAPER	PETITIONER
Ex. 1024	Dec 13, 2018	EXHIBIT	PETITIONER
Joint Motion to Terminate Proceeding Pursuant to 35 U.S.C. 317 and 37 C.F.R. 42.74	Dec 13, 2018	PAPER	PETITIONER
Ex. 1025	Dec 13, 2018	EXHIBIT	PETITIONER
Patent Owner's Preliminary Response	Oct 17, 2018	PAPER	PATENT OWNER
Notice of Accord Filing Date	Jul 19, 2018	PAPER	BOARD
Patent Owner's Mandatory Notices	Jul 6, 2018	PAPER	PATENT OWNER
Patent Owner's Power of Attorney	Jul 6, 2018	PAPER	PATENT OWNER
U.S. Patent No. 6,566,167 ("the '167 Patent")	Jun 15, 2018	EXHIBIT	PETITIONER
Declaration of Peter Elenius	Jun 15, 2018	EXHIBIT	PETITIONER
Schaper et al., "Electrical Characterization of the Interconnected Mesh Power System IMPS MCM Topology," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 18, No. 1, February 1995 at pp. 99-105 ("Schaper")	Jun 15, 2018	EXHIBIT	PETITIONER
U.S. Patent Application Publication No. 2002/0118528 ("Su")	Jun 15, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 6,359,341 ("Huang")	Jun 15, 2018	EXHIBIT	PETITIONER
Simon S. Ang et al., "A low-cost, flexible ball-grid-array multichip module technology," Proc. SPIE 3184, August 1997 at pp. 13-21 ("Schaper II")	Jun 15, 2018	EXHIBIT	PETITIONER
Davidson and Katopis, Microelectronics Packaging Handbook, Chapter 3, (Rao Tummala and Eugene Rymaszewski eds., 1989)	Jun 15, 2018	EXHIBIT	PETITIONER
Microelectronics Packaging Handbook, 696 (Rao Tummala and Eugene Rymaszewski eds., 1989)	Jun 15, 2018	EXHIBIT	PETITIONER
Semiconductor Packaging A Multidisciplinary Approach, 29-30 (Robert Hannemann, et al., eds., 1994)	Jun 15, 2018	EXHIBIT	PETITIONER
Ball Grid Array Technology, 370-377 (John Lau, ed., 1995)	Jun 15, 2018	EXHIBIT	PETITIONER
Petition for Inter Partes Review of U.S. Patent No. 6,566,167	Jun 15, 2018	PAPER	PETITIONER
Petitioner Samsung Electronics America, Inc.'s Power of Attorney	Jun 15, 2018	PAPER	PETITIONER
Petitioner Samsung Electronics Co., Ltd.'s Power of Attorney	Jun 15, 2018	PAPER	PETITIONER
Curriculum Vitae for Peter Elenius	Jun 15, 2018	EXHIBIT	PETITIONER
Prosecution File History of U.S. Patent No. 6,566,167	Jun 15, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 6,125,042 ("Verdi")	Jun 15, 2018	EXHIBIT	PETITIONER
Curriculum Vitae for Sylvia D. Hall-Ellis	Jun 15, 2018	EXHIBIT	PETITIONER
SPIE Bibliographic Record For Schaper II	Jun 15, 2018	EXHIBIT	PETITIONER
Ball Grid Array Technology, 279-280 (John Lau, ed., 1995)	Jun 15, 2018	EXHIBIT	PETITIONER
Huang, et al., "CBGA Package Design for C4 PowerPC Microprocessor Chips: Trade-off between Substrate Routability and Performance" (IEEE 1994)	Jun 15, 2018	EXHIBIT	PETITIONER
Citation to T. Chang, et al., "Parasitic characteristics of BGA packages," 124-129 (IEEE 1998)	Jun 15, 2018	EXHIBIT	PETITIONER
Declaration of Sylvia D. Hall-Ellis	Jun 15, 2018	EXHIBIT	PETITIONER
IEEE Xplore Bibliographic Record For Schaper	Jun 15, 2018	EXHIBIT	PETITIONER
Electronic Packaging and Interconnection Handbook, 7.52 (Charles Harper, ed., 2000)	Jun 15, 2018	EXHIBIT	PETITIONER
Tsai, "Inductance and SSN Performance Comparison of a 225 Plastic BGA and a 208 Plastic QFP" (1996)	Jun 15, 2018	EXHIBIT	PETITIONER
T. Chang, et al., "Parasitic characteristics of BGA packages," 124-129 (IEEE 1998)	Jun 15, 2018	EXHIBIT	PETITIONER