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Samsung Electronics Co., Ltd. et al. vs Invensas Corporation et al.

The detailed information for PTAB case with proceeding number IPR2018-01401 filed by Samsung Electronics Co., Ltd. et al. against Invensas Corporation et al. on Jul 13, 2018. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.

Case Details

Proceeding Number: IPR2018-01401
Filing Date: Jul 13, 2018
Petitioner: Samsung Electronics Co., Ltd. et al.
Respondent: Invensas Corporation et al.
Status: Terminated-Settled
Respondent Application Number: 09143723
Respondent Tech Center: 2800
Respondent Patent Number: 6232231
Termination Date: Jan 4, 2019

Proceeding Documents

The table below shows documents filed in the case, listing each document name, filing date, document type, and filing party. Tracking these filings indicates the activity of the parties involved in the case, and the types of documents filed can provide insights into the legal strategies being employed.

Show Exhibit Documents

Document Name	Filing Date	Category	Filing Party
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Notice of Refund	Feb 6, 2019	PAPER	BOARD
Petitioner's Request for Refund of Fees	Jan 9, 2019	PAPER	PETITIONER
Termination Decision Document	Jan 4, 2019	PAPER	BOARD
Joint Motion to Terminate Proceeding Pursuant to 35 U.S.C. 317 and 37 C.F.R. 42.74	Dec 13, 2018	PAPER	PETITIONER
Joint Request to File Settlement Agreement and Consent Letter As Business Confidential Information Under 35 U.S.C. 317 and 37 C.F.R. 42.74	Dec 13, 2018	PAPER	PETITIONER
Ex. 1022	Dec 13, 2018	EXHIBIT	PETITIONER
Ex. 1023	Dec 13, 2018	EXHIBIT	PETITIONER
Patent Owner's Preliminary Response	Nov 29, 2018	PAPER	PATENT OWNER
Notice of Accord Filing Date	Aug 29, 2018	PAPER	BOARD
Patent Owner's Mandatory Notices	Aug 1, 2018	PAPER	PATENT OWNER
Patent Owner's Power of Attorney	Aug 1, 2018	PAPER	PATENT OWNER
U.S. Patent No. 6,232,231 ("the '231 Patent")	Jul 13, 2018	EXHIBIT	PETITIONER
Petition for Inter Partes Review of U.S. Patent No. 6,232,231	Jul 13, 2018	PAPER	PETITIONER
Petitioner Samsung Electronics Co., Ltd.'s Power of Attorney	Jul 13, 2018	PAPER	PETITIONER
Petitioner Samsung Electronics America, Inc.'s Power of Attorney	Jul 13, 2018	PAPER	PETITIONER
Petitioner Samsung Austin Semiconductor LLC's Power of Attorney	Jul 13, 2018	PAPER	PETITIONER
Declaration of Dr. Michael Thomas	Jul 13, 2018	EXHIBIT	PETITIONER
Curriculum Vitae for Dr. Michael Thomas	Jul 13, 2018	EXHIBIT	PETITIONER
Prosecution File History of U.S. Patent No. 6,232,231	Jul 13, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 5,948,573 ("Takahashi")	Jul 13, 2018	EXHIBIT	PETITIONER
Certified English Translation of Japanese Patent Application 4-262535 ("Tonishi")	Jul 13, 2018	EXHIBIT	PETITIONER
Japanese Patent Application 4-262535	Jul 13, 2018	EXHIBIT	PETITIONER
Declaration of Martin Cross Regarding Translation of References from Japanese to English	Jul 13, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 6,109,775 to Tripathi et al.	Jul 13, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 5,874,318 to Baker	Jul 13, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 6,365,521 ("Shubert")	Jul 13, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 5,972,792 ("Hudson")	Jul 13, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 6,120,361 ("Konishi")	Jul 13, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 5,302,551 to Iranmanesh et al.	Jul 13, 2018	EXHIBIT	PETITIONER
Semiconductor Industry Association, The National Technological Roadmap for Semiconductors: Technology Needs, 1997 Edition	Jul 13, 2018	EXHIBIT	PETITIONER
L. Zuckerman, "IBM to Make Smaller and Faster Chips - Second Breakthrough in a Week Has Wide Uses," The New York Times, D1, Monday, September 22, 1997	Jul 13, 2018	EXHIBIT	PETITIONER
T. H. Park, Framework for Characterization of Copper Interconnect in Damascene CMP Processes, 1998	Jul 13, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 6,309,956 to Chiang et al.	Jul 13, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 5,854,125 to Harvey	Jul 13, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 6,103,626 to Kim	Jul 13, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 6,261,883 to Koubuchi et al.	Jul 13, 2018	EXHIBIT	PETITIONER