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Samsung Electronics Co., Ltd. et al. vs Invensas Bonding Technologies, Inc. et al.

The detailed information for PTAB case with proceeding number IPR2019-00007 filed by Samsung Electronics Co., Ltd. et al. against Invensas Bonding Technologies, Inc. et al. on Oct 1, 2018. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.

Case Details

Proceeding Number: IPR2019-00007
Filing Date: Oct 1, 2018
Petitioner: Samsung Electronics Co., Ltd. et al.
Respondent: Invensas Bonding Technologies, Inc. et al.
Status: Terminated-Settled
Respondent Application Number: 15064467
Respondent Tech Center: 2800
Respondent Patent Number: 9431368
Termination Date: Dec 21, 2018

Proceeding Documents

The table below shows documents filed in the case, listing each document name, filing date, document type, and filing party. Tracking these filings indicates the activity of the parties involved in the case, and the types of documents filed can provide insights into the legal strategies being employed.

Show Exhibit Documents

Document Name	Filing Date	Category	Filing Party
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Notice of Refund	Feb 1, 2019	PAPER	BOARD
Petitioner's Request for Refund of Fees	Jan 8, 2019	PAPER	PETITIONER
Termination Decision Document	Dec 21, 2018	PAPER	BOARD
Ex. 1014	Dec 13, 2018	EXHIBIT	PETITIONER
Joint Motion to Terminate Proceeding Pursuant to 35 U.S.C. 317 and 37 C.F.R. 42.74	Dec 13, 2018	PAPER	PETITIONER
Joint Request to File Settlement Agreement and Consent Letter As Business Confidential Information Under 35 U.S.C. 317 and 37 C.F.R. 42.74	Dec 13, 2018	PAPER	PETITIONER
Ex. 1015	Dec 13, 2018	EXHIBIT	PETITIONER
Notice of Accord Filing Date	Dec 3, 2018	PAPER	BOARD
Patent Owner's Motion for District Court (Phillips) Patent Claim Construction	Oct 31, 2018	PAPER	PATENT OWNER
Patent Owner's Power of Attorney	Oct 22, 2018	PAPER	PATENT OWNER
Patent Owner's Mandatory Notices	Oct 22, 2018	PAPER	PATENT OWNER
Power of Attorney Samsung Electronics Co., Ltd.	Oct 1, 2018	PAPER	PETITIONER
Power of Attorney Samsung Electronics America, Inc.	Oct 1, 2018	PAPER	PETITIONER
Curriculum Vitae for Dr. Charles Hunt in Support of Petition for Inter Partes Review of U.S. Patent No. 9,431,368	Oct 1, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 5,236,118, Aligned Wafer Bonding (filed May 12, 1992) ("Bower")	Oct 1, 2018	EXHIBIT	PETITIONER
PETITION FOR INTER PARTES REVIEW OF U.S. PATENT NO. 9,431,368	Oct 1, 2018	PAPER	PETITIONER
U.S. Patent No. 9,431,368 ("the "368 Patent")	Oct 1, 2018	EXHIBIT	PETITIONER
Prosecution File History of U.S. Patent No. 9,431,368	Oct 1, 2018	EXHIBIT	PETITIONER
Declaration of Dr. Charles Hunt	Oct 1, 2018	EXHIBIT	PETITIONER
Q.-Y. Tong et al., Semiconductor Wafer Bonding: Recent Developments, 37 Materials Chemistry and Physics 101 (1994) ("Tong")	Oct 1, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 5,753,536, Semiconductor Device and Associated Fabrication Method (filed Aug. 28,1995) ("Sugiyama")	Oct 1, 2018	EXHIBIT	PETITIONER
John L. Vossen et al., Thin Film Processes II, Academic Press (1991) (excerpts)	Oct 1, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 6,097,096, Metal Attachment Method and Structure for Attaching Substrates at Low Temperatures (filed Jul. 11, 1997) ("Gardner")	Oct 1, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 5,413,952, Direct Wafer Bonded Structure Method of Making (filed Feb. 2, 1994) ("Pages")	Oct 1, 2018	EXHIBIT	PETITIONER
Q.-Y. Tong et al., Semiconductor Wafer Bonding, Science and Technology, The Electrochemical Society Series (1999) (excerpts)	Oct 1, 2018	EXHIBIT	PETITIONER
Declaration of Amanda Peil from Elsevier Inc. Regarding Exhibit 1008. (Part 1 of 2)	Oct 1, 2018	EXHIBIT	PETITIONER
Declaration of Amanda Peil from Elsevier Inc. Regarding Exhibit 1008. (Part 2 of 2)	Oct 1, 2018	EXHIBIT	PETITIONER
John L. Vossen et al., Thin Film Processes, Academic Press (1978) (excerpts)	Oct 1, 2018	EXHIBIT	PETITIONER