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Samsung Electronics Co., Ltd. et al. vs Invensas Bonding Technologies, Inc. et al.

The detailed information for PTAB case with proceeding number IPR2019-00021 filed by Samsung Electronics Co., Ltd. et al. against Invensas Bonding Technologies, Inc. et al. on Oct 2, 2018. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.

Case Details

Proceeding Number: IPR2019-00021
Filing Date: Oct 2, 2018
Petitioner: Samsung Electronics Co., Ltd. et al.
Respondent: Invensas Bonding Technologies, Inc. et al.
Status: Terminated-Settled
Respondent Application Number: 14957501
Respondent Tech Center: 2800
Respondent Patent Number: 9391143
Termination Date: Dec 21, 2018

Proceeding Documents

The table below shows documents filed in the case, listing each document name, filing date, document type, and filing party. Tracking these filings indicates the activity of the parties involved in the case, and the types of documents filed can provide insights into the legal strategies being employed.

Show Exhibit Documents

Document Name	Filing Date	Category	Filing Party
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Notice of Refund	Jan 25, 2019	PAPER	BOARD
Petitioner's Request for Refund of Fees	Jan 8, 2019	PAPER	PETITIONER
Termination Decision Document	Dec 21, 2018	PAPER	BOARD
Ex. 1018	Dec 13, 2018	EXHIBIT	PETITIONER
Joint Motion to Terminate Proceeding Pursuant to 35 U.S.C. 317 and 37 C.F.R. 42.74	Dec 13, 2018	PAPER	PETITIONER
Joint Request to File Settlement Agreement and Consent Letter As Business Confidential Information Under 35 U.S.C. 317 and 37 C.F.R. 42.74	Dec 13, 2018	PAPER	PETITIONER
Ex. 1019	Dec 13, 2018	EXHIBIT	PETITIONER
Notice of Accord Filing Date	Nov 6, 2018	PAPER	BOARD
Patent Owner's Motion for District Court (Phillips) Patent Claim Construction	Oct 31, 2018	PAPER	PATENT OWNER
Patent Owner's Power of Attorney	Oct 22, 2018	PAPER	PATENT OWNER
Patent Owner's Mandatory Notices	Oct 22, 2018	PAPER	PATENT OWNER
PETITION FOR INTER PARTES REVIEW OF U.S. PATENT NO. 9,391,143	Oct 2, 2018	PAPER	PETITIONER
Power of Attorney Samsung Electronics Co., Ltd.	Oct 2, 2018	PAPER	PETITIONER
Prosecution File History of U.S. Patent No. 9,391,143	Oct 2, 2018	EXHIBIT	PETITIONER
M. Reiche et al., The Effect of a Plasma Pretreatment on the Si/Si Bonding Behaviour, 97-36 Electrochemical Society Proceedings 437 (1997) ("Reiche")	Oct 2, 2018	EXHIBIT	PETITIONER
Q. Tong et al., Semiconductor Wafer Bonding: Recent Developments, 37 Materials Chemistry and Physics 101 (1994) ("Tong (1994)")	Oct 2, 2018	EXHIBIT	PETITIONER
Original and Certified Translation of Japanese Patent Application Pub. No. H7-249749 ("Yamagata")	Oct 2, 2018	EXHIBIT	PETITIONER
Power of Attorney Samsung Electronics America, Inc.	Oct 2, 2018	PAPER	PETITIONER
U.S. Patent No. 9,391,143 ("the "143 Patent")	Oct 2, 2018	EXHIBIT	PETITIONER
Declaration of Dr. Charles Hunt	Oct 2, 2018	EXHIBIT	PETITIONER
Curriculum Vitae for Dr. Charles Hunt	Oct 2, 2018	EXHIBIT	PETITIONER
G. Krauter et al., Low Temperature Silicon Direct Bonding for Application in Micromechanics: Bonding Energies for Different Combinations of Oxides, Sensors and Actuators A 70, 271-275 (1998) ("Krauter")	Oct 2, 2018	EXHIBIT	PETITIONER
C. Harendt et al., Vertical Polysilicon Interconnects by Aligned Wafer Bonding, 97-36 Electrochemical Society Proceedings 501 (1998) ("Harendt")	Oct 2, 2018	EXHIBIT	PETITIONER
Q. Tong et al., Semiconductor Wafer Bonding: Science and Technology, John Wiley & Sons, Inc. (1999)	Oct 2, 2018	EXHIBIT	PETITIONER
A. Li, Systematic Low Temperature Bonding and its Application to the Hydrogen Ion Cut Process and Three- Dimensional Structures (1999)	Oct 2, 2018	EXHIBIT	PETITIONER
Declaration of Amanda Piel of Elsevier, Inc. Regarding Krauter and Tong (1994) (Part 1 of 2)	Oct 2, 2018	EXHIBIT	PETITIONER
Declaration of Amanda Piel of Elsevier, Inc. Regarding Krauter and Tong (1994) (Part 2 of 2)	Oct 2, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 5,503,704 ("Bower")	Oct 2, 2018	EXHIBIT	PETITIONER
Q. Tong et al., Wafer Bonding and Layer Splitting for Microsystems, 11 Advanced Materials 1409 (1999)	Oct 2, 2018	EXHIBIT	PETITIONER
R. Bower et al., Low Temperature Si3N4 Direct Bonding, 62 Applied Physics Letters 3485 (1993)	Oct 2, 2018	EXHIBIT	PETITIONER
Declaration of Dr. Sylvia Hall-Ellis Regarding Krauter, Reiche, Tong (1994), and Harendt	Oct 2, 2018	EXHIBIT	PETITIONER
Declaration of Elizabeth Craanen of The Electrochemical Society, Inc. Regarding Reiche	Oct 2, 2018	EXHIBIT	PETITIONER