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Samsung Electronics Co., Ltd. et al. vs Invensas Bonding Technologies, Inc. et al.

The detailed information for PTAB case with proceeding number IPR2019-00023 filed by Samsung Electronics Co., Ltd. et al. against Invensas Bonding Technologies, Inc. et al. on Oct 2, 2018. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.

Case Details

Proceeding Number: IPR2019-00023
Filing Date: Oct 2, 2018
Petitioner: Samsung Electronics Co., Ltd. et al.
Respondent: Invensas Bonding Technologies, Inc. et al.
Status: Terminated-Settled
Respondent Application Number: 12954740
Respondent Tech Center: 2800
Respondent Patent Number: 8153505
Termination Date: Dec 21, 2018

Proceeding Documents

The table below shows documents filed in the case, listing each document name, filing date, document type, and filing party. Tracking these filings indicates the activity of the parties involved in the case, and the types of documents filed can provide insights into the legal strategies being employed.

Show Exhibit Documents

Document Name	Filing Date	Category	Filing Party
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Notice of Refund	Feb 1, 2019	PAPER	BOARD
Petitioner's Request for Refund of Fees	Jan 8, 2019	PAPER	PETITIONER
Termination Decision Document	Dec 21, 2018	PAPER	BOARD
Joint Motion to Terminate Proceeding Pursuant to 35 U.S.C. 317 and 37 C.F.R. 42.74	Dec 13, 2018	PAPER	PETITIONER
Joint Request to File Settlement Agreement and Consent Letter As Business Confidential Information Under 35 U.S.C. 317 and 37 C.F.R. 42.74	Dec 13, 2018	PAPER	PETITIONER
Ex. 1026	Dec 13, 2018	EXHIBIT	PETITIONER
Ex. 1027	Dec 13, 2018	EXHIBIT	PETITIONER
Notice of Accord Filing Date	Nov 30, 2018	PAPER	BOARD
Patent Owner's Motion for District Court (Phillips) Patent Claim Construction	Oct 31, 2018	PAPER	PATENT OWNER
Patent Owner's Power of Attorney	Oct 22, 2018	PAPER	PATENT OWNER
Patent Owner's Mandatory Notices	Oct 22, 2018	PAPER	PATENT OWNER
Power of Attorney Samsung Electronics Co., Ltd.	Oct 2, 2018	PAPER	PETITIONER
U.S. Patent No. 8,153,505 ("the "505 Patent")	Oct 2, 2018	EXHIBIT	PETITIONER
Curriculum Vitae for Dr. Charles Hunt	Oct 2, 2018	EXHIBIT	PETITIONER
C. Harendt, Vertical Polysilicon Interconnects by Aligned Wafer Bonding, 97-36 Electrochemical Society Proceedings 501 (1998) ("Harendt")	Oct 2, 2018	EXHIBIT	PETITIONER
M. Reiche, The Effect of a Plasma Pretreatment on the Si/Si Bonding Behaviour, 97-36 Electrochemical Society Proceedings 437 (1998) ("Reiche")	Oct 2, 2018	EXHIBIT	PETITIONER
Q. Tong et al., Semiconductor Wafer Bonding: Recent Developments, 37 Materials Chemistry and Physics 101 (1994) ("Tong')	Oct 2, 2018	EXHIBIT	PETITIONER
Johann Steinkirchner et al., Silicon Wafer Bonding via Designed Monolayers, 7 Advanced Materials 7, 662 (1995)	Oct 2, 2018	EXHIBIT	PETITIONER
John L. Vossen et al., Thin Film Processes, Academic Press (1978) (excerpts)	Oct 2, 2018	EXHIBIT	PETITIONER
John L. Vossen et al., Thin Film Processes II, Academic Press (1991) (excerpts)	Oct 2, 2018	EXHIBIT	PETITIONER
Yang Li, Systematic Low Temperature Bonding and Its Application To The Hydrogen Ion Cut Process And Three- Dimensional Structures, University of California, Davis (1999)	Oct 2, 2018	EXHIBIT	PETITIONER
Watters Declaration regarding Li (Ex-1006)	Oct 2, 2018	EXHIBIT	PETITIONER
Declaration of Electrochemical Society regarding Reiche (Ex- 1007)	Oct 2, 2018	EXHIBIT	PETITIONER
PETITION FOR INTER PARTES REVIEW OF U.S. PATENT NO. 8,153,505	Oct 2, 2018	PAPER	PETITIONER
Power of Attorney Samsung Electronics America, Inc.	Oct 2, 2018	PAPER	PETITIONER
Prosecution File History of U.S. Patent No. 8,153,505	Oct 2, 2018	EXHIBIT	PETITIONER
Declaration of Dr. Charles Hunt	Oct 2, 2018	EXHIBIT	PETITIONER
Y. Li et al., Systematic Low Temperature Silicon Bonding Using Pressure and Temperature, 1998 Jpn. J. Appl. Phys. 37 (1998) ("Li")	Oct 2, 2018	EXHIBIT	PETITIONER
Q. Tong et al., Semiconductor Wafer Bonding: Science and Technology, John Wiley & Sons, Inc. (1999)	Oct 2, 2018	EXHIBIT	PETITIONER
Ricardo D'Agostino, Plasma Etching of Si and SiO2 in SF6- O2 mixtures, 52(1) J. Appl. Phys. 162 (1981)	Oct 2, 2018	EXHIBIT	PETITIONER
Elsevier Declaration Regarding Tong (Ex-1009) (Part 1 of 2)	Oct 2, 2018	EXHIBIT	PETITIONER
Elsevier Declaration Regarding Tong (Ex-1009) (Part 2 of 2)	Oct 2, 2018	EXHIBIT	PETITIONER
Hall-Ellis Declaration Regarding Harendt (Ex-1005)	Oct 2, 2018	EXHIBIT	PETITIONER
U.S. Patent No. 5,503,704, Nitrogen Based Low Temperature Direct Bonding (1996) ("Bower")	Oct 2, 2018	EXHIBIT	PETITIONER
Qin-Yi Tong, Wafer Bonding and Layer Splitting for Microsystems, 11 Adv. Mater. 17 (1999)	Oct 2, 2018	EXHIBIT	PETITIONER
Robert W. Bower, Low temperature Si3N4 direct bonding, 62 Appl. Phys. Lett. 26 (1993)	Oct 2, 2018	EXHIBIT	PETITIONER