The detailed information for PTAB case with proceeding number IPR2020-01669 filed by Taiwan Semiconductor Manufacturing Company Limited et al. against Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung EV et al. on Sep 25, 2020. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.

Case Details

Proceeding Number
IPR2020-01669
Filing Date
Sep 25, 2020
Petitioner
Taiwan Semiconductor Manufacturing Company Limited et al.
Respondent
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung EV et al.
Status
Final Written Decision
Respondent Application Number
09979826
Respondent Tech Center
2800
Respondent Patent Number
6548391
Institution Decision Date
Apr 15, 2021
Termination Date
Apr 8, 2022

Proceeding Documents

The table below shows documents filed in the case, listing each document name, filing date, document type, and filing party. Tracking these filings indicates the activity of the parties involved in the case, and the types of documents filed can provide insights into the legal strategies being employed.


Document NameFiling DateCategoryFiling Party

Alert me when new update on this case

Trial Certificate Checklist

Jun 29, 2022PAPERBOARD

Final Written Decision: original

Apr 8, 2022PAPERBOARD

Other: Hearing transcript

Mar 17, 2022PAPERBOARD

Petitioner's Updated Exhibit List

Mar 15, 2022PAPERPETITIONER

Ex. 1058 - Federal Circuit's Rule 36 Affirmance

Mar 15, 2022EXHIBITPETITIONER

ORDER GRANTING REQUESTS FOR ORAL ARGUMENT 37 C.F.R. sec 42.7

Jan 19, 2022PAPERBOARD

Petitioner's Updated Mandatory Notices Pursuant to 37 C.F.R. �� 42.8(a)(3)

Dec 22, 2021PAPERPETITIONER

Patent Owner's Request for Oral Argument

Dec 2, 2021PAPERPATENT OWNER

Petitioner's Request for Oral Argument

Dec 2, 2021PAPERPETITIONER

Patent Owner's Sur-Reply

Nov 12, 2021PAPERPATENT OWNER

Petitioner's Reply

Sep 30, 2021PAPERPETITIONER

Deposition of Dr. Philip E. Garrou, dated August 25, 2021 (Redacted)

Sep 30, 2021EXHIBITPETITIONER

Tungsten: Properties, Chemistry, Technology of the Element, Alloys, and Chemical Compounds, E. Lassner, et al., Springer (1999)

Sep 30, 2021EXHIBITPETITIONER

USPTO Class Definition for Class 257

Sep 30, 2021EXHIBITPETITIONER

ORDER Granting Patent Owner���s Motions for Pro Hac Vice Admission of Corby R. Vowell and Dave R. Gunter

Aug 24, 2021PAPERBOARD

Petitioner's Updated Power of Attorney

Aug 18, 2021PAPERPETITIONER

Petitioner's Updated Mandatory Notices Pursuant to 37 C.F.R. �� 42.8(a)(3)

Aug 18, 2021PAPERPETITIONER

Motion for Pro Hac Vice Admission of Dave R. Gunter

Aug 16, 2021PAPERPATENT OWNER

Motion for Pro Hac Vice Admission of Cory R. Vowell

Aug 16, 2021PAPERPATENT OWNER

Declaration of Dave R. Gunter

Aug 13, 2021EXHIBITPATENT OWNER

Patent Owner's Updated Exhibit List

Aug 13, 2021PAPERPATENT OWNER

Declaration of Corby R. Vowell

Aug 13, 2021EXHIBITPATENT OWNER

Patent Owner's Updated Exhibit List

Aug 13, 2021PAPERPATENT OWNER

DECISION Granting Petitioner���s Motion to Withdraw and Substitute Counsel 37 C.F.R. �� 42.10

Aug 11, 2021PAPERBOARD

Petitioner's Notice of Deposition of Dr. Philip Garrou

Aug 11, 2021PAPERPETITIONER

Patent Owner's Response to Petition for Inter Partes Review

Jul 8, 2021PAPERPATENT OWNER

Expert Declaration of Dr. Philip Garrou dated July 7, 2021

Jul 8, 2021EXHIBITPATENT OWNER

N. Haivik & K Aasmundtveit, ���Wafer Level Solid Liquid Interdiffusion Bonding���, chapter 10 in ���Handbook of Wafer Bonding���, P. Ramm, JJQ Lu, MMV Taklo Eds, Wiley-VCH 2012

Jul 8, 2021EXHIBITPATENT OWNER

A. Munding et. Al., ��� Cu/Sn Solid-Liquid Interdiffusion Bonding���, chapter 7 in ���Wafer Level 3D ICs Process Technology���, CS Tan, R. Guttmann, L.R Reif Eds., Springer, 2008

Jul 8, 2021EXHIBITPATENT OWNER

A. Klumpp, ���Bonding with Intermetallic Compounds���, chapter 14 in Handbook of 3D Integration, P. Garrou, M. Koyanagi and P. Ramm Eds. Wiley-VCH 2014

Jul 8, 2021EXHIBITPATENT OWNER

Petitioner's Unopposed Motion to Withdraw and Substitute Counsel Under 37 C.F.R. �� 11.116

Jun 29, 2021PAPERPETITIONER

Trial Instituted Document

Apr 15, 2021PAPERBOARD

SCHEDULING ORDER

Apr 15, 2021PAPERBOARD

Petitioner's Update Exhibit List

Apr 15, 2021PAPERPETITIONER

Claim Construction Order, W-20-CV-00109-ADA (WD Tx April 9, 2021)

Apr 15, 2021EXHIBITPETITIONER

Petitioner's Updated Exhibit List

Mar 16, 2021PAPERPETITIONER

Order Staying Case, W-20-CV-00109-ADA (WD Tx Mar. 11, 2021)

Mar 16, 2021EXHIBITPETITIONER

Patent Owner's Surreply to Preliminary Response

Feb 25, 2021PAPERPATENT OWNER

Petitioner's Reply to Patent Owner���s Preliminary Response

Feb 18, 2021PAPERPETITIONER

Claim Construction Order, W-20-CV-00109-ADA (WD Tx Jan. 29, 2021)

Feb 18, 2021EXHIBITPETITIONER

Patent Owner's Preliminary Response

Jan 20, 2021PAPERPATENT OWNER

Patent Owner's Limited Power of Attorney

Jan 7, 2021PAPERPATENT OWNER

Patent Owner's Mandatory Notices

Jan 7, 2021PAPERPATENT OWNER

Notice of Accord Filing Date

Oct 20, 2020PAPERBOARD

Patent Owner's Mandatory Notices Under 37 C.F.R. Section 42.8

Oct 16, 2020PAPERPATENT OWNER

Patent Owner's Limited Power of Attorney

Oct 16, 2020PAPERPATENT OWNER

U.S. Patent 5,426,072 to Ronald M. Finnila

Sep 25, 2020EXHIBITPETITIONER

EP 1171912B1 Application File History - Certified English Translation

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 5,424,245 to Richard W. Gurtler et al.

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 6,548,391 to Peter Ramm et al.

Sep 25, 2020EXHIBITPETITIONER

File History of U.S. Patent 5,548,391

Sep 25, 2020EXHIBITPETITIONER

JP 3895595B2 Application File History ¿¿¿ Certified English Translation

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 6,002,177 to Michael Anthony Gaynes, et al.

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 3,648,131 to Kenneth P. Stuby

Sep 25, 2020EXHIBITPETITIONER

Three-Dimensional IC Trends, Proceedings of the IEEE, Akasaka, Y., Dec. 1986

Sep 25, 2020EXHIBITPETITIONER

Cumulatively Bonded IC (Cubic) Technology For 3D-IC Fabrication, 8th International Workshop on Future Electron Devices, Hayashi, Y., et al., Mar. 14-16, 1990

Sep 25, 2020EXHIBITPETITIONER

ULSI Technology, C.Y. Chang and S.M. Sze, McGraw-Hill Int¿¿¿l Eds. (1996)

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 5,270,261 to Claude L. Bertin et al.,

Sep 25, 2020EXHIBITPETITIONER

EP 0559366 to Paul T. Lin

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 6,175,157 to Tadahiro Morifuji

Sep 25, 2020EXHIBITPETITIONER

Semiconductor Connections LLC v. Taiwan Semiconductor Manufacturing Company Limited et al, Case No. 6:20-cv-00109-ADA, Plaintiff¿¿¿s Preliminary Infringement Contentions (W.D. Tex, July 31, 2020)

Sep 25, 2020EXHIBITPETITIONER

Silicon Processing for the VLSI ERA, S. Wolf, R. Tauber, Vol., 1, 1st Ed., (1986)

Sep 25, 2020EXHIBITPETITIONER

WO 98/50194 to Shirzadi-Ghoshouni

Sep 25, 2020EXHIBITPETITIONER

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability, K. Suganuma, Woodhead Pub. (2018)

Sep 25, 2020EXHIBITPETITIONER

Fabrication Technology for Wafer Through-Hole Interconnections and Three-Dimensional Stacks of Chips and Wafers, S. Linder et al., IEEE (1994)

Sep 25, 2020EXHIBITPETITIONER

Semiconductor Connections LLC v. Taiwan Semiconductor Manufacturing Company Limited et al, Case No. 6:20-cv-00109-ADA, Motion for Transfer of Venue (W.D. Tex, Aug. 21, 2020)

Sep 25, 2020EXHIBITPETITIONER

The Oxford Dictionary and Thesaurus, Oxford University Press(1996)

Sep 25, 2020EXHIBITPETITIONER

JP 10-223833, Multichip Semiconductor Device as Well as Chips for Use in the Multichip Semiconductor Device and Method for the Formation Thereof to N. Hayasaka etal., dated Aug. 21, 1998 - Certified English Translation

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 4,939,568 to Takashi Kato et al.

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 5,038,996 to James Wilcox et al.

Sep 25, 2020EXHIBITPETITIONER

Semiconductor Connections LLC v. Taiwan Semiconductor Manufacturing Company Limited et al, Case No. 6:20-cv-00109-ADA, Proposed Scheduling Order (W.D. Tex, Aug. 21, 2020)

Sep 25, 2020EXHIBITPETITIONER

Semiconductor Connections LLC v. Taiwan Semiconductor Manufacturing Company Limited et al, Case No. 6:20-cv-00109-ADA, Complaint (W.D. Tex, Feb. 11, 2020)

Sep 25, 2020EXHIBITPETITIONER

David B. Guralnik, Webster¿¿¿s New Word College Dictionary (3rd ed. 1986)

Sep 25, 2020EXHIBITPETITIONER

The Oxford Modern English Dictionary, Oxford University Press(1993)

Sep 25, 2020EXHIBITPETITIONER

Handbook Of Multilevel Metallization For Integrated Circuits, 819, Wilson et al., Noyes Publ. (1993)

Sep 25, 2020EXHIBITPETITIONER

EP-A-0531723 to C. Bertin et al.

Sep 25, 2020EXHIBITPETITIONER

Low Stress Die Attach by Low Temperature Transient Liquid Phase Bonding,The International Society for Hybrid Microelectronics (ISHM) Symposium Proceedings, October 1992

Sep 25, 2020EXHIBITPETITIONER

Semiconductor Joining by the Solid-Liquid-Interdiffusion (SLID) process. Journal of the Electrochemical Society, (December 1996)

Sep 25, 2020EXHIBITPETITIONER

Transient Liquid Phase Bonding by W. D. MacDonald and T. W. Eager¿¿¿, Annu. Rev. Mater. Sci. 1992

Sep 25, 2020EXHIBITPETITIONER

The Silicon Dioxide Solution, Proceedings of the IEEE, M. Riordan, Vol. 86, No. 1 (2007)

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 5,627,106 to C. Hsu

Sep 25, 2020EXHIBITPETITIONER

DE4433846C2 to P. Ramm, et al.

Sep 25, 2020EXHIBITPETITIONER

EP-A-0926726 to U. Mastermatteo et al.

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 3,613,226 to Robert W. Haisty et al.

Sep 25, 2020EXHIBITPETITIONER

An Overview of through-silicon-via technology and manufacturing challenges ; Microelectronic Engineering 135 (2015) 73¿¿¿106 (2015)

Sep 25, 2020EXHIBITPETITIONER

The National Technology Roadmap for Semiconductors Technology Needs (1997)

Sep 25, 2020EXHIBITPETITIONER

EP 1171912B1 Application File History ¿¿¿ Certified

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 5,563,084 to Peter Ramm

Sep 25, 2020EXHIBITPETITIONER

EP 1171912B1 Application File History ¿¿¿ Certificate of Translation

Sep 25, 2020EXHIBITPETITIONER

JP 3895595B2 Application File History - Certified

Sep 25, 2020EXHIBITPETITIONER

JP 3895595B2 Application File History ¿¿¿ Certificate of Translation

Sep 25, 2020EXHIBITPETITIONER

JP 10-223833, Multichip Semiconductor Device as Well as Chips for Use in the Multichip Semiconductor Device and Method for the Formation Thereof to N. Hayasaka etal., dated Aug. 21, 1998

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 5,563,084 to Peter Ramm

Sep 25, 2020EXHIBITPETITIONER

Petition for Inter Partes Review of U.S. Patent 6,548,391

Sep 25, 2020PAPERPETITIONER

Petitioner's Power of Attorney

Sep 25, 2020PAPERPETITIONER

Petitioner's Reasons For Parallel Petitions and Petition Ranking

Sep 25, 2020PAPERPETITIONER

Declaration of Wilmer Bottoms, Ph.D. Under 37 C.F.R. 1.68 In Support Of Petition For Inter Partes Review

Sep 25, 2020EXHIBITPETITIONER

Curriculum Vitae of Dr. Wilmer Bottoms, Ph.D

Sep 25, 2020EXHIBITPETITIONER