The detailed information for PTAB case with proceeding number IPR2020-01670 filed by Taiwan Semiconductor Manufacturing Company Limited et al. against Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung EV et al. on Sep 25, 2020. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.

Case Details

Proceeding Number
IPR2020-01670
Filing Date
Sep 25, 2020
Petitioner
Taiwan Semiconductor Manufacturing Company Limited et al.
Respondent
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung EV et al.
Status
Institution Denied
Respondent Application Number
09979826
Respondent Tech Center
2800
Respondent Patent Number
6548391
Institution Decision Date
Apr 15, 2021

Proceeding Documents

The table below shows documents filed in the case, listing each document name, filing date, document type, and filing party. Tracking these filings indicates the activity of the parties involved in the case, and the types of documents filed can provide insights into the legal strategies being employed.


Document NameFiling DateCategoryFiling Party

Alert me when new update on this case

Trial Instituted Document

Apr 15, 2021PAPERBOARD

Petitioner's Updated Exhibit List

Apr 15, 2021PAPERPETITIONER

Claim Construction Order, W-20-CV-00109-ADA (WD Tx April 9, 2021)

Apr 15, 2021EXHIBITPETITIONER

Petitioner's Updated Exhibit List

Mar 16, 2021PAPERPETITIONER

Order Staying Case, W-20-CV-00109-ADA (WD Tx Mar. 11, 2021)

Mar 16, 2021EXHIBITPETITIONER

Patent Owner's Surreply to Preliminary Response

Feb 25, 2021PAPERPATENT OWNER

Petitioner's Reply to Patent Owner's Preliminary Response

Feb 18, 2021PAPERPETITIONER

Claim Construction Order, W-20-CV-00109-ADA (WD Tx Jan. 29, 2021)

Feb 18, 2021EXHIBITPETITIONER

Patent Owner's Preliminary Response

Jan 20, 2021PAPERPATENT OWNER

Patent Owner's Replacement Mandatory Notices

Jan 7, 2021PAPERPATENT OWNER

Notice of Accord Filing Date

Oct 20, 2020PAPERBOARD

Patent Owner's Limited Power of Attorney

Oct 16, 2020PAPERPATENT OWNER

Patent Owner's Mandatory Notices

Oct 16, 2020PAPERPATENT OWNER

U.S. Patent 6,548,391 to Peter Ramm et al.

Sep 25, 2020EXHIBITPETITIONER

EP 1171912B1 Application File History- Certified English Translation

Sep 25, 2020EXHIBITPETITIONER

File History of U.S. Patent 5,548,391

Sep 25, 2020EXHIBITPETITIONER

JP 3895595B2 Application File History - Certified English Translation

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 4,939,568 to Takashi Kato et al.

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 6,002,177 to Michael Anthony Gaynes, et al.

Sep 25, 2020EXHIBITPETITIONER

Semiconductor Connections LLC v. Taiwan Semiconductor Manufacturing Company Limited et al, Case No. 6:20-cv-00109-ADA, Plaintiff¿¿¿s Preliminary Infringement Contentions (W.D. Tex, July 31, 2020)

Sep 25, 2020EXHIBITPETITIONER

Amalgams for Improved Electronics Interconnection, C. A. MacKay, IEEE Micro (Mar. 1993)

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 5,424,245 to Richard W. Gurtler et al.

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 5,529,950 to Wolfgang Hoenlein, et al.

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 5,258,648 to Paul T. Lin

Sep 25, 2020EXHIBITPETITIONER

EP0559366 to Paul T. Lin

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 5,426,072 to Ronald M. Finnila

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 5,270,261 to Claude L. Bertin et al.

Sep 25, 2020EXHIBITPETITIONER

Three-Dimensional IC Trends, Proceedings of the IEEE, vol. 74, No. 12, Akasaka, Y., Dec. 1986

Sep 25, 2020EXHIBITPETITIONER

Cumulatively Bonded IC (Cubic) Technology For 3D-IC Fabrication, 8th International Workshop on Future Electron Devices, Hayashi, Y., et al., Mar. 14-16, 1990

Sep 25, 2020EXHIBITPETITIONER

Interconnects Scaling-The Real Limiter to High Performance, M. Bohr, ULSI, IEDM 95 ¿¿¿ 241, IEEE 1995

Sep 25, 2020EXHIBITPETITIONER

Ultra thin diffusion barriers for Cu interconnections at the gigabit generation and beyond, F. Braud, et al., ME (1997)

Sep 25, 2020EXHIBITPETITIONER

Fabrication Technology for Wafer Through-Hole Interconnections and Three-Dimensional Stacks of Chips and Wafers, S. Linder et al., IEEE (1994)

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 5,234,850 to I-Chi Liao

Sep 25, 2020EXHIBITPETITIONER

Semiconductor Connections LLC v. Taiwan Semiconductor Manufacturing Company Limited et al, Case No. 6:20-cv-00109-ADA, Complaint (W.D. Tex, Feb. 11, 2020)

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 4,597,827 to Akito Nishitani, et al.

Sep 25, 2020EXHIBITPETITIONER

Three dimensional metallization for vertically integrated circuits, Microelectronics Engineering, P. Bollmann, P. Ramm et al. (1997)

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 5,627,106 to C. Hsu

Sep 25, 2020EXHIBITPETITIONER

DE4433846C2 to P. Ramm, et al.

Sep 25, 2020EXHIBITPETITIONER

Three dimensional metallization for vertically integrated circuits, Microelectronics Engineering, P. Bollmann, P. Ramm et al. 40, 41 (1997)

Sep 25, 2020EXHIBITPETITIONER

Fabrication of Three-Dimensional IC Using ¿¿¿Cumulatively Bonded IC¿¿¿ (CUBIC) Technology, 1990 Symposium on VLSI Technology, Hayashi, Y., et al., IEEE, Mar. 14-16, 1990

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 6,175,157 to Tadahiro Morifuji

Sep 25, 2020EXHIBITPETITIONER

Semiconductor Connections LLC v. Taiwan Semiconductor Manufacturing Company Limited et al, Case No. 6:20-cv-00109-ADA, Proposed Scheduling Order (W.D. Tex, Aug. 21, 2020)

Sep 25, 2020EXHIBITPETITIONER

Semiconductor Connections LLC v. Taiwan Semiconductor Manufacturing Company Limited et al, Case No. 6:20-cv-00109-ADA, Motion for Transfer of Venue (W.D. Tex, Aug. 21, 2020)

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 5,399,898 to Michael D. Rostoker

Sep 25, 2020EXHIBITPETITIONER

Semiconductor Joining by the Solid-Liquid-Interdiffusion (SLID) process. Journal of the Electrochemical Society, L. Bernstein (December 1966)

Sep 25, 2020EXHIBITPETITIONER

Silicon Processing for the VLSI ERA, S. Wolf, R. Tauber, Vol., 1, 1st Ed., (1986)

Sep 25, 2020EXHIBITPETITIONER

EP 1171912B1 Application File History - Certified

Sep 25, 2020EXHIBITPETITIONER

JP 3895595B2 Application File History - Certificate of Translation

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 5,563,084 to Peter Ramm

Sep 25, 2020EXHIBITPETITIONER

EP-A-0926726 to U. Mastermatteo et al.

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 3,613,226 to Robert W. Haisty et al.

Sep 25, 2020EXHIBITPETITIONER

Low Stress Die Attach by Low Temperature Transient Liquid Phase Bonding, The International Society for Hybrid Microelectronics (ISHM) Symposium Proceedings, October 1992

Sep 25, 2020EXHIBITPETITIONER

Transient Liquid Phase Bonding by W. D. MacDonald and T. W. Eager¿¿¿, Annu. Rev. Mater. Sci. 1992

Sep 25, 2020EXHIBITPETITIONER

The National Technology Roadmap for Semiconductors Technology Needs (1997)

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 6,013,948 to S. Akram et al.

Sep 25, 2020EXHIBITPETITIONER

EP 1171912B1 Application File History - Certificate of Translation

Sep 25, 2020EXHIBITPETITIONER

JP 3895595B2 Application File History - Certified

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 3,648,131 to Kenneth P. Stuby

Sep 25, 2020EXHIBITPETITIONER

David B. Guralnik, Webster¿¿¿s New Word College Dictionary, (3rd ed. 1986)

Sep 25, 2020EXHIBITPETITIONER

Barrier Properties of Very Thin Ta and TaN Layers Against Copper Diffusion, J. Electrochem Soc. Vol. 145, No. 7, 2538 (July 1998)

Sep 25, 2020EXHIBITPETITIONER

Petitioner's Power of Attorney

Sep 25, 2020PAPERPETITIONER

U.S. Patent 5,971,253 to Kenneth Gilleo et al.

Sep 25, 2020EXHIBITPETITIONER

The Oxford Dictionary and Thesaurus, Oxford University Press(1996)

Sep 25, 2020EXHIBITPETITIONER

The Oxford Modern English Dictionary, Oxford University Press(1993)

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 6,221,769 to S. Dhong et al

Sep 25, 2020EXHIBITPETITIONER

Improved TiN Film as a Diffusion Barrier Between Copper and Silicon, Thin Solid Films 320, 134 (1998)

Sep 25, 2020EXHIBITPETITIONER

U.S. Patent 5,608,264 to S. Gaul

Sep 25, 2020EXHIBITPETITIONER

EP-A-0531723 to C. Bertin et al.

Sep 25, 2020EXHIBITPETITIONER

Petition for Inter Partes Review of U.S. Patent 6,548,391

Sep 25, 2020PAPERPETITIONER

Petitioner¿¿¿s Reasons For Parallel Petitions and Petition Ranking

Sep 25, 2020PAPERPETITIONER

Curriculum Vitae of Dr. Wilmer Bottoms, Ph.D

Sep 25, 2020EXHIBITPETITIONER

Declaration of Dr. Wilmer Bottoms, Ph.D in Support of IPR Petition

Sep 25, 2020EXHIBITPETITIONER