The detailed information for PTAB case with proceeding number IPR2020-01729 filed by Semiconductor Components Industries, LLC d/b/a ON Semiconductor et al. against Invensas Corporation et al. on Sep 30, 2020. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.

Case Details

Proceeding Number
IPR2020-01729
Filing Date
Sep 30, 2020
Petitioner
Semiconductor Components Industries, LLC d/b/a ON Semiconductor et al.
Respondent
Invensas Corporation et al.
Status
Final Written Decision
Respondent Application Number
09143723
Respondent Tech Center
2800
Respondent Patent Number
6232231
Institution Decision Date
Dec 17, 2020
Termination Date
Sep 1, 2021

Proceeding Documents

The table below shows documents filed in the case, listing each document name, filing date, document type, and filing party. Tracking these filings indicates the activity of the parties involved in the case, and the types of documents filed can provide insights into the legal strategies being employed.


Document NameFiling DateCategoryFiling Party

Alert me when new update on this case

Final Written Decision: original

Sep 1, 2021PAPERBOARD

PANEL CHANGE ORDER Conduct of the Proceedings 37 C.F.R. ¿¿ 42.5

Dec 28, 2020PAPERBOARD

Decision - Granting Institution of Inter Partes Review; Granting Motion for Joinder

Dec 17, 2020PAPERBOARD

Patent Owner Non-Opposition to Joinder Motion

Dec 4, 2020PAPERPATENT OWNER

Patent Owner Mandatory Notices

Oct 21, 2020PAPERPATENT OWNER

Patent Owner Power of Attorney

Oct 21, 2020PAPERPATENT OWNER

Notice of Accord Filing Date

Oct 8, 2020PAPERBOARD

U.S. Patent No. 6,232,231

Sep 30, 2020EXHIBITPETITIONER

U.S. Patent No. 6,093,631

Sep 30, 2020EXHIBITPETITIONER

Integration of CMP Into Deep Sub-micron Multilevel Metallization Circuits by D. Pramanik et al., Proceedings of the First International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (Pramanik1997)

Sep 30, 2020EXHIBITPETITIONER

CMP Applications for Sub-0.25m Process Technologies by D. Pramanik et al., Proceedings of the Second International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (Pramanik1998)

Sep 30, 2020EXHIBITPETITIONER

Introduction to VLSI Systems by C. Mead and L. Conway (Mead) PART 1

Sep 30, 2020EXHIBITPETITIONER

Digital Integrated Circuits by J. Rabaey (Rabaey) PART 1

Sep 30, 2020EXHIBITPETITIONER

Digital Integrated Circuits by J. Rabaey (Rabaey) PART 3

Sep 30, 2020EXHIBITPETITIONER

Digital Integrated Circuits by J. Rabaey (Rabaey) PART 4

Sep 30, 2020EXHIBITPETITIONER

Chemical Mechanical Planarization of Microelectronic Materials by J. Steigerwald et al. (Steigerwald)

Sep 30, 2020EXHIBITPETITIONER

Integration of chemical-mechanical polishing into CMOS integrated circuit manufacturing, by H. Landis et al., Thin Solid Films (1992) 1-7 (Landis)

Sep 30, 2020EXHIBITPETITIONER

U.S. Patent No. 5,948,573

Sep 30, 2020EXHIBITPETITIONER

U.S. Patent No. 5,639,679

Sep 30, 2020EXHIBITPETITIONER

U.S. Patent No. 5,928,959

Sep 30, 2020EXHIBITPETITIONER

U.S. Patent No. 5,721,172

Sep 30, 2020EXHIBITPETITIONER

U.S. Patent No. 5,943,590

Sep 30, 2020EXHIBITPETITIONER

U.S. Patent No. 5,602,423

Sep 30, 2020EXHIBITPETITIONER

U.S. Patent No. 5,652,465

Sep 30, 2020EXHIBITPETITIONER

Declaration of Dr. Duane S. Boning

Sep 30, 2020EXHIBITPETITIONER

Prosecution History for U.S. Patent No. 6,232,231

Sep 30, 2020EXHIBITPETITIONER

The physical and electrical effects of metal-fill patterning practices for oxide chemical-mechanical polishing processes, by B. Stine et al., IEEE Trans. On Elec. Devices, Vol. 45 No. 3 March 1998, pp. 665-679 (Stine1998)

Sep 30, 2020EXHIBITPETITIONER

U.S. Patent No. 5,879,222

Sep 30, 2020EXHIBITPETITIONER

Digital Integrated Circuits by J. Rabaey (Rabaey) PART 2

Sep 30, 2020EXHIBITPETITIONER

Introduction to VLSI Systems by C. Mead and L. Conway (Mead) PART 2

Sep 30, 2020EXHIBITPETITIONER

Introduction to VLSI Systems by C. Mead and L. Conway (Mead) PART 3

Sep 30, 2020EXHIBITPETITIONER

Introduction to VLSI Systems by C. Mead and L. Conway (Mead) PART 4

Sep 30, 2020EXHIBITPETITIONER

Principles of CMOS VLSI Design 2nd Edition by N. Weste and K. Eshraghian (Weste) PART 1

Sep 30, 2020EXHIBITPETITIONER

Implementation of CMP-based design rules and pattern practices by L. E. Camilletti, Proc. IEEE/SEMI Adv. Semiconduct. Manufact. Conf., October 1995, pp. 2-4 (Camilletti)

Sep 30, 2020EXHIBITPETITIONER

The role of dummy fill patterning practices on intra-die ILD thickness variation in CMP processes by B. Stine et al., Proc. VLSI Multilevel Interconnect Conf., June 1996, pp. 421-423 (Stine)

Sep 30, 2020EXHIBITPETITIONER

Multilevel interconnect system for 0.35-m CMOS LSIs with metal dummy planarization process and thin tungsten wirings, by Ichikawa et al., VLSI Multilevel Interconnect Conf., June 1995, pp. 254-260 (Ichikawa)

Sep 30, 2020EXHIBITPETITIONER

U.S. Patent No. 5,923,563

Sep 30, 2020EXHIBITPETITIONER

U.S. Patent No. 6,103,626

Sep 30, 2020EXHIBITPETITIONER

Claim Construction Order (Nov. 16, 2018) from Case 1:17-cv-01363-MN (D. Del.)

Sep 30, 2020EXHIBITPETITIONER

Claim Construction Order (Oct. 26, 2018) from Case 2:17-CV-00670-RWS-RSP (E.D. Tx.)

Sep 30, 2020EXHIBITPETITIONER

IPR2017-00831 Decision Denying Institution of Inter Partes Review (Paper 8)

Sep 30, 2020EXHIBITPETITIONER

IPR2018-01401 Petition for Inter Partes Review of U.S. Patent No. 6,232,231

Sep 30, 2020EXHIBITPETITIONER

IPR2018-01401 Decision to Terminate Proceeding (Paper 11)

Sep 30, 2020EXHIBITPETITIONER

Feb. 24, 2003 Amendment from Prosecution of U.S. Patent No. 6,849,946

Sep 30, 2020EXHIBITPETITIONER

Printout of Electrochemical Society webpage on 2/19/2020 of https://www.electrochem.org/dl/pv/published/1996/1996.htm

Sep 30, 2020EXHIBITPETITIONER

U.S. Patent No. 6,109,775

Sep 30, 2020EXHIBITPETITIONER

Email from Duane Boning dated March 10, 1998

Sep 30, 2020EXHIBITPETITIONER

Principles of CMOS VLSI Design 2nd Edition by N. Weste and K. Eshraghian (Weste) PART 2

Sep 30, 2020EXHIBITPETITIONER

"Principles of CMOS VLSI Design 2nd Edition" by N. Weste and K. Eshraghian ("Weste") PART 3

Sep 30, 2020EXHIBITPETITIONER

PETITION FOR INTER PARTES REVIEW OF U.S. PATENT NO. 6,232,231

Sep 30, 2020PAPERPETITIONER

Power of Attorney

Sep 30, 2020PAPERPETITIONER

Motion for Joinder to Inter Parties Review IPR2020-00603

Sep 30, 2020PAPERPETITIONER