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Semiconductor Components Industries, LLC doing business as ON Semiconductor et al. vs Invensas Corporation et al.

The detailed information for PTAB case with proceeding number IPR2020-01732 filed by Semiconductor Components Industries, LLC doing business as ON Semiconductor et al. against Invensas Corporation et al. on Sep 30, 2020. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.

Case Details

Proceeding Number: IPR2020-01732
Filing Date: Sep 30, 2020
Petitioner: Semiconductor Components Industries, LLC doing business as ON Semiconductor et al.
Respondent: Invensas Corporation et al.
Status: Terminated-Settled
Respondent Application Number: 09427583
Respondent Tech Center: 2800
Respondent Patent Number: 6317333
Termination Date: Nov 12, 2020

Proceeding Documents

The table below shows documents filed in the case, listing each document name, filing date, document type, and filing party. Tracking these filings indicates the activity of the parties involved in the case, and the types of documents filed can provide insights into the legal strategies being employed.

Show Exhibit Documents

Document Name	Filing Date	Category	Filing Party
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Notice of Refund	Dec 1, 2020	PAPER	BOARD
Petitioner's Request for Refund of Post-Institution Fees	Nov 16, 2020	PAPER	PETITIONER
Settlement Prior to Institution of Trial 37 C.F.R. § 42.74	Nov 12, 2020	PAPER	BOARD
JOINT MOTION TO TERMINATE	Nov 9, 2020	PAPER	PETITIONER
JOINT REQUEST TO FILE SETTLEMENT AGREEMENT AS BUSINESS CONFIDENTIAL INFORMATION AND TO MAINTAIN AGREEMENT SEPARATE FROM THE PUBLIC FILE	Nov 9, 2020	PAPER	PETITIONER
PETITIONER¿¿¿S UPDATED EXHIBIT LIST	Nov 9, 2020	PAPER	PETITIONER
Agreement and Covenant Not to Sue	Nov 9, 2020	EXHIBIT	PETITIONER
Patent Owner Mandatory Notices	Oct 21, 2020	PAPER	PATENT OWNER
Patent Owner Power of Attorney	Oct 21, 2020	PAPER	PATENT OWNER
Notice of Accord Filing Date	Oct 9, 2020	PAPER	BOARD
U.S. Patent No. 6,317,333	Sep 30, 2020	EXHIBIT	PETITIONER
Declaration of Professor Pradeep Lall, Ph.D In Support Of Petition For Inter Partes Review of U.S. Patent No. 6,317,333 (Lall)	Sep 30, 2020	EXHIBIT	PETITIONER
Curriculum Vitae of Pradeep Lall, Ph.D	Sep 30, 2020	EXHIBIT	PETITIONER
Prosecution History of U.S. Application Serial No. 09/061,022	Sep 30, 2020	EXHIBIT	PETITIONER
Japanese Publication No. 74417 (from Japanese Application No. 9-231927) and machine translation from the Japanese Platform for Patent Information	Sep 30, 2020	EXHIBIT	PETITIONER
Prosecution History of U.S. Application Serial No. 09/427,583 (resulting in U.S. Patent No. 6,317,333)	Sep 30, 2020	EXHIBIT	PETITIONER
Japanese Publication No. 9-8460 and machine translation from the Japan Platform for Patent Information	Sep 30, 2020	EXHIBIT	PETITIONER
U.S. Pat. No. 5,635,767	Sep 30, 2020	EXHIBIT	PETITIONER
U.S. Pat. No. 5,841,075	Sep 30, 2020	EXHIBIT	PETITIONER
U.S. Pat. No. 6,014,317	Sep 30, 2020	EXHIBIT	PETITIONER
U.S. Pat. No. 5,969,426	Sep 30, 2020	EXHIBIT	PETITIONER
Tummala, et al., Microelectronics Packaging Handbook, Volume I (1997) PART 2	Sep 30, 2020	EXHIBIT	PETITIONER
Tummala, et al., Microelectronics Packaging Handbook, Volume I (1997) PART 1	Sep 30, 2020	EXHIBIT	PETITIONER
Tummala, et al., Microelectronics Packaging Handbook, Volume II (1997) PART 4	Sep 30, 2020	EXHIBIT	PETITIONER
Tummala, et al., Microelectronics Packaging Handbook, Volume II (1997) PART 1	Sep 30, 2020	EXHIBIT	PETITIONER
Tummala, et al., Microelectronics Packaging Handbook, Volume II (1997) PART 2	Sep 30, 2020	EXHIBIT	PETITIONER
Tummala, et al., Microelectronics Packaging Handbook, Volume II (1997) PART 3	Sep 30, 2020	EXHIBIT	PETITIONER
Tummala, et al., Microelectronics Packaging Handbook, Volume II (1997) PART 5	Sep 30, 2020	EXHIBIT	PETITIONER
Tummala, et al., Microelectronics Packaging Handbook, Volume II (1997) PART 6	Sep 30, 2020	EXHIBIT	PETITIONER
Tummala, et al., Microelectronics Packaging Handbook, Volume III (1997) PART 3	Sep 30, 2020	EXHIBIT	PETITIONER
Tummala, et al., Microelectronics Packaging Handbook, Volume III (1997) PART 4	Sep 30, 2020	EXHIBIT	PETITIONER
Tummala, et al., Microelectronics Packaging Handbook, Volume III (1997) PART 1	Sep 30, 2020	EXHIBIT	PETITIONER
Tummala, et al., Microelectronics Packaging Handbook, Volume III (1997) PART 2	Sep 30, 2020	EXHIBIT	PETITIONER
Tsukada, et al., Surface Laminar Circuit, A Low Cost High Density Printed Circuit Board, Proceedings of the Technical Program of Surface Mount International (September 1992)	Sep 30, 2020	EXHIBIT	PETITIONER
Tsukada, Multi-Chip Packaging for Future Direction, Journal of the Japanese Institute for Interconnecting and Packaging Electronic Circuits (January 1997), including certified translation	Sep 30, 2020	EXHIBIT	PETITIONER
IEEE Electrical Insulation Magazine, Vol. 13, Issue 5, September-October 1997	Sep 30, 2020	EXHIBIT	PETITIONER
Tsukada, et al., Surface Laminar Circuit Packaging, IEEE 42nd Electronic Components and Technology Conference (ECTC) (1992)	Sep 30, 2020	EXHIBIT	PETITIONER
Freyman et al., Overmolded Plastic Pad Array Carriers (OMPAC): A Low Cost, High Interconnect Density IC Packaging Solution for Consumer and Industrial Electronics, 1991 ECTC Proc., Atlanta, Georgia, May 1991, pp. 176-182.	Sep 30, 2020	EXHIBIT	PETITIONER
Vardaman et al., The market for ball grid array packages, Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium, 4-5 Dec. 1995.	Sep 30, 2020	EXHIBIT	PETITIONER
Liu et al., Plastic ball grid array (PBGA) overview, Materials Chemistry and Physics 40, Elsevier, pp. 236-244, 1995	Sep 30, 2020	EXHIBIT	PETITIONER
Lau et al., Ball Grid Array Technology, McGraw-Hill, Inc., 1995. PART 1	Sep 30, 2020	EXHIBIT	PETITIONER
Lau et al., Ball Grid Array Technology, McGraw-Hill, Inc., 1995. PART 2	Sep 30, 2020	EXHIBIT	PETITIONER
Declaration of Professor Sylvia Hall-Ellis, Ph.D including: Appendix A (Curriculum Vitae) and Attachments.	Sep 30, 2020	EXHIBIT	PETITIONER
Mearig et al., An Overview of Manufacturing BGA Technology, 1995 IEEE/CPMT Intl Electronics Manufacturing Technology Symposium, pp. 434-437, 1995	Sep 30, 2020	EXHIBIT	PETITIONER
Power of Attorney	Sep 30, 2020	PAPER	PETITIONER
PETITION FOR INTER PARTES REVIEW OF U.S. Patent No. 6,317,333	Sep 30, 2020	PAPER	PETITIONER
Motion for Joinder to Inter Parties Review of IPR2020-00708	Sep 30, 2020	PAPER	PETITIONER