Advanced Semiconductor Engineering, Inc. vs Bell Semiconductor LLC et al.

Other: other court decision

Other: Fed Circuit mandate

Patent Owner's Notice of Appeal

Final Written Decision

Other: Hearing transcript

Petitioner's Revised Power of Attorney

Petitioner's Updated Mandatory Notices

ORDER Conditionally Granting Petitioners Motion for Pro Hac Vice Admission of Ramy Hanna 37 C.F.R. sec 42.10 c

Notice of Filing of Patent Owner's Updated Demonstratives

Patent Owner's Demonstratives

Petitioner's Demonstratives

PETITIONER���S MOTION FOR PRO HAC VICE ADMISSION OF RAMY HANNA UNDER 37 C.F.R. �� 41.10(c)

Ramy Hanna Bio

Hanna Decl. ISO Pro Hac

ORDER Granting Patent Owners Motion for Pro Hac Vice Admission of Christopher Clayton 37 C.F.R. sec 42.10(c)

ORDER Setting Oral Argument 37 C.F.R. sec 42.70

Patent Owner's Sur-Reply

PATENT OWNER���S MOTION FOR PRO HAC VICE ADMISSION UNDER 37 C.F.R. �� 42.10(c)

AFFIDAVIT OF MR. CHRISTOPHER CLAYTON IN SUPPORT OF PATENT OWNER���S MOTION FOR PRO HAC VICE ADMISSION

Petitioner's Request for Oral Argument

Patent Owner's Request for Oral Argument

Notice of Stipulation to Modify Schedule

Petitioner's Reply to Patent Owner's Response

Transcript of November 17, 2021 deposition of Joseph Bernstein

Second Declaration of Dr. Jeffrey Suhling

���Characterization of Plastic Packages Using (100) Silicon Stress Test Chips,��� Zou, Suhling, Jaeger, Lin, Nguyen, and Gee, EEP-Vol. 22/AMD-Vol. 226, Applications of Experimental Mechanics to Electronic Packaging, ASME 1997. (Exhibit 1032, Figure 7.)

Eric Ouyang et al., ���Behaviors of QFN Packages on a Leadframe Strip,��� IMAPS 2016 - 49th International Symposium on Microelectronics, Pasadena, CA, Oct. 10-13, 2016

Excerpt of Ray P. Prasad, Surface Mount Technology, 2d Ed., 1997

Joint Claim Construction Statement in Bell Semiconductor, LLC v. Renesas Electronics Corp. et al., No. 6:19-cv-02196 (M.D. Fla.)

Granting in Part and Conditionally Granting in Part Patent Owner's Motion to Withdraw and Substitute New Counsel

PATENT OWNER���S MOTION TO WITHDRAW AND SUBSTITUTE NEW COUNSEL

Notice of Stipulation to Modify Schedule

Petitioner's Amended Notice of Deposition of Dr. Joseph Bernstein

UPDATED POWER OF ATTORNEY FOR PATENT OWNER

PATENT OWNER���S UPDATED MANDATORY NOTICES

Petitioner's Notice of Deposition of Dr. Joseph Bernstein

Order: REVISED SCHEDULING ORDER+

Petitioner's Objection to Patent Owner's Evidence Pursuant to 37 C.F.R. �� 42.64(b)(1)

Order Granting Petitioner's Motion to Withdraw Counsel

Petitioner's Motion to Withdraw Under 37 C.F.R. �� 11.116

Notice of Stipulation to Modify Schedule

Petitioner's Updated Mandatory Notices

Trial Instituted Document

Scheduling Order

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Ex. 3001 -Transcript - Conference Call

Notice of Accord Filing Date

JP Patent Publication H9-102573 Certified English Translation of Higuchi and Affidavit of Translator

U.S. Pat. Pub. 2001/0011772 to Fukasawa et al.

Petitioner's Power of Attorney

U.S. Patent 6,624,007 to Kobayakawa, et al.

File History for U.S. Patent 6,624,007

Curriculum Vitae of Dr. Jeffrey Suhling

JP Patent Publication 2001-77263 to Matsuo, et al.

JP Patent Publication 2001-77263 Certified English Translation of Matsuo and Affidavit of Translator

JP Patent Publication H9-102573 to Higuchi

Bell Semiconductor, LLC v. Microchip Tech. Inc., Civil No. 6-20-cv-00296 (WD Tex. April 16, 2020), Docket Sheet

Bell Semiconductor, LLC v. Renesas Electronics Corporation, Civil No. 6-19-cv-02196 (MDFL November 19, 2019), Docket Sheet

Bell Semiconductor, LLC v. Renesas Electronics Corporation, Civil No. 6-19-cv-02196 (MDFL November 19, 2019), Docket No. 38 (Case Management and Scheduling Order)

U.S. Pat. No. 5,371,943 to Shibata

Bell Semiconductor, LLC v. Integrated Device Technology, Inc. Civil No. 1-19-cv-02155 (D. Del. Nov. 18, 2019), Docket Sheet

Bell Semiconductor, LLC v. NXP Semiconductors, N.V., Civil No. 1-20-cv-00611 (WD Tex. Mar. 23, 2020), Docket Sheet

Plastic-Encapsulated Microelectronics, Materials, Processes, Quality, Reliability, and Applications, John Wiley & Sons, Inc., 1995 (Chapter 1 Introduction)

Introduction to Manufacturing Processes, Third Edition, McGraw-Hill, 2000. (Chapter 10, Sheet-Metalworking Processes)

Microelectronic Packaging Handbook, Technology Drivers Part 1, Second Edition, Chapman & Hall, 1997 (Chapter 1 Microelectronics Packaging, An Overview)

U.S. Pat. No. 6,555,899 to Chun et. al

Microelectronic Packaging Handbook, Semiconductor Packaging Part 2, Second Edition, Chapman & Hall, 1999 (Chapter 10 - Plastic Packaging)

Plastic-Encapsulated Microelectronics, Materials, Processes, Quality, Reliability, and Applications, John Wiley & Sons, Inc., 1995 (Chapter 3 Manufacturing Processes)

Materials and Processes in Manufacturing, Eighth Edition, Prentice Hall, 1997. (Chapter 19, Cold-Working Processes)

Marks' Standard Handbook for Mechanical Engineers, Tenth Edition, McGraw-Hill, 1996. (Chapter 13.2, Plastic Working of Metals)

Bell Semiconductor, LLC v. Microchip Tech. Inc., Civil No. 6-20-cv-00296 Proposed Scheduling Order, Docket No 29 (WD Tex. Oct. 30, 2020)

Bell Semiconductor, LLC v. NXP Semiconductors, N.V., Civil No. 1-20-cv-00611 Proposed Scheduling Order, Docket No. 41 (WD Tex. Nov. 6, 2020)

U.S. Pat. No. 4,205,548 to Bothner et al.

U.S. Pat. No. 4,711,700 to Cusack

U.S. Pat. No. 6,057,176 to King

The Comparison of Solder Joint Reliability between BCC++ and QFN, Proceedings of the 2001 Electronic Components and Technology Conference, May 29-June 1, 2001

Declaration of Dr. Jeffrey Suhling

EXPUNGED

EXPUNGED

Petition for Inter Partes Review of U.S. Patent 6,624,007