NXP Semiconductors N.V. et al. vs Bell Seminconductor LLC et al.

Other: Fed Circuit mandate

Other: other court decision

Petitioner's Notice of Cross-Appeal

Patent Owner's Notice of Appeal

Final Written Decision: original

Other: Hearing transcript

Order: DECISION1 Granting Patent Owners Opposed Motions for Admission Pro Hac Vice of Jason G. Sheasby 37 C.F.R. § 42.10

Patent Owner's Demonstratives

Petitioners' Hearing Demonstratives - Not In Evidence

Patent Owner's Objections to Petitioner's Demonstratives

Petitioners' Objections to Patent Owner's Demonstratives

Response in opposition to Patent Owner's Motion to Appear Pro Hac Vice

Draft Sheasby Declaration

Docket Navigator Search Results

Opposed Motion for PHV Admission of Jason Sheasby

EXPUNGED

EXPUNGED

Ex. 2034 Sheasby Declaration iso PHV Mtn for Admission

Ex. 2035 Email chain between Counsel

ORDER Setting Oral Argument 37 C.F.R. 42.70

Patent Owner's Sur-Reply

Patent Owner's Request for Oral Argument

Petitioners' Reply to Patent Owner's Response

Annotated Hall Fig. 3

Annotated Hall Fig. 2

Images from Infringement Contentions (Ex. 1010)

Demonstrative ��� Striplines

Demonstrative ��� Chin cross-section

Demonstrative ��� Chin Prior Art and Hall Prior Art

Demonstrative ��� Chin and Hall Prior Art

Demonstrative ��� Chin and Hall

Oggioni (Annotated)

Demonstrative ��� Hall Figs. 2 and 3

Dr. Bauer Deposition Transcript with Errata

Na. et al., ���Discontinuity impacts and design considerations of high speed differential signals in FC-PBGA packages with high wiring density��� (IEEE 2005)

Cases et al., ���Laminate Package Trends for High-speed System Interconnects��� (IEEE 2003)

Stipulation to move Due Dates 2 and 3

Notice of Deposition of Charles Bauer PhD

Stipulation to move Due Dates 2 and 3

Patent Owner Response

EX2006 2005-05-31 Hasan (Intel), Development of small die-small form factor flip chip pkg

EX2007 2005-05-19 Mathew (Intel), IXE 7000 Ethernet switch pkg development

EX2008 2004-08-02 Sharawi (Practical issues in high speed PCB design)

EX2009 NXP and Freescale Announce Completion of Merger

EX2010 2004-01-31 Xilinx, Device Packaging and Thermal Characteristics

EX2011 2005-11-08 Parker (Agilent), The effects of defects on high-speed boards

EX2012 2004-08-09 Ahn

EX2013 Tk Chin- Linkedin.com

EX2014 2004-06-24 Xilinx, Rocket IO Users Guide

EX2016 MT-094

EX2017 Stress Driven Qualification of Integrated Circuits

EX2018 IPC-TM-650 Thermal Stress, Plated-Through Holes

EX2021 Transmission Line Design Handbook - Wadell

EX2022 High-Speed Layout Guidelines for Signal Conditioners

EX2024 IPC-9701 Performance Test Methods & Qualification Requirements

EX2026 Altera, Stratix II Device Handbook (2005-01)

EX2027 Altera White Paper on Signal Integrity

EX2028 Hortaleza US20040183167A1

EX2029 Bauer CV

EX2030 IPR2021-00966 Bauer Declaration

EX2031 2021-12-29 Dr David Choi Transcript

EX2032 2021-12-30 Dr David Choi Transcript

EX2033 Choi Errata

EX2100 Dr David Choi_2100

EX2101 Dr David Choi_2101

EX2102 Dr David Choi_2102

EX2103 Dr David Choi_2103

EX2104 Dr David Choi_2104

Notice of Stipulation to Modify Due Date 1

Notice of Deposition of Dr. David Choi

Notice of Stipulation to Modify Due Date 1

Institution Decision: DECISION Granting Institution of Inter Partes Review 35 U.S.C. § 314 Dismissing Renewed Motion for Joinder 35 U.S.C. § 315(c); 37 C.F.R. § 42.122(b)

Order: SCHEDULING ORDER

Patent Owner Preliminary Response

Ex. 2002 Elenius Declaration

Ex. 2003 Peter Elenius CV - 2020

Ex. 2004 Centralized CM ECF LIVE

Ex. 2005 2020.12.04 NXP Prelim. Invalid. Contentions Cover Pleading

Ex. 2019 Flip Chip BGA Reference Guide

Ex. 2028 Hortaleza US20040183167

Reply in support of renewed motion for joinder

PATENT OWNER���S OPPOSITION TO PETITIONERS��� RENEWED MOTION FOR JOINDER TO INTER PARTES REVIEW

2021-05-25 NXP Email to Board

Patent Owner's Opposition to Renewed Motion for Joinder

Ex 2001 Email to Board in NXP IPRs (2021.05.25)

Renewed motion for joinder

Transcript of call with Board on 6-9-21

EXPUNGED

Conduct of the Proceeding Dismissing Petitioner's Motion for Joinder as Moot

PO's Power of Attorney

PO's Mandatory Notice

Notice of Accord Filing Date

PETITION FOR INTER PARTES REVIEW UNDER 35 U.S.C. 311-319 AND 37 C.F.R. 42

Hall et al., U.S. Patent No. 8,049,340

Prosecution History File Wrapper of the 340 Patent

Declaration of David Choi, Ph.D.

Chin et al., U.S. Patent No. 6,765,298

Chin et al., U.S. Patent Publication 2003/0107056

Oggioni et al., U.S. Patent No. 6,717,255

Hsu et al., U.S. Patent Application Publication 2005/0037601

Motorola - MC92600 Quad 1.25 Gbaud Reduced Interface SERDES Reference Manual

Hall et al., High-Speed Digital System Design - A Handbook of Interconnect Theory and Design Practices (John Wiley & Sons 2000)

Exhibit A-1 of Plaintiff's Preliminary Infringement Contentions, Bell Semiconductor, LLC v. Microchip Technology, Inc., No. 6:20-cv-0296 (W.D. Tex.)

Barr et al., U.S. Patent Application Publication 2005/0011676

Internet Archive (Motorola Gigabit SERDES Transceivers)

Internet Archive (Motorola - MC92600 Quad 1.25 Gbaud Reduced Interface SERDES Reference Manual)

Burggraaf, P., "Status 1998," Integrated Circuit Engineering Corporation (1998)

Semiconductor Packaging: A DoD Dual Use Technology Assessment Final Report, Department of Defense, 1997

Fairchild Semiconductor - IC Package Designs and IC Signal Performance

Havinga, Mobile Multimedia Systems, University of Twente (2000)

Bogatin, Roadmaps of Packaging Technology, Integrated Circuit Engineering Corporation

Sedra et al., "Microelectronic Circuits," Saunders College Publishing (3d ed. 1991)

Thomas et al., "The Analysis and Design of Linear Circuits," Prentice Hall (1994)

Johnson, "Parasitic pads," EDN (Aug. 17, 2000)

Adrizzoni, "A Practical Guide to High-Speed Printed-Circuit-Board Layout," Analog Dialogue (Sept. 2005)

"Motorola Completes Separation of Freescale Semiconductor" (Dec. 2, 2004)

Chin, "Printed Circuit Board Design Techniques for DS40MB200" (National Semiconductor Oct. 2005)

Declaration of Jacob Robert Munford

Shafer, U.S. Patent No. 6,908,340

Declaration of Truman Fenton

Scheduling Order, Bell Semiconductor, LLC v. NXP Semiconductors N.V. et al., Civil Action No. 1:20-cv-00611, Dkt. 45 (W.D. Tex. Nov. 23, 2020)

Internet Archive Declaration supporting Ex. 1008

Hall et al., High-Speed Digital System Design - A Handbook of Interconnect Theory and Design Practices (John Wiley & Sons 2000) (excerpts of hardcopy textbook supporting Ex. 1009)

Power of Attorney

Motion for Joinder to IPR2021-00148