The detailed information for PTAB case with proceeding number IPR2021-01123 filed by Renesas Electronics America Inc. et al. against Bell Semiconductor LLC et al. on Jun 14, 2021. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.

Case Details

Proceeding Number
IPR2021-01123
Filing Date
Jun 14, 2021
Petitioner
Renesas Electronics America Inc. et al.
Respondent
Bell Semiconductor LLC et al.
Status
Terminated-Settled
Respondent Application Number
13252632
Respondent Tech Center
2800
Respondent Patent Number
8288269
Termination Date
Aug 6, 2021

Proceeding Documents

The table below shows documents filed in the case, listing each document name, filing date, document type, and filing party. Tracking these filings indicates the activity of the parties involved in the case, and the types of documents filed can provide insights into the legal strategies being employed.


Document NameFiling DateCategoryFiling Party

Alert me when new update on this case

Notice of Refund

Aug 10, 2021PAPERBOARD

Settlement Prior to Institution of Trial 37 C.F.R. sec. 42.74

Aug 6, 2021PAPERBOARD

PETITIONER'S REQUEST FOR REFUND OF POST-INSTITUTION FEES

Aug 6, 2021PAPERPETITIONER

JOINT MOTION TO TERMINATE PROCEEDING

Jul 22, 2021PAPERPETITIONER

CONFIDENTIAL SETTLEMENT AGREEMENT

Jul 22, 2021EXHIBITPETITIONER

REQUEST TO KEEP SETTLEMENT AGREEMENT CONFIDENTIAL AND SEPARATE

Jul 22, 2021PAPERPETITIONER

Patent Owner's Opposition to Motion for Joinder

Jul 14, 2021PAPERPATENT OWNER

Patent Owner's Mandatory Notice

Jul 6, 2021PAPERPATENT OWNER

Patent Owner's Power of Attorney

Jul 6, 2021PAPERPATENT OWNER

Notice of Accord Filing Date

Jun 16, 2021PAPERBOARD

Power of Attorney

Jun 14, 2021PAPERPETITIONER

Petition for Inter Partes Review

Jun 14, 2021PAPERPETITIONER

The '269 Patent

Jun 14, 2021EXHIBITPETITIONER

Declaration of David Choi, Ph.D.

Jun 14, 2021EXHIBITPETITIONER

Chin Patent

Jun 14, 2021EXHIBITPETITIONER

Chin Publication

Jun 14, 2021EXHIBITPETITIONER

Oggioni Patent

Jun 14, 2021EXHIBITPETITIONER

Blair Patent

Jun 14, 2021EXHIBITPETITIONER

Motorola - MC92600 Quad 1.25 Gbaud SERDES User's Manual

Jun 14, 2021EXHIBITPETITIONER

Hall et al., High-Speed

Jun 14, 2021EXHIBITPETITIONER

Preliminary Infringement Contentions

Jun 14, 2021EXHIBITPETITIONER

Declaration of Jacob Robert Munford

Jun 14, 2021EXHIBITPETITIONER

Motorola Gigabit SERDES Transceivers Screenshot

Jun 14, 2021EXHIBITPETITIONER

MC92600 User's Manual Screenshot

Jun 14, 2021EXHIBITPETITIONER

Burggraaf, Status 1998

Jun 14, 2021EXHIBITPETITIONER

DoD, Semiconductor Packaging

Jun 14, 2021EXHIBITPETITIONER

Clark, IC Package Design's Effects on Signal Integrity

Jun 14, 2021EXHIBITPETITIONER

Havinga, Design Techniques for Energy Efficient and Low-power Systems

Jun 14, 2021EXHIBITPETITIONER

Bogatin, Roadmaps of Packaging Technology

Jun 14, 2021EXHIBITPETITIONER

Sedra et al., Microelectronic Circuits

Jun 14, 2021EXHIBITPETITIONER

Thomas et al., The Analysis and Design of Linear Circuits

Jun 14, 2021EXHIBITPETITIONER

Johnson, Parasitic Pads

Jun 14, 2021EXHIBITPETITIONER

Adrizzoni, A Practical Guide to High-Speed Printed-Circuit-Board Layout

Jun 14, 2021EXHIBITPETITIONER

Motorola Completes Separation of Freescale Semiconductor

Jun 14, 2021EXHIBITPETITIONER

Chin, Printed Circuit Board Design Techniques for DS40MB200

Jun 14, 2021EXHIBITPETITIONER

The '340 Patent

Jun 14, 2021EXHIBITPETITIONER

Shafer Patent

Jun 14, 2021EXHIBITPETITIONER

Declaration of Liang Huang

Jun 14, 2021EXHIBITPETITIONER

Scheduling Order, Civil Action No. 19-cv-2155-LPS (D. Del.)

Jun 14, 2021EXHIBITPETITIONER

Internet Archive Declaration

Jun 14, 2021EXHIBITPETITIONER

Hall et al., High-Speed (Hardcopy Excerpts)

Jun 14, 2021EXHIBITPETITIONER

Motion for Joinder to Inter Parties Review

Jun 14, 2021PAPERPETITIONER