IP Verse

Samsung Electronics Co., Ltd. et al. vs ImberaTek LLC et al.

The detailed information for PTAB case with proceeding number IPR2023-00069 filed by Samsung Electronics Co., Ltd. et al. against ImberaTek LLC et al. on Oct 18, 2022. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.

Case Details

Proceeding Number: IPR2023-00069
Filing Date: Oct 18, 2022
Petitioner: Samsung Electronics Co., Ltd. et al.
Respondent: ImberaTek LLC et al.
Status: Terminated-Settled
Respondent Application Number: 11907795
Respondent Tech Center: 2800
Respondent Patent Number: 7609527
Termination Date: Jan 24, 2023

Proceeding Documents

The table below shows documents filed in the case, listing each document name, filing date, document type, and filing party. Tracking these filings indicates the activity of the parties involved in the case, and the types of documents filed can provide insights into the legal strategies being employed.

Show Exhibit Documents

Document Name	Filing Date	Category	Filing Party
Alert me when new update on this case
Notice: refund approved	Jan 31, 2023	PAPER	BOARD
Termination Decision: Pre-DI settlement	Jan 24, 2023	PAPER	BOARD
Petitioner’s Request for Refund of Post-institution Fees	Jan 24, 2023	PAPER	PETITIONER
Joint Motion to Dismiss Inter Partes Review Before Institution	Jan 13, 2023	PAPER	PETITIONER
Joint Request to Keep Separate Pursuant to 35 U.S.C. § 317(b) and 37 C.F.R. § 42.74(c)	Jan 13, 2023	PAPER	PETITIONER
Settlement and Patent License Agreement	Jan 13, 2023	EXHIBIT	PETITIONER
Confirmatory Letter	Jan 13, 2023	EXHIBIT	PETITIONER
Notice : Power of Attorney	Oct 26, 2022	PAPER	PATENT OWNER
Notice : Mandatory Notice	Oct 26, 2022	PAPER	PATENT OWNER
Notice: Notice filing date accorded	Oct 25, 2022	PAPER	BOARD
Samsung Electronics Co. Ltd.'s Power of Attorney	Oct 18, 2022	PAPER	PETITIONER
Samsung Electronics America, Inc's Power of Attorney	Oct 18, 2022	PAPER	PETITIONER
Samsung Austin Semiconductor, LLC's Power of Attorney	Oct 18, 2022	PAPER	PETITIONER
U.S. Patent No. 7,609,527 (“the ’527 Patent”)	Oct 18, 2022	EXHIBIT	PETITIONER
Declaration of Dr. Sanjay Banerjee	Oct 18, 2022	EXHIBIT	PETITIONER
Curriculum Vitae of Dr. Sanjay Banerjee	Oct 18, 2022	EXHIBIT	PETITIONER
Prosecution History of U.S. Patent No. 7,609,527 (App. No. 11/907,795)	Oct 18, 2022	EXHIBIT	PETITIONER
U.S. Patent No. 5,616,520 (“Nishiuma”)	Oct 18, 2022	EXHIBIT	PETITIONER
U.S. Patent Application Publication No. US2002/0149117 (“Shibata”)	Oct 18, 2022	EXHIBIT	PETITIONER
U.S. Patent Publication No. US2002/0159242 (“Nakatani”)	Oct 18, 2022	EXHIBIT	PETITIONER
Certified Translation of Japanese Patent App. Publication No. JP2002-16327	Oct 18, 2022	EXHIBIT	PETITIONER
Japanese Patent Application Publication No. JP2002-16327 (“Eiji”)	Oct 18, 2022	EXHIBIT	PETITIONER
Certified Translation of Japanese Patent App. Publication No. JP2002-83926	Oct 18, 2022	EXHIBIT	PETITIONER
Japanese Patent Application Publication No. JP2002-83926	Oct 18, 2022	EXHIBIT	PETITIONER
Japanese Patent Application Publication No. JPH08-213425 (“Nakaoka”)	Oct 18, 2022	EXHIBIT	PETITIONER
U.S. Patent No. 6,038,133 to Nakatani et al. (“Nakatani-II”)	Oct 18, 2022	EXHIBIT	PETITIONER
Combined Civil and Criminal Federal Court Management Statistics	Oct 18, 2022	EXHIBIT	PETITIONER
U.S. Patent No. 6,476,503 (“Imamura”)	Oct 18, 2022	EXHIBIT	PETITIONER
U.S. Patent Application Publication No. US2008/0043441A1 (“Tuominen”)	Oct 18, 2022	EXHIBIT	PETITIONER
Claim Mapping Table	Oct 18, 2022	EXHIBIT	PETITIONER
Dielectric Materials in Semiconductor Devices	Oct 18, 2022	EXHIBIT	PETITIONER
3D-Integration: Trends and Opportunities – An Overview	Oct 18, 2022	EXHIBIT	PETITIONER
Solderless Interconnection and Packaging Technique	Oct 18, 2022	EXHIBIT	PETITIONER
U.S. Patent Application Publication No. 2001/0026010 (“Horiuchi”)	Oct 18, 2022	EXHIBIT	PETITIONER
U.S. Patent No. 5,250,843 (“Eichelberger”)	Oct 18, 2022	EXHIBIT	PETITIONER
U.S. Patent No. 6,324,067 (“Nishiyama”)	Oct 18, 2022	EXHIBIT	PETITIONER
European Patent Application No. EP1069616 (“Kurita”)	Oct 18, 2022	EXHIBIT	PETITIONER
Certified Translation of WO1996012296 (“Suwa”)	Oct 18, 2022	EXHIBIT	PETITIONER
International Publication No. WO1996012296 (“Suwa”)	Oct 18, 2022	EXHIBIT	PETITIONER
U.S. Patent No. 6,351,031 (“Iijima”)	Oct 18, 2022	EXHIBIT	PETITIONER
Hargrave’s Communications Dictionary	Oct 18, 2022	EXHIBIT	PETITIONER
Computer Desktop Encyclopedia	Oct 18, 2022	EXHIBIT	PETITIONER
Modern Dictionary of Electronics	Oct 18, 2022	EXHIBIT	PETITIONER
European Patent Application Publication No. EP1225631 (“Vinciarelli”)	Oct 18, 2022	EXHIBIT	PETITIONER
U.S. Patent No. 7,183,132 (“Nakamura”)	Oct 18, 2022	EXHIBIT	PETITIONER
Mechanical and Structural Properties of Electrodeposited Copper	Oct 18, 2022	EXHIBIT	PETITIONER
Journal of Applied Physics	Oct 18, 2022	EXHIBIT	PETITIONER
Department of Defense Test Method Standard: Test Procedure for Microcircuit	Oct 18, 2022	EXHIBIT	PETITIONER
Petition for Inter Partes Review of U.S. Patent No. 7,609,527	Oct 18, 2022	PAPER	PETITIONER
Certified Translation of Japanese Patent App. Publication No. JPH08-213425	Oct 18, 2022	EXHIBIT	PETITIONER