The detailed information for PTAB case with proceeding number IPR2023-00105 filed by MICRON TECHNOLOGY, INC. against Katana Silicon Technologies LLC on Nov 15, 2022. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.

Case Details

Proceeding Number
IPR2023-00105
Filing Date
Nov 15, 2022
Petitioner
MICRON TECHNOLOGY, INC.
Respondent
Katana Silicon Technologies LLC
Status
Institution Denied
Respondent Application Number
09873338
Respondent Tech Center
2800
Respondent Patent Number
6731013
Institution Decision Date
Jun 14, 2023
Termination Date
Jun 14, 2023

Proceeding Documents

The table below shows documents filed in the case, listing each document name, filing date, document type, and filing party. Tracking these filings indicates the activity of the parties involved in the case, and the types of documents filed can provide insights into the legal strategies being employed.


Document NameFiling DateCategoryFiling Party

Alert me when new update on this case

Notice: refund approved

Dec 12, 2023PAPERBOARD

Petitioner's Request for Refund of Post-Institution Fees

Nov 28, 2023PAPERPETITIONER

Rehearing:Decision on Request for Rehearing

Sep 26, 2023PAPERBOARD

Petitioner's Updated Mandatory Notices

Jul 21, 2023PAPERPETITIONER

Petitioner's Supplemental POA

Jul 21, 2023PAPERPETITIONER

Petitioner Micron Technology, Inc.’s Request for Rehearing Under 37 C.F.R. 42.71(c)-(d)

Jul 14, 2023PAPERPETITIONER

Denying Institution of Inter Partes Review 35 U.S.C. 314

Jun 14, 2023PAPERBOARD

Patent Owner Preliminary Response

Mar 20, 2023PAPERPATENT OWNER

Ex. 2001 - Declaration of Peter Elenius

Mar 20, 2023EXHIBITPATENT OWNER

Ex. 2002 - Peter Elenius CV

Mar 20, 2023EXHIBITPATENT OWNER

Ex. 2003 - Lau & Lee, Chip Scale Package, Ch 15

Mar 20, 2023EXHIBITPATENT OWNER

Ex. 2004 - Lau & Lee, Chip Scale Package, Ch 17

Mar 20, 2023EXHIBITPATENT OWNER

Ex. 2005 - Lau & Lee, Chip Scale Package, Ch 19

Mar 20, 2023EXHIBITPATENT OWNER

Ex. 2006 - Lau & Lee, Chip Scale Package, Ch 28

Mar 20, 2023EXHIBITPATENT OWNER

Ex. 2007 - Patent Search Support Structures

Mar 20, 2023EXHIBITPATENT OWNER

KATANA SILICON TECHNOLOGIES LLC’S MANDATORY NOTICES

Mar 10, 2023PAPERPATENT OWNER

KATANA SILICON TECHNOLOGIES LLC’S POWER OF ATTORNEY

Mar 10, 2023PAPERPATENT OWNER

Notice : Mandatory Notice

Dec 23, 2022PAPERPATENT OWNER

Notice : Power of Attorney

Dec 23, 2022PAPERPATENT OWNER

Notice: Notice filing date accorded

Dec 19, 2022PAPERBOARD

Ex. 1001 - US6731013 (Juso)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1002 - Declaration of Jeffrey Suhling

Nov 15, 2022EXHIBITPETITIONER

Ex. 1003 - US6731013 File History

Nov 15, 2022EXHIBITPETITIONER

Ex. 1004 - US5581122 (Chao)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1005 - JP Unexamined App. Pub. 1996 288316 (Toyoda)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1006 - JP Unexamined App. Pub. 1997 121002 (Aoki)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1007 - JP Unexamined App. Pub. 1999 204720 (Fukui)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1008 - US5656550 (Tsuji)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1009 - U.K. App. Pub. GB2093401 (Miura)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1010 - JP Unexamined App. Pub. 1999 8474 (Tokuno)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1011 - US6028358 (Suzuki)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1012 - US5854507 (Miremadi et al.)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1013 - US5639695 (Jones)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1014 - Rymaszewski, Ch. 1 (Microelectronics Packaging - An Overview)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1015 - Goldmann, Ch. 5 (Package Reliability)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1016 - Totta, Ch. 8 (Chip-to-Package Interconnections)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1017 - Pecht, Ch. 10 (Plastic Packaging)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1018 - Seraphim, Ch. 17 (Printed-Wiring Board Packaging)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1019 - Massenat, High-density package, cofired, multi-chip module, 3-D,

Nov 15, 2022EXHIBITPETITIONER

Ex. 1020 - Tuckerman, Laminated Memory (IEEE 1994)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1021 - US5804004 (Tuckerman et al.)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1022 - US2771663 (Henry)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1023 - US5247423 (Lin et al.)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1024 - US5532906 (Hanari et al.)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1025 - Hahn, High Power Multichip Modules Employing the Planar Embeddin

Nov 15, 2022EXHIBITPETITIONER

Ex. 1026 - US5909057 (McCormick et al.)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1027 - US6011304 (Mertol)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1028 - US5841194 (Tsukamoto)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1029 - US6195264 (Lauffer et al.)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1030 - US5241133 (Mullen, III et al.)

Nov 15, 2022EXHIBITPETITIONER

Ex. 1031 - Lau Chapter 9

Nov 15, 2022EXHIBITPETITIONER

Ex. 1032 - Lau Chapter 10

Nov 15, 2022EXHIBITPETITIONER

Petition : as filed

Nov 15, 2022PAPERPETITIONER

Notice : Power of Attorney

Nov 15, 2022PAPERPETITIONER