Intel Corporation vs BeSang Inc.

Petitioner's Notice of Appeal

Final Written Decision Determining No Challenged Claims Unpatentable 35 U.S.C. § 318(a) Denying-in-Part and Dismissing-in-Part Patent Owner’s Motion to Exclude 37 C.F.R. § 42.71

Final Written Decision: JUDGMENT Final Written Decision Determining No Challenged Claims Unpatentable 35 U.S.C. § 318(a) Denying-in-Part and Dismissing-in-Part Patent Owner’s Motion to Exclude 37 C.F.R. § 42.71

Other: Hearing transcript

Patent Owner's Updated Exhibit List

Patent Owner’s Demonstratives for Oral Hearing

Petitioner's Demonstrative Exhibits

LEAP Practitioner Request and Verification Form (Patent Owner)

Petitioner's Updated Power of Attorney

Petitioner's Updated Mandatory Notices

LEAP Practitioner Request and Verification Form (Patent Owner)

Patent Owner's Reply in Support of Motion to Exclude Evidence

Exhibit 3001

Petitioner's Opposition to Patent Owner's Motion to Exclude Evidence

ORDER Setting Oral Argument

Patent Owner's Motion to Exclude Evidence

Petitioner's Request for Oral Argument

Patent Owner's Request for Oral Argument

Patent Owner's Sur-Reply

Dr. Carl Sechen Depo. Transcript (July 10, 2024)

Patent Owner's Notice of Deposition of Dr. Carl Sechen

Patent Owner's Objections to Evidence

Exhibit 1038 - Docket, Besang Inc. v. Intel Corp., Case No. 3:23-cv-00113 (D. Or.)

Exhibit 1039 - Updated Docket, BeSang, Inc. v. Micron Tech, Inc., Case No. 2:23- cv-00028 (E.D. Tex.)

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Exhibit 1041 - U. Gosële & Q. Y. Tong, Semiconductor Wafer Bonding

EXPUNGED

Exhibit 1043 - Wafter Bonding for Three Dimensional (3D) Integration

Exhibit 1044 - Wafer bonding using low-k dielectrics as bonding glue in three-dimensional integration

Exhibit 1045 - U.S. Patent No. 6,054,370

EXPUNGED

Exhibit 1047 - Model-based uniformity control for epitaxial silicon deposition

Exhibit 1048 - Technology and applications of amorphous silicon

Exhibit 1049 - U.S. Patent No. 6,544,837

Exhibit 1050 - Low-temperature wafer-level transfer bonding

Exhibit 1051 - Bipolar and MOS analog integrated circuit design

Exhibit 1052 - U.S. Patent No. 5,978,258

Exhibit 1053 - U.S. Patent No. 5,714,393

EXPUNGED

Exhibit 1055 - Electrical integrity of state-of-the-art 0.13m SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication

Exhibit 1057 - U.S. Patent No. 5,661,408

Petitioner's Reply

Exhibit 1056 - Deposition transcript of Steven Przybylski

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Exhibit 1037 - Reply Declaration of Dr. Carl Sechen

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Petitioner's Amended Notice of Deposition

Petitioner's Notice of Deposition

Petitioner's Objections to Patent Owner's Evidence

Patent Owner's Response to Petition for Inter Partes Review

Series Circuit v. Parallel Circuit

Itoh, VLSI Memory Chip Design (2001) (excerpts)

Batude, 3-D Sequential Information (2012)

Dr. Jack C. Lee Depo. Transcript (Feb. 6, 2024)

Declaration of Steven A. Przybylski

CV of Steven A. Przybylski

Webster's Dictionary excerpt (2003)

Random House Dictionary excerpt (1997)

May, Fundamentals of Semiconductor Manufacturing (2006)(excerpts)

Dr. Carl Sechen Depo. Transcript (Feb. 27, 2024)

Endoh, Novel Ultrahigh-Density Flash Memory (Apr. 2003)

Sakuraba, New Three-Dimensional High-Density (2004)

U.S. Patent No. 6,982,905 (Nguyen)

Groeseneken, Basics of Nonvolatile Semiconductor Memory Devices

Harrison, Current Sources & Voltage References (2005) (excerpts)

Electrical Engineering Handbook (2005) (excerpts)

Joint Stipulation to Modify Due Dates 1, 2, and 3

Patent Owner's Notice of Deposition of Dr. Carl Sechen

Patent Owner's Objections to Evidence

Granting Institution of Inter Partes Review 35 U.S.C. § 314

SCHEDULING ORDER

Patent Owner's Updated Exhibit List

Opinion and Order, BeSang v. Intel (D. Or. Oct. 10, 2023)

Petitioner's Updated Mandatory Notices

Petitioner's Power of Attorney

Patent Owner's Preliminary Sur-Reply

9-22-2023 Email from Board Authorizing Preliminary Reply and Sur-Reply Briefing

Intel's Motion to Extend Temporary Stay, BeSang v. Intel (D. Or. Sept. 15, 2023)

Preliminary Reply to Patent Owner's Preliminary Response

Ex. 1032 Complaint BeSang Inc. v. Micron Tech. Inc.

Ex. 1033 Letter to Counsel for BeSang

Ex. 1034 Notice of Sotera Stipulation Filed by Intel Corporation

Ex. 1035 Email Court Correspondence Confirming Stay of BeSang Inc. v. Intel Corp.

Ex. 1036 Updated Docket, BeSang Inc. v. Micron Technology, Inc

Patent Owner's Preliminary Response

First Amended Docket Control Order, BeSang v. Micron (E.D. Tex. June 21, 2023)

Docket Re BeSang v. Micron (E.D. Tex.) (as of Sept. 14, 2023)

Docket Re BeSang v. Intel (D. Or.) (as of Sept. 14, 2023)

Defs' Patent L.R. 3-3 Invalidity Contentions, BeSang v. Micron (E.D. Tex. July 11, 2023)

Mutschler, Stanford, Korean nanofab center, EDN (Aug. 13, 2008)

Press Release, Micron and Intel Unveil New 3D NAND Flash Memory (Mar. 26, 2015)

Clarke, EE Times updates list of emerging startups (Feb. 2, 2009)

GSA Forum, Exploring the Potential of Emerging Semiconductor Technology (June 2011)

Frost & Sullivan, Looking Beyond TSV For 3D IC Technology (Mar. 2009)

Press Release, Micron and Intel Extend their Leadership (May 21, 2018)

Micron Unveils 3D NAND (Mar. 26, 2015) (video file)

Radar Scope, Semiconductor Times (Apr. 2007)

1-29-2007 Email from Peter Feeley to BeSang

7-30-2007 Email exchange between Tom Arnold, Sang-Yun Lee, and others

Patrizio, Impact of Intel and Micron, Network World (Jan. 12, 2018)

Intel’s Invalidity Contentions, BeSang v. Intel (D. Or. July 14, 2023)

USPTO Assignment Abstract for U.S. Patent App. Pub. No. 2003/0157748

US District Courts Federal Court Management Statistics (June 30, 2023)

Notice: Notice filing date accorded

Notice : Mandatory Notice

Notice : Power of Attorney

Petitioner's Power of Attorney

Ex. 1001 - US Pat. No. 7378702

Ex. 1002 - 702 Patent File History

Ex. 1003 - Declaration of Dr. Carl Sechen

Ex. 1004 - CV of Dr. Carl Sechen

Ex. 1005 - US Pat. No. 7052941

Ex. 1006 - 941 Patent File History

Ex. 1007 - US Pat. App. Pub. No. 20020028541 (Lee)

Ex. 1008 - US Pat. App. Pub. No. 20030157748 (Kim)

Ex. 1009 - Aspar et al.

Ex. 1010 - US Pat. No. 6034882 (Johnson)

Ex. 1011 - US Pat. No. 5571730 (Park)

Ex. 1012 - US Pat. App. Pub. No. 20020154556 (Endoh)_Part1of7

Ex. 1012 - US Pat. App. Pub. No. 20020154556 (Endoh)_Part2of7

Ex. 1012 - US Pat. App. Pub. No. 20020154556 (Endoh)_Part3of7

Ex. 1012 - US Pat. App. Pub. No. 20020154556 (Endoh)_Part4of7

Ex. 1012 - US Pat. App. Pub. No. 20020154556 (Endoh)_Part5of7

Ex. 1012 - US Pat. App. Pub. No. 20020154556 (Endoh)_Part6of7

Ex. 1012 - US Pat. App. Pub. No. 20020154556 (Endoh)_Part7of7

Ex. 1013 - BeSang v. Intel Complaint

Ex. 1014 - Silicon Processing, Stanley Wolf, Vol. 1 - Chapters 1,7,11,16,17

Ex. 1015 - Silicon Processing, Stanley Wolf, Vol. 4 - Chapters 11 and 12

Ex. 1016 - US Pat. No. 6355501 (Fung)

Ex. 1017 - US Pat. No. 5414288 (Fitch)

Ex. 1018 - US Pat. No. 6027975 (Hergenrother)

Ex. 1019 - US Pat. No. 6337247 (Schulz)

Ex. 1020 - US Pat. No. 6449186 (Noble)

Ex. 1021 - US Pat. No. 6943067 (Greenlaw)

Ex. 1022 - IEEE Dictionary (2000)

Ex. 1023 - US Pat. No. 5882987 (Srikrishnan)

Ex. 1024 - Maleville - Multiple SOI Layers by Multiple Smart-Cut Transfers

Ex. 1025 - US5615148 (Yamamura)

Ex. 1026 - US5544103 (Lambertson)

Ex. 1027 - US6381173 (Zatelli)

Ex. 1028 - Declaration of J. Munford

Ex. 1029 - Rule 16 Conference Minutes D. Or. 23-cv-00113 dckt 000045

Ex. 1030 - Oregon from Time to Trial Stats Mar 2023

Ex. 1031 - Excerpts from US Pat. App. Pub. No. 20020154556 (Endoh)(EX1012)

Petition for Inter Partes Review