The detailed information for PTAB case with proceeding number IPR2024-00974 filed by Samsung Electronics Co., Ltd. et al. against Redstone Logics LLC on May 31, 2024. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.

Case Details

Proceeding Number
IPR2024-00974
Filing Date
May 31, 2024
Petitioner
Samsung Electronics Co., Ltd. et al.
Respondent
Redstone Logics LLC
Status
Terminated-Settled
Respondent Application Number
13739995
Respondent Tech Center
2800
Respondent Patent Number
9253925
Termination Date
Nov 7, 2024

Proceeding Documents

The table below shows documents filed in the case, listing each document name, filing date, document type, and filing party. Tracking these filings indicates the activity of the parties involved in the case, and the types of documents filed can provide insights into the legal strategies being employed.


Document NameFiling DateCategoryFiling Party

Alert me when new update on this case

Notice: refund approved

Nov 14, 2024PAPERBOARD

Petitioners' Request for Refund

Nov 12, 2024PAPERPETITIONER

Settlement Prior to Institution of Trial and ORDER Granting Joint Request to Treat Settlement Agreement as Business Confidential Information 37 C.F.R. § 42.74

Nov 7, 2024PAPERBOARD

Ex. 3001

Nov 5, 2024EXHIBITBOARD

Joint Motion to Terminate the Proceeding

Nov 4, 2024PAPERPETITIONER

Ex. 1040 CONFIDENTIAL Release Agreement

Nov 4, 2024EXHIBITPETITIONER

Notice : Mandatory Notice

Jun 28, 2024PAPERPATENT OWNER

Notice : Power of Attorney

Jun 28, 2024PAPERPATENT OWNER

Notice: Notice filing date accorded

Jun 14, 2024PAPERBOARD

Petition : as filed

May 31, 2024PAPERPETITIONER

Petitioner Power of Attorney - SEC

May 31, 2024PAPERPETITIONER

Petitioner Power of Attorney - SEA

May 31, 2024PAPERPETITIONER

Ex. 1001 U.S. Patent No. 9,253,925

May 31, 2024EXHIBITPETITIONER

Ex. 1002 Certified File History for U.S. Patent No. 9,253,925

May 31, 2024EXHIBITPETITIONER

Ex. 1003 Declaration of Leland J. Spangler, Ph.D.

May 31, 2024EXHIBITPETITIONER

Ex. 1004 US Patent No. 7,180,173 (Kuo)

May 31, 2024EXHIBITPETITIONER

Ex. 1005 US Patent Publication 20110133236 (Nozaki)

May 31, 2024EXHIBITPETITIONER

Ex. 1006 US Patent Publication 20050039879 (Hanai)

May 31, 2024EXHIBITPETITIONER

Ex. 1007 Redstone Preliminary Disclosure of Asserted Claims and Infringemen

May 31, 2024EXHIBITPETITIONER

Ex. 1008 Claim Chart for U.S. Patent No. 9,253,925

May 31, 2024EXHIBITPETITIONER

Ex. 1009 US Patent Publication 20120206882 (Mohammed)

May 31, 2024EXHIBITPETITIONER

Ex. 1010 First Amended Scheduling Order

May 31, 2024EXHIBITPETITIONER

Ex. 1011 Pierson - Handbook of carbon, graphite (1993)

May 31, 2024EXHIBITPETITIONER

Ex. 1012 Wu - Graphenes as a material for electronics (2007)

May 31, 2024EXHIBITPETITIONER

Ex. 1013 Introduction to Aluminum, MEPTEC (2012)

May 31, 2024EXHIBITPETITIONER

Ex. 1014 Blackman - Stress Recrystallization of Graphite (1962)

May 31, 2024EXHIBITPETITIONER

Ex. 1015 Tong - Advanced Materials for Thermal Management (2011)

May 31, 2024EXHIBITPETITIONER

Ex. 1016 The Heat is On 2012, Thermal Management Symposium 2012

May 31, 2024EXHIBITPETITIONER

Ex. 1017 Lemak - Pyrolytic Graphite Heat Spreader (2006)

May 31, 2024EXHIBITPETITIONER

Ex. 1018 US Patent No. 568,323 (Acheson)

May 31, 2024EXHIBITPETITIONER

Ex. 1019 Chung - Performance of isotropic and anisotropic (2012)

May 31, 2024EXHIBITPETITIONER

Ex. 1020 Norley -The development of a natural graphite (2001)

May 31, 2024EXHIBITPETITIONER

Ex. 1021 Shives - Comparative Thermal Performance Evaluation (2004)

May 31, 2024EXHIBITPETITIONER

Ex. 1022 Lakhar - Optimization of Graphite Heat (2009)

May 31, 2024EXHIBITPETITIONER

Ex. 1023 iMX6 Thermal Management, Freescale AN4579 (2012)

May 31, 2024EXHIBITPETITIONER

Ex. 1024 Smalc - Innovations in Flexible Graphite (2012)

May 31, 2024EXHIBITPETITIONER

Ex. 1025 U.S. Patent No. 5,224,030 (Banks)

May 31, 2024EXHIBITPETITIONER

Ex. 1026 U.S. Patent No. 5,902,762 (Mercuri)

May 31, 2024EXHIBITPETITIONER

Ex. 1027 U.S. Patent No. 5,991,155 (Kobayashi)

May 31, 2024EXHIBITPETITIONER

Ex. 1028 U.S. Patent No. 7,292,441 (Smalc)

May 31, 2024EXHIBITPETITIONER

Ex. 1029 U.S. Patent No. 6,404,070 (Higashi)

May 31, 2024EXHIBITPETITIONER

Ex. 1030 U.S. Patent No. 4,849,858 (Grapes)

May 31, 2024EXHIBITPETITIONER

Ex. 1031 iFixit - BlackBerry PlayBook Teardown

May 31, 2024EXHIBITPETITIONER

Ex. 1032 TI OMAP4xxx POP SMT Design Guideline

May 31, 2024EXHIBITPETITIONER

Ex. 1033 e.MMC 4.41 IF SanDisk Flash Memory Datasheet

May 31, 2024EXHIBITPETITIONER

Ex. 1034 Texas Instruments, TWL6030 Fully Integrated Power Management

May 31, 2024EXHIBITPETITIONER

Ex. 1035 vEpotek H20E Data Sheet

May 31, 2024EXHIBITPETITIONER

Ex. 1036 Inoue - Physical Factors Determining Thermal

May 31, 2024EXHIBITPETITIONER

Ex. 1037 Kandasamy - Interface thermal characteristics

May 31, 2024EXHIBITPETITIONER

Ex. 1038 RIM to release Blackberry PlayBook

May 31, 2024EXHIBITPETITIONER

Ex. 1039 Prasher - Thermal Interface Materials

May 31, 2024EXHIBITPETITIONER