IP Verse

Taiwan Semiconductor Manufacturing Company Ltd. - IPR2025-01210

The detailed information for PTAB case with proceeding number IPR2025-01210 filed by Taiwan Semiconductor Manufacturing Company Ltd. on Jul 15, 2025. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.

Case Details

Proceeding Number
IPR2025-01210
Filing Date
Jul 15, 2025
Petitioner
Taiwan Semiconductor Manufacturing Company Ltd.
Status
Pending
Respondent Application Number
12241896
Respondent Tech Center
2800
Respondent Patent Number
7632751

Proceeding Documents

The table below shows documents filed in the case, listing each document name, filing date, document type, and filing party. Tracking these filings indicates the activity of the parties involved in the case, and the types of documents filed can provide insights into the legal strategies being employed.


Document NameFiling DateCategoryFiling Party

Alert me when new update on this case

Notice: Notice filing date accorded

Jul 28, 2025PAPERBOARD

U.S. Patent No. 7,632,751

Jul 15, 2025EXHIBITPETITIONER

File History of U.S. Patent No. 7,632,751

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent Publication No. 2001/0019180 to Aoyagi et al.

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent No. 5,250,465 to Iizuka et al.

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent Publication No. 2004/0173905 to Kamoshima et al.

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent No. 7,042,099 to Kurashima

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent Publication No. 2003/0005399 to Igarashi

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent No. 6,717,268 to Hau-Riege

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent No. 6,022,808 to Nogami

Jul 15, 2025EXHIBITPETITIONER

Kaanta et al., "Dual Damascene: A ULSI Wiring Technology"

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent No. 5,032,890 to Ushiku

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent No. 6,156,660 to Liu et al.

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent No. 5,798,298 to Yang

Jul 15, 2025EXHIBITPETITIONER

Bao et al., “90 nm generation Cu/CVD low-k"

Jul 15, 2025EXHIBITPETITIONER

Loke, “Process Integration Issues of Low-Permittivity Dielectrics"

Jul 15, 2025EXHIBITPETITIONER

Tu, “Recent advances on electromigration in very-large-scale-integration"

Jul 15, 2025EXHIBITPETITIONER

Huang, et al., "Numerical modeling and characterization of the stress"

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent No. 6,858,944 to Huang et al.

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent No. 6,215,189 to Toyoda et al.

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent No. 6,238,850 to Bula et al.

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent Application No. 2003/0116852 to Watanabe

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent Application No. 2004/0113238 to Hasunuma

Jul 15, 2025EXHIBITPETITIONER

Japanese Patent No. 2002-299437 (Fukazawa)

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent No. 5,885,857 to Yamaha

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent No. 6,468,894 to Yang

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent No. 6,582,976 to Watanabe

Jul 15, 2025EXHIBITPETITIONER

Middleman - Ch 8 Oxidation of Silicon

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent No. 6,717,267 (Kunikiyo)

Jul 15, 2025EXHIBITPETITIONER

U.S. Patent Application No. 2001/0030365 to Otsuka

Jul 15, 2025EXHIBITPETITIONER

Interface, Cooper, "Copper On-Chip Interconnections"

Jul 15, 2025EXHIBITPETITIONER

Wolf, Stanley, Silicon Processing for the VLSI Era Deep-Submicron Process

Jul 15, 2025EXHIBITPETITIONER

JP2000012688 to Nasu (“Nasu”) and Certified Translation

Jul 15, 2025EXHIBITPETITIONER

Petition for Inter Parties Review

Jul 15, 2025PAPERPETITIONER

Declaration of Dr. Reinhold Dauskardt

Jul 15, 2025EXHIBITPETITIONER

Petitioner's Power of Attorney

Jul 15, 2025PAPERPETITIONER