Taiwan Semiconductor Manufacturing Company Ltd. vs Advanced Integrated Circuit Process LLC - IPR2025-01210

Motion for Entry of Protective Order

Motion to Seal

EX2026 - Patent Purchase Agreement (SEALED)

PO Discretionary Denial Brief

EX2001 - AICP v. TSMC Complaint EDTX

EX2002 – AICP v. TSMC Docket Sheet

EX2003 – 2nd Amended DCO DKT 60

EX2004 -DCO DKT 46

EX2005 – 1st Amended DCO DKT 53

EX2006 – AICP Notice of Compliance DKT 45

EX2008 – Declaration of Kemper Diehl

EX2009 -Protective Order DKT 62

EX2010 – TSMC Motion to Stay Pending IPR DKT 47

EX2011 – Order Denying w/o Prejudice TSMC’s Motion to Stay Pending IPR DKT 71

EX2012 - Docket Navigator Time-to-Trial Stats

EX2013 – Lex Machina Time-to-Trial Stats

EX2014 – USPTO Memorandum

EX2016 – U.S. Patent No. 7,439,623

EX2017 – U.S. Patent No. 8,329,572

EX2018 – U.S. Patent No. 8,884,373

EX2020 – Excerpt of TSMC’s Petition for IPR in IPR2025-01211 (‘623)

EX2021 - Excerpt of TSMC’s Petition for IPR in IPR2025-01212 (‘623)

EX2022 - Excerpt of TSMC’s Petition for IPR in IPR2025-01302 (‘373)

EX2023 - Excerpt of TSMC’s Petition for IPR in IPR2025-01305 (‘572)

EX2024 – PO’s Reply to Petitioner’s Opposition to Discretionary Denial in IPR2025-00682

EX2025 – PO’s Reply to Petitioner’s Opposition to Discretionary Denial in IPR2025-00828

EX2027 – 3rd Amended DCO DKT 73

STIPULATION: 7-31-2025 Letter from K. Wheatley (counsel for TSMC) to J. Nelson et al. (counsel for AICP)

Petitioner's Updated Exhibit List

Patent Owner's Power of Attorney

Patent Owner's Mandatory Notice

Notice: Notice filing date accorded

U.S. Patent No. 7,632,751

File History of U.S. Patent No. 7,632,751

U.S. Patent Publication No. 2001/0019180 to Aoyagi et al.

U.S. Patent No. 5,250,465 to Iizuka et al.

U.S. Patent Publication No. 2004/0173905 to Kamoshima et al.

U.S. Patent No. 7,042,099 to Kurashima

U.S. Patent Publication No. 2003/0005399 to Igarashi

U.S. Patent No. 6,717,268 to Hau-Riege

U.S. Patent No. 6,022,808 to Nogami

Kaanta et al., "Dual Damascene: A ULSI Wiring Technology"

U.S. Patent No. 5,032,890 to Ushiku

U.S. Patent No. 6,156,660 to Liu et al.

U.S. Patent No. 5,798,298 to Yang

Bao et al., “90 nm generation Cu/CVD low-k"

Loke, “Process Integration Issues of Low-Permittivity Dielectrics"

Tu, “Recent advances on electromigration in very-large-scale-integration"

Huang, et al., "Numerical modeling and characterization of the stress"

U.S. Patent No. 6,858,944 to Huang et al.

U.S. Patent No. 6,215,189 to Toyoda et al.

U.S. Patent No. 6,238,850 to Bula et al.

U.S. Patent Application No. 2003/0116852 to Watanabe

U.S. Patent Application No. 2004/0113238 to Hasunuma

Japanese Patent No. 2002-299437 (Fukazawa)

U.S. Patent No. 5,885,857 to Yamaha

U.S. Patent No. 6,468,894 to Yang

U.S. Patent No. 6,582,976 to Watanabe

Middleman - Ch 8 Oxidation of Silicon

U.S. Patent No. 6,717,267 (Kunikiyo)

U.S. Patent Application No. 2001/0030365 to Otsuka

Interface, Cooper, "Copper On-Chip Interconnections"

Wolf, Stanley, Silicon Processing for the VLSI Era Deep-Submicron Process

JP2000012688 to Nasu (“Nasu”) and Certified Translation

Petition for Inter Parties Review

Declaration of Dr. Reinhold Dauskardt

Petitioner's Power of Attorney