Taiwan Semiconductor Manufacturing Company, Ltd. vs Advanced Integrated Circuit Process LLC - IPR2025-01211

Patent Assignment Record from Nuvoton Technology Corp. Japan to Advanced Integrated Circuit Process LLC, Reel: 068118 Frame: 0314-0317, United States Patent and Trademark Office (July 30, 2024)

United States District Courts – National Judicial Caseload Profile, 12-Month Period Ending Mar. 31, 2025, U.S. Courts (2025), available at https://www.uscourts.gov/sites/default/files/document/ fcms_na_distprofile0331.2025

Summary of Judge Gilstrap Patent Trials Between October 22, 2024 and October 22, 2025

Docket for 2:23-cv-00274 (E.D. Tex.)

Docket for 2:23-cv-0379 (E.D. Tex.)

Docket for 2:24-cv-00034 (E.D. Tex.)

Docket for 2:24-cv-00047 (E.D. Tex.)

Docket for 2:24-cv-00049 (E.D. Tex.)

Jeremy Bowman, Nasdaq, This 1 Number May Ensure TSMC’s Market Dominance, The Motley Fool (Aug. 17, 2024) (last visited October 22, 2025), available at https://www.nasdaq.com/articles/1-number-mayensure- tsmcs-market-dominance

CNBC Transcript: United States Commerce Secretary Howard Lutnick Speaks with CNBC’s Brian Sullivan on “The Exchange” Today, CNBC (Apr. 29. 2025) (last visited October 22, 2025), available at https://www.cnbc.com/2025/04/29/cnbc-transcriptunited- states-commerce-secretary-howard-lutnickspeaks- with-cnbcs-brian-sullivan-on-the-exchangetoday. html

Trump on China Putting - America First (Robert C. O’Brien editor)

Remarks: Donald Trump Announces an Economic Investment in the United States - March 3, 2025, available at https://rollcall.com/factbase/trump/transcript/donaldtrump- remarks-economic-investment-united-states-march-3-2025/#2

Speech: Donald Trump Addresses an Republican Dinner in Washington - April 8, 2025, available at https://rollcall.com/factbase/trump/transcript/donaldtrump- speech-nrcc-republican-dinner-april-8- 2025/#161

Microchip USA, How Military Tensions Are Driving the Next Semiconductor Chip Race (July 16, 2025) (last visited Aug. 12, 2025), available at https://www.microchipusa.com/industry-news/howmilitary- tensions-are-driving-the-next-semiconductorchiprace? srsltid=AfmBOopQdXXTBoOGl_bluj9BHhwBF REsja-0SrRhCUKPHwTlW98FCBKI

Another Historic Investment Secured Under President Trump, Articles, The White House (Mar. 3, 2025) (last visited July 14, 2025), available at https://www.whitehouse.gov/articles/2025/03/anotherhistoric- investment-secured-under-president-trump/

Sujai Shivakumar and Charles Wessner, Semiconductors and National Defense: What Are the Stakes?, Center for Strategic International Studies (June 8, 2022) (last visited July 14, 2025), available at https://www.csis.org/analysis/ semiconductors-andnational- defense-what-are-stakes

U.S., Taiwan, and Semiconductors: A Critical Supply Chain Partnership, Final Report, Project 2049 Institute (US-Taiwan Business Counsel June 21, 2023)

Eric Lee, How Taiwan Underwrites the US Defense Industrial Complex, The Diplomat (Nov. 9, 2021) (last visited July 14, 2025), available at https://thediplomat.com/2021/11/how-taiwanunderwrites- the-us-defense-industrial-complex/

Silvia Pellegrino, What is TSMC?, Tech Monitor (Jan. 2, 2023) (last visited July 14, 2025), available at https://www.techmonitor.ai/what-is/what-is-tsmc/?cfview

Patent Owner’s Response and Objections to Petitioner’s First Request for Production of Documents (Contains Material Marked Highly Confidential – Attorneys’ Eyes Only)

U.S. Patent No. 7,067,919 to Watanabe et al. (“Watanabe’919”)

U.S. Patent No. 6,958,542 to Hasunuma et al. (“Hasunuma’542”)

JP4047324 file wrapper - excerpts and Certified Translation of excerpts and Certification of Translation

16/12nm Technology

Petition for Inter Partes Review IPR2025-01212

Removing Barriers to American Leadership in Artificial Intelligence, Presidential Actions, The White House (Jan. 23, 2025) (last visited July 14, 2025), available at https://www.whitehouse.gov/presidentialactions/2025/0 1/removing-barriers-to-american-leadership-inartificialintelligence/

Office of Science and Technology Policy, Executive Office of the President of the United States, Winning the Race: America’s AI Action Plan (July 2025)

U.S.-China Economic and Security Review Commission, 2024 Report to Congress of the U.S.- China Economic and Security Review Commission, 118 Cong., 2d Sess. (2024)

TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design, Ansys (Sept. 25, 2024) (last visited July 14, 2025), available at https://investors.ansys.com/newsreleases/ news-releasedetails/tsmc-expandscollaboration- ansys-integrating-ai-technology

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies, Cadence (Apr. 23, 2025) (last visited July 14, 2025), available at https://www.cadence.com/en_US/home/company/news room/pressreleases/pr/2025/cadence-and-tsmc-advanceai- and-3d-ic-chipdesign-with-certified.html

Silent Giant TSMC Returns to the Peak of its Powers as the AI Boom Continues, Yahoo! finance (June 12, 2025), available at https://finance.yahoo.com/news/silent-giant-tsmcreturnspeak230300515. html?guccounter=1&guce_referrer=aH R0cHM6Ly93d3 cuZ29vZ2xlLmNvbS8&guce_referrer_sig=AQAAAGb NeBi6fbz4 U1LAPZACoSOpXFKhZ2d8Aeym1OTBUscShGSwm 5cDQL_KD bidYk16TkPx7YtIzsB2YbOGeGdO4PchwSBFYrk3fT g3HWrMVsPIL1q7mWa7ZR5e6BG0tbKASjEzPE- 8raiT0KakQ2cXTjpdVs4xTGUvCoXUGlVbDT

Alex He, In the Global AI Chips Race, China Is Playing Catch-Up (September 18, 2024)

Jeff Klearman, Decoding TSMC’s Contribution to the AI and 5G Ecosystem (November 20, 2024), available at https://graniteshares.com/institutional/us/enus/ research/decoding-tsmc-s-contribution-to-the-ai-and- 5g-ecosystem

Charlotte Trueman, Mayo Clinic to use Cerebras chips for medical AI models (January 9, 2024), available at https://www.datacenterdynamics.com/en/news/mayoclinic- to-use-cerebas-chips-for-medical-ai-models/

Vishal Subbiah, A Big Chip for Big Science: Watching the COVID-19 Virus in Action – Cerebras (December 14, 2021), available at https://www.cerebras.ai/blog/abig- chip-for-big-science-watching-the-covid-19-virusin- action

Petitioner's Updated Exhibit List

Petitioner’s Opposition to Patent Owner’s Discretionary Denial Request

Petitioner’s Unopposed Motion to Seal

Patent Owner's Unopposed Motion for Entry of Protective Order

Email Correspondence

Motion for Protective Order

Motion to Seal

EX2026 - SEALED Patent Purchase Agreement

PO Discretionary Denial Brief

EX2001 - AICP v. TSMC Complaint EDTX

EX2002 – AICP v. TSMC Docket Sheet

EX2003 – 2nd Amended DCO DKT 60

EX2004 -DCO DKT 46

EX2005 – 1st Amended DCO DKT 53

EX2006 – AICP Notice of Compliance DKT 45

EX2008 – Declaration of Kemper Diehl

EX2009 -Protective Order DKT 62

EX2010 – TSMC Motion to Stay Pending IPR DKT 47

EX2011 – Order Denying w/o Prejudice TSMC’s Motion to Stay Pending IPR DKT 71

EX2012 - Docket Navigator Time-to-Trial Stats

EX2013 – Lex Machina Time-to-Trial Stats

EX2014 – USPTO Memorandum

EX2015 – U.S. Patent No. 7,632,751

EX2017 – U.S. Patent No. 8,329,572

EX2018 – U.S. Patent No. 8,884,373

EX2019 – Excerpt of TSMC’s Petition for IPR in IPR2025-01210 (‘751)

EX2021 - Excerpt of TSMC’s Petition for IPR in IPR2025-01212 (‘623)

EX2022 - Excerpt of TSMC’s Petition for IPR in IPR2025-01302 (‘373)

EX2023 - Excerpt of TSMC’s Petition for IPR in IPR2025-01305 (‘572)

EX2024 – PO’s Reply to Petitioner’s Opposition to Discretionary Denial in IPR2025-00682

EX2025 – PO’s Reply to Petitioner’s Opposition to Discretionary Denial in IPR2025-00828

EX2027 – 3rd Amended DCO DKT 73

STIPULATION: 7-31-2025 Letter from K. Wheatley (counsel for TSMC) to J. Nelson et al. (counsel for AICP)

Petitioner's Updated Exhibit List

Notice: Notice filing date accorded

Patent Owner's Power of Attorney

Patent Owner's Mandatory Notice

U.S. Patent No. 7,439,623

File History of U.S. Patent No. 7,439,623

U.S. Patent No. 5,250,465 to Iizuka et al.

U.S. Patent Publication No. 2004/0173905 to Kamoshima et al.

U.S. Patent No. 7,042,099 to Kurashima

Kaanta et al., “Dual Damascene: A ULSI Wiring Technology,"

U.S. Patent No. 5,032,890 to Ushiku

U.S. Patent No. 6,156,660 to Liu et al.

U.S. Patent No. 5,798,298 to Yang

Bao et al., “90 nm generation Cu/CVD low-k"

Loke, “Process Integration Issues of Low-Permittivity Dielectrics"

Huang, et al., “Numerical modeling and characterization of the stress"

IEEE Proceedings - Ogawa, et al., “Stress-Induced Voiding Under Vias"

Advanced Metallization - Geometrical Aspects of Stress-Induced Voiding

U.S. Patent No. 6,215,189 to Toyoda et al.

U.S. Patent No. 6,238,850 to Bula et al.

U.S. Patent Publication No. 2003/0116852 to Watanabe et al.

U.S. Patent Publication No. 2004/0113238 to Hasunuma et al.

U.S. Patent No. 6,468,894 to Yang

U.S. Patent No. 6,022,808 to Nogami

U.S. Patent No. 5,885,857 to Yamaha et al.

U.S. Patent Publication No. 2003/0005399 to Igarashi

U.S. Patent No. 6,717,268 to Hau-Riege

Tu, “Recent advances on electromigration in very-large-scale-integration"

Interface - Cooper, "Copper On-Chip Interconnections"

JP2000012688 to Nasu and Certified Translation

Wolf, Silicon Processing for the VLSI Era

EX1018 AICP's P.R. 3-1 Disclosure and P.R. 3-2 in 25-cv-00324-JRG

U.S. Patent No. 6,717,267 to Kunikiyo (Kunikiyo)

JP2002299437 (“Fukazawa”) and Certified Translation of Fukazawa

U.S. Patent Publication No. 2001/0030365 to Otsuka et al. (Otsuka)

JPH10214893 to Fujii (“Fujii”) and Certified Translation of Fujii

Declaration of Dr. Reinhold Dauskardt

Taiwan Semiconductor Manufacturing Company Ltd. Power of Attorney

Petition for Inter Partes Review

Notice Ranking Petitions