Taiwan Semiconductor Manufacturing Company Ltd. et al. - IPR2026-00065

NOTICE OF FILING DATE ACCORDED TO PETITION AND TIME FOR FILING PATENT OWNER PRELIMINARY RESPONSE

EX1001-U.S. Patent No. 11,107,768

EX1002-File History of the ’768 Patent

EX1004-U.S. Patent No. 9,167,694 to Sundaram, et al.

EX1005-U.S. Patent Publication No. 2010/0290191 to Lin, et al.

EX1006-U.S. Patent Publication No. 2011/0215458 to Camacho, et al.

EX1009-U.S. Patent No. 8,709,933 to Haba, et al.

EX1010-U.S. Patent No. 9,123,763 to Yu, et al.

EX1012-Andrea Chen, et al. Semiconductor Packaging Materials Interaction

EX1013-Philip Garrou, et al., RDL an integral part of today’s advanced pack

EX1014-U.S. Patent No. 8,780,576 to Haba, et al.

EX1015-U.S. Patent No. 7,902,648 to Lee

EX1016-U.S. Patent No. 7,964,961 to Lee, et al.

EX1017-U.S. Patent No. 7,241,641 to Savastiouk, et al.

EX1018-U.S. Patent Publication No. 2005/0110168 to Chuang

EX1019-U.S. Patent Publication No. 2011/0026232 to Lin, et al.

EX1020-U.S. Patent No. 5,086,558 to Grube, et al.

EX1021-U.S. Patent Publication No. 2011/0193219 to Lai, et al.

EX1022-U.S. Patent No. 6,818,545 to Lee, et al.

EX1023-U.S. Patent No. 6,974,659 to Su, et al.

EX1024-U.S. Patent Publication No. 2006/0175686 to Murata, et al.

EX1025-U.S. Patent Publication No. 2012/0098124 to Wu, et al.

EX1026-U.S. Patent No. 8,193,604 to Lin et al.

EX1027-U.S. Patent Publication No. 2004/0203224 to Halahan, et al.

EX1028-Philip Garrou, Introduction to 3D Integration

EX1029-U.S. Patent Publication No. 2003/0068877 to Kinsman

EX1030-U.S. Patent Publication No. 2010/0246152 to Lin, et al.

EX1031-Yi Yang, et al, CPU-Assisted GPGPU on Fused CPU-GPU Architectures

EX1035-E.D. Blackshear, et al, The evolution of build-up package technology

EX1037-U.S. Patent No. 7,374,969 to Cho, et al.

EX1040-U.S. Patent No. 6,619,538 to Test, et al.

EX1042-U.S. Patent No. 6,831,003 to Huang, et al.

EX1043-U.S. Patent Publication No. 2009/0226611 to Suzuki, et al.

EX1044-U.S. Patent No. 6,077,726 to Mistry, et al.

EX1045-U.S. Patent Publication No. 2010/0244245 to Pendse, et al.

EX1046-U.S. Patent Publication No. 2012/0206160 to Wu, et al.

EX1047-U.S. Patent Publication No. 2009/0174052 to Sogawa, et al.

EX1048-U.S. Patent Publication No. 2013/0100624 to Carpenter, et al.

EX1049-U.S. Patent No. 7,047,515 to Vitek, et al.

EX1050-U.S. Patent No. 8,116,097 to Love, et al.

EX1051-U.S. Patent Publication No. 2009/0237900 to Origuchi, et al.

EX1052-U.S. Patent Publication No. 2005/0002167 to Hsuan, et al.

EX1053-U.S. Patent Publication No. 2008/0067695 to Chow, et al.

EX1054-U.S. Patent No. 6,489,240 to Iacoponi, et al.

EX1055-U.S. Patent No. 6,578,178 to Mau

EX1056-U.S. Patent Publication No. 2012/0001190 to Okabe, et al.

EX1057-U.S. Patent No. 7,307,348 to Wood, et al.

EX1058-U.S. Patent No. 8,138,014 to Chi, et al.

EX1059-U.S. Patent No. 6,506,672 to Dagenais, et al.

EX1061-U.S. Patent Publication No. 2009/0261473 to Lee, et al.

EX1063-U.S. Patent No. 6,812,143 to Lane, et al.

EX1065-U.S. Patent Publication No. 2011/0147950 to Tai, et al.

EX1066-U.S. Patent Publication No. 2009/0070727 to Solomon

EX1067-U.S. Patent Publication No. 2012/0098114 to Ishibashi

EX1068-U.S. Patent Publication No. 2011/0074028 to Pendse

EX1071-U.S. Patent No. 7,649,368 to Eldridge, et al.

EX1078-U.S. Patent Publication No. 2012/0139068 to Stacey

EX1080-U.S. Patent Publication No. 2012/0319251 to Yu, et al.

EX1081-U.S. Patent No. 7,838,759 to Alley, et al.

EX1082-U.S. Patent No. 6,982,874 to Smalc, et al.

EX1083-U.S. Patent Publication No. 2009/0166069 to Kinoshita

EX1084-U.S. Patent No. 7,759,782 to Haba, et al.

EX1085-U.S. Patent No. 6,946,727 to Ho, et al.

EX1086-U.S. Patent Publication No. 2003/0013298 to May

EX1087-U.S. Patent No. 5,834,945 to Akram, et al.

EX1088-U.S. Patent No. 6,611,046 to Yang

EX1089-U.S. Patent No. 7,638,254 to Hattori, et al.

EX1090-U.S. Patent Publication No. 2005/0156280 to Patel, et al.

EX1091-U.S. Patent Publication No. 2011/0215470 to Chen, et al.

EX1092-Moody Dreiza, et al., High Density PoP (Package-on-Package)

EX1093-U.S. Patent No. 6,107,180 to Munroe, et al.

EX1094-U.S. Patent Publication No. 2011/0210283 to Ramirez, et al.

EX1095-U.S. Patent No. 6,452,502 to Dishongh, et al.

EX1096-U.S. Patent No. 6,344,401 to Lam

EX1097-Richard K. Ulrich, et al., Advanced Electronic Packaging, IEEE Press

EX1098-Mulugeta Abtew, et al., Lead-free Solders in Microelectronics

EX1099-Karl J. Puttlitz, et al., Handbook of Lead-Free Solder Technology

EX1100-U.S. Patent Publication No. 2013/0309832 to Cheng, et al.

EX1101-U.S. Patent Publication No. 2013/0151869 to Steinman, et al.

EX1102-Linely Gwennap, Sandy Bridge Spans Generations

EX1104-U.S. Patent No. 6,710,447 to Nogami

EX1105-U.S. Patent Publication No. 2011/0059305 to Kaneya, et al.

EX1106-U.S. Patent No. 7,057,896 to Matsuo, et al.

EX1107-U.S. Patent No. 7,777,333 to Bachman, et al.

EX1108-U.S. Patent No. 7,095,105 to Cherukuri, et al.

EX1109-U.S. Patent No. 7,423,347 to Chen, et al.

EX1110-U.S. Patent Publication No. 2008/0128891 to Ziglioli, et al.

EX1111-U.S. Patent Publication No. 2008/0042280 to Lin, et al.

EX1112-U.S. Patent No. 7,923,836 to Farooq, et al.

EX1113-U.S. Patent Publication No. 2005/0121711 to Pogge, et al.

EX1114-U.S. Patent Publication No. 2012/0313240 to Cheng, et al.

EX1115-U.S. Patent No. 7,262,444 to Fillion, et al.

EX1116-U.S. Patent Publication No. 2013/0037944 to Lee, et al.

EX1126-U.S. Patent No. 8,592,988 to Lee, et al.

EX1128-U.S. Patent No. 6,528,179 to Jimarez, et al.

EX1129-U.S. Patent No. 6,468,413 to Fanti, et al.

EX1130-U.S. Patent No. 8,132,775 to Goldmann

EX1131-U.S. Patent Publication No. 2011/0186977 to Chi, et al.

EX1132-U.S. Patent No. 7,169,627 to Duh, et al.

EX1133-U.S. Patent No. 6,614,243 to Klehn, et al.

EX1134-U.S. Patent Publication No. 2009/0162622 to Van Veen, et al.

EX1136-U.S. Patent No. 7,741,567 to Beddingfield, et al.

EX1137-U.S. Patent No. 6,407,341 to Anstrom, et al.

EX1135-U.S. Patent No. 6,570,259 to Alcoe, et al.

EX1003 - Declaration Dr Shanfield '768 Patent

Petition for Inter Partes Review of U.S. Patent No. 11,107,768

Petitioner TSMC Power of Attorney

Petitioner Apple Power of Attorney