Taiwan Semiconductor Manufacturing Company Ltd. et al. v. MYW Semitech, LLC - IPR2026-00066

Email correspondence

Petitioners’ Opposition to Patent Owner’s Request for Discretionary Denial

EX1139-Revision to Rules of Practice Before the Patent Trial and Appeal Board, 90 Fed. Reg. 48335 (Oct. 17, 2025) (to be codified at 37 CFR pt. 42)

EX1140-MYW Semitech, LLC v. Apple Inc., No. 1:25-cv-00504, Dkt. 26, Scheduling Order (D. Del. Sept. 5, 2025)

EX1145-Apple iPhone 7 Introduction Press Release, dated Sept. 7, 2016

EX1146-MYW Semitech, LLC v. Apple Inc., No. 1:25-cv-00504, Dkt. 18, Amended Complaint (D. Del. July 7, 2025)

EX1147-MYW Semitech, LLC v. Apple Inc., No. 1:25-cv-00504, Dkt. 83, Order (D. Del. Feb. 12, 2026) (“Semitech Order”)

EX1148-MYW Semitech, LLC v. Apple Inc., No. 1:25-cv-00504, Hearing Transcript (D. Del. Feb. 12, 2026) (“Hearing Transcript”)

EX1149-MYW Semitech, LLC v. Apple Inc., No. 1:25-cv-00504, Dkt. 87, Apple’s Responsive Letter (D. Del. Feb. 13, 2025)

EX1150-Docket Navigator’s Statistics for Judge Andrew’s Motion for Stay Pending IPR (Post-Institution) Success

EX1151-Chief Administrative Patent Judge Boalick’s Memorandum dated March 24, 2025

EX1152-CNBC Transcript: United States Commerce Secretary Howard Lutnick Speaks with CNBC’s Brian Sullivan on “The Exchange” Today, CNBC (Apr. 29. 2025), available at https://www.cnbc.com/2025/04/29/cnbc-transcript-united-states-commerce-secretary-howard-lutnick-speaks-with-cnbcs-brian-sullivan-on-the-exchange-today.html

EX1153-Trump on China Putting - America First (Robert C. O’Brien editor)

EX1154-Remarks: Donald Trump Announces an Economic Investment in the United States - March 3, 2025, available at https://rollcall.com/factbase/trump/transcript/donald-trump-remarks-economic-investment-united-states-march-3-2025/#2

EX1155-Speech: Donald Trump Addresses an Republican Dinner in Washington - April 8, 2025, available at https://rollcall.com/factbase/trump/transcript/donald-trump-speech-nrcc-republican-dinner-april-8-2025/#161

EX1156-Another Historic Investment Secured Under President Trump, Articles, The White House (Mar. 3, 2025), available at https://www.whitehouse.gov/articles/2025/03/another-historic-investment-secured-under-president-trump/

EX1157-Jeremy Bowman, Nasdaq, This 1 Number May Ensure TSMC’s Market Dominance, The Motley Fool (Aug. 17, 2024), available at https://www.nasdaq.com/articles/1-number-may-ensure-tsmcs-market-dominance

EX1158-TSMC Arizona Webpage, available at https://www.tsmc.com/static/abouttsmcaz/index.htm

EX1159-Silvia Pellegrino, What is TSMC?, Tech Monitor (Jan. 2, 2023), available at https://www.techmonitor.ai/what-is/what-is-tsmc/?cf-view

EX1160-U.S. Patent No. 11,107,768 to Yang

EX1161-U.S. Patent No. 8,709,933 to Haba, et al.

Petitioners’ Opposition to Patent Owner’s Motion to Seal and Petitioners’ Unopposed Request to Modify Default Protective Order

Patent Owner's Preliminary Response

Exhibit 2014

Exhibit 2015

Patent Owner's Motion for Entry of Default Protective Order and Motion to Seal

Exhibit 2001

Exhibit 2002

Exhibit 2003

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Exhibit 2006

Exhibit 2007

Exhibit 2008

Exhibit 2009

Exhibit 2010

Exhibit 2011

Exhibit 2012

Exhibit 2013

Patent Owner's Discretionary Denial Brief

Petitioners' Updated Exhibit List

EX1138-Email to Patent Owner’s Counsel with Stipulation

Notice: Mandatory Notice

Notice: Power of Attorney

NOTICE OF FILING DATE ACCORDED TO PETITION AND TIME FOR FILING PATENT OWNER PRELIMINARY RESPONSE

EX1001-U.S. Patent No. 11,538,763

EX1002-File History of the ’763 Patent

EX1004-U.S. Patent No. 9,167,694 to Sundaram, et al.

EX1005-U.S. Patent Publication No. 2010/0290191 to Lin, et al.

EX1006-U.S. Patent Publication No. 2011/0215458 to Camacho, et al.

EX1007-U.S. Patent No. 9,679,863 to Lin, et al.

EX1008-U.S. Patent Publication 2011/0266691 to Lin, et al.

EX1010-U.S. Patent No. 9,123,763 to Yu, et al.

EX1011-U.S. Patent Publication 2014/0035935 to Shenoy, et al.

EX1012-Andrea Chen, et al. Semiconductor Packaging Materials Interaction

EX1013-Philip Garrou, et al., RDL an integral part of today’s advanced pack

EX1014-U.S. Patent No. 8,780,576 to Haba, et al.

EX1015-U.S. Patent No. 7,902,648 to Lee

EX1016-U.S. Patent No. 7,964,961 to Lee, et al.

EX1017-U.S. Patent No. 7,241,641 to Savastiouk, et al.

EX1018-U.S. Patent Publication No. 2005/0110168 to Chuang

EX1019-U.S. Patent Publication No. 2011/0026232 to Lin, et al.

EX1020-U.S. Patent No. 5,086,558 to Grube, et al.

EX1021-U.S. Patent Publication No. 2011/0193219 to Lai, et al.

EX1022-U.S. Patent No. 6,818,545 to Lee, et al.

EX1023-U.S. Patent No. 6,974,659 to Su, et al.

EX1024-U.S. Patent Publication No. 1006/0175686 to Murata, et al.

EX1025-U.S. Patent Publication No. 2012/0098124 to Wu, et al.

EX1026-U.S. Patent No. 8,193,604 to Lin et al.

EX1027-U.S. Patent Publication No. 2004/0203224 to Halahan, et al.

EX1028-Philip Garrou, Introduction to 3D Integration

EX1029-U.S. Patent Publication No. 2003/0068877 to Kinsman

EX1030-U.S. Patent Publication No. 2010/0246152 to Lin, et al.

EX1031-Yi Yang, et al, CPU-Assisted GPGPU on Fused CPU-GPU Architectures

EX1032-File History of the ’768 Patent

EX1033-U.S. Patent No. 4,863,773 to Rousseau, et al.

EX1034-U.S. Patent No. 6,365,265 to Tose, et al.

EX1035-E.D. Blackshear, et al, The evolution of build-up package technology

EX1037-U.S. Patent No. 7,374,969 to Cho, et al.

EX1038-U.S. Patent No. 7,199,036 to Chan, et al.

EX1039-U.S. Patent No. 8,158,508 to Lin, et al.

EX1040-U.S. Patent No. 6,619,538 to Test, et al.

EX1041-U.S. Patent Publication No. 2011/0101523 to Hwang, et al.

EX1042-U.S. Patent No. 6,831,003 to Huang, et al.

EX1043-U.S. Patent Publication No. 2009/0226611 to Suzuki, et al.

EX1044-U.S. Patent No. 6,077,726 to Mistry, et al.

EX1045-U.S. Patent Publication No. 2010/0244245 to Pendse, et al.

EX1046-U.S. Patent Publication No. 2012/0206160 to Wu, et al. (“Wu”)

EX1047-U.S. Patent Publication No. 2009/0174052 to Sogawa, et al.,

EX1048-U.S. Patent Publication No. 2013/0100624 to Carpenter, et al.

EX1049-U.S. Patent No. 7,047,515 to Vitek, et al.

EX1050-U.S. Patent No. 8,116,097 to Love, et al.

EX1051-U.S. Patent Publication No. 2009/0237900 to Orguchi, et al.

EX1052-U.S. Patent Publication No. 2005/0002167 to Hsuan, et al.

EX1053-U.S. Patent Publication No. 2008/0067695 to Chow, et al.

EX1054-U.S. Patent No. 6,489,240 to Iacoponi, et al.,

EX1055-U.S. Patent No. 6,578,178 to Mau

EX1056-U.S. Patent Publication No. 2012/0001190 to Okabe, et al.

EX1057-U.S. Patent No. 7,307,348 to Wood, et al.

EX1058-U.S. Patent No. 8,138,014 to Chi, et al.

EX1059-U.S. Patent No. 6,506,672 to Dagenais, et al.

EX1060-U.S. Patent No. 8,518,798 to Graetz

EX1061-U.S. Patent Publication No. 2009/0261473 to Lee, et al.

EX1062-U.S. Patent No. 6,440,289 to Woo, et al.

EX1063-U.S. Patent No. 6,812,143 to Lane, et al.

EX1064-U.S. Patent Publication No. 2012/0145552 to Nagai, et al.

EX1065-U.S. Patent Publication No. 2011/0147950 to Tsi, et al.

EX1066-U.S. Patent Publication No. 2009/0070727 to Solomon

EX1067-U.S. Patent Publication No. 2012/0098114 to Ishibashi

EX1068-U.S. Patent Publication No. 2011/0074028 to Pendse

EX1069-U.S. Patent No. 7,485,955 to Kang, et al.

EX1070-U.S. Patent Publication No. 2012/0104623 to Pagaila, et al.

EX1072-U.S. Patent No. 7,772,880 to Solomon

EX1073-U.S. Patent No. 7,989,270 to Huang, et al.

EX1074-U.S. Patent Publication No. 2011/0304999 to Yu, et al

EX1075-U.S. Patent Publication No. 2009/0117327 to Takada

EX1076-U.S. Patent Publication No. 2005/0081744 to Klocke, et al.,

EX1077-U.S. Patent No. 6,291,082 to Lopatin

EX1080-U.S. Patent Publication No. 2012/0319251 to Yu, et al.

EX1090- U.S. Patent Publication No. 2005/0156280 to Patel, et al.

EX1093-U.S. Patent No. 6,107,180 to Munroe, et al.

EX1094-U.S. Patent Publication No. 2011/0210283 to Ramirez, et al.

EX1095-U.S. Patent No. 6,542,502 to Dishongh, et al.

EX1096-U.S. Patent No. 6,344,401 to Lam

EX1097-Richard K. Ulrich, et al., Advanced Electronic Packaging, IEEE Press

EX1098-Mulugeta Abtew, et al., Lead-free Solders in Microelectronics

EX1099-Karl J. Puttlitz, et al., Handbook of Lead-Free Solder Technology

EX1100-U.S. Patent Publication No. 2013/0309832 to Cheng, et al.

EX1101-U.S. Patent Publication No. 2013/0151869 to Steinman, et al.

EX1102-Linely Gwennap, Sandy Bridge Spans Generations

EX1103-U.S. Patent No. 6,330,164 to Khandros, et al.

EX1104-U.S. Patent No. 6,710,447 to Nogami

EX1127-U.S. Patent No. 8,238,113 to Iihola, et al.

EX1129-U.S. Patent No. 6,468,413 to Fanti, et al.

EX1130-U.S. Patent No. 8,132,775 to Goldman

EX1131-U.S. Patent Publication No. 2011/0186977 to Chi, et al.

EX1132-U.S. Patent No. 7,169,627 to Duh, et al.

EX1133-U.S. Patent No. 6,614,243 to Klehn, et al.

EX1134-U.S. Patent Publication No. 2009/0162622 to Van Veen, et al.

EX1135-U.S. Patent No. 6,570,259 to Alcoe, et al.

EX1136-U.S. Patent No. 7,741,567 to Beddingfield, et al.

EX1137-U.S. Patent No. 6,407,341 to Anstrom, et al.

EX1003 - Declaration Dr Shanfield '763 Patent

Petition for Inter Partes Review of U.S. Patent No. 11,538,763

Petitioner TSMC Power of Attorney

Petitioner Apple Power of Attorney