Patent Owner’s Request for Discretionary Denial | Jun 2, 2026 | PAPER | PATENT OWNER |
U.S. Patent No. 9,859,202 | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Plaintiff’s Original Complaint, TopWire LLC, v. Samsung Electronics Co., Ltd. and Samsung Electronics America, Inc., ECF No. 1, No. 2:25-cv-01183-JRG (E.D. Tex. December 1, 2025) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Plaintiff’s Original Complaint, TopWire, LLC v. Apple Inc., No. 7:25-cv-00551-ADA, ECF No. 1 (W.D. Tex. December 1, 2025) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Plaintiff’s Disclosure of Asserted Claims and Infringement Contentions, TopWire, LLC v. Samsung Electronics Co., Ltd. and Samsung Electronics America, Inc., No. 2:25-cv-01183-JRG (E.D. Tex. March 12, 2025) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Petition for Inter Partes Review of U.S. Patent No. 9,859,202, IPR2026-00303, Paper 2, (PTAB March 16, 2026) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Notice of References Cited, U.S. Patent Application No. 17/185,283 | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Office Action Summary, U.S. Patent Application No. 17/185,283 | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
U.S. Patent No. 11,483,930 | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Information Disclosure Statement by Applicant, U.S. Patent Application No. 17/185,283 (October 21, 2022) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Information Disclosure Statement by Applicant, U.S. Patent Application No. 18/502,657 (November 6, 2023) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Information Disclosure Statement by Applicant, U.S. Patent Application No. 19/077,672 (March 12, 2025) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Letter from R. Katz to Samsung Electronics Co., Ltd. Re: TopWire LLC (September 19, 2025) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Chart showing statistics regarding success rates of motions to stay case pending inter partes review over the past five years | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
“PTAB Trial Statistics”, United States Patent and Trademark Office, Patent Trial and Appeal Board, Fiscal Year 2026 2nd Quarter | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Docket Control Order, TopWire LLC, v. Samsung Electronics Co., Ltd. and Samsung Electronics America, Inc., ECF No. 21, No. 2:25-cv-01183-JRG (E.D. Tex. April 7, 2026) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
First Amended Docket Control Order, TopWire LLC, v. Samsung Electronics Co., Ltd. and Samsung Electronics America, Inc., ECF No. 29, No. 2:25-cv-01183-JRG (E.D. Tex. May 11, 2026) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Discovery Order, TopWire LLC, v. Samsung Electronics Co., Ltd. and Samsung Electronics America, Inc., ECF No. 23, No. 2:25-cv-01183-JRG (E.D. Tex. April 13, 2026) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Protective Order, TopWire LLC, v. Samsung Electronics Co., Ltd. and Samsung Electronics America, Inc., ECF No. 27, No. 2:25-cv-01183-JRG (E.D. Tex. April 22, 2026) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Letter from S. Keller to N. Sirota regarding Discovery Expectations (May 18, 2026) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Letter from F. Zhu to W. McCarty, III regarding Discovery Expectations (May 20, 2026) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Plaintiff’s First Set of Interrogatories, TopWire LLC, v. Samsung Electronics Co., Ltd. and Samsung Electronics America, Inc., No. 2:25-cv-01183-JRG (E.D. Tex. May 18, 2026) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Defendants’ First Set of Interrogatories to Plaintiff, TopWire LLC, v. Samsung Electronics Co., Ltd. and Samsung Electronics America, Inc., No. 2:25-cv-01183-JRG (E.D. Tex. May 20, 2026) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Defendants’ Initial Invalidity Contentions, TopWire LLC, v. Samsung Electronics Co., Ltd. and Samsung Electronics America, Inc., No. 2:25-cv-01183-JRG (E.D. Tex. May 21, 2026) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Email from S. Liquori to Counsel for Plaintiff re Defendants’ Initial Invalidity Contentions (May 21, 2026) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Additional Discretionary Institution Considerations – U.S. Manufacturing and Small Business Use of AIA Proceedings (“U.S. Manufacturing Memo”) | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Adnan Farooqui, “Where are Samsung phones made? It’s not where you think”, Sammobile.com, May 12, 2026 | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Adnan Farooqui, “Samsung confirms it may relocate some production sites to avoid US tariff impact”, Sammobile.com, April 30, 2025 | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Listing of Samsung’s Foreign Suppliers, Samsung.com | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
John VerWay, “Re-Shoring Advanced Semiconductor Packaging”, Center for Security and Emerging Technology, June 2022 | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Global Network, Samsung Electro-Mechanics | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
“Samsung Electronics to Invest $4 Billion in Advanced Packaging Plant in Vietnam, Intensifying AI Semiconductor Competition”, BigGo Finance, April 9, 2026 | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
“[News] Samsung Reportedly Plans $170M Chip Packaging R&D Center in Yokohama, Opening Mar. 2027”, Trendforce, August 14, 2025 | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
“Our Taylor, Texas Fab in Numbers”, Samsung Semiconductor Global | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Arjun Kharpal, “Samsung to spend $228 Billion on the world’s largest chip facility as part of South Korea tech plan”, CNBC, March 15, 2023 | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Travis E. Poling, “Samsung says it’s on track for 2026 opening”, Taylor Press, February 11, 2026 | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
“Samsung Electronics to receive up to $6.4 billion in direct funding under the CHIPS and Science Act”, Samsung.com, April 14, 2024 | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
“PTAB Appeal Statistics”, United States Patent and Trademark Office, Patent Trial and Appeal Board, April 30, 2026 | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
“PTAB data at a glance”, Patent Trial and Appeal Board, March 2026 | Jun 2, 2026 | EXHIBIT | PATENT OWNER |
Notice: Mandatory Notice | Apr 21, 2026 | PAPER | PATENT OWNER |
Notice: Power of Attorney | Apr 21, 2026 | PAPER | PATENT OWNER |
Notice: NOTICE OF FILING DATE ACCORDED TO PETITION AND TIME FOR FILING PATENT OWNER PRELIMINARY RESPONSE | Apr 2, 2026 | PAPER | BOARD |
USP. 9,859,202 | Mar 31, 2026 | EXHIBIT | PETITIONER |
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225-cv-01183 Complaint | Mar 31, 2026 | EXHIBIT | PETITIONER |
USP Pub 2011_0147908 | Mar 31, 2026 | EXHIBIT | PETITIONER |
USP Pub 2013_0182402 | Mar 31, 2026 | EXHIBIT | PETITIONER |
USP 5,334,804 | Mar 31, 2026 | EXHIBIT | PETITIONER |
USP Pub 2013_0249083 | Mar 31, 2026 | EXHIBIT | PETITIONER |
Benson, Polymer Adhesives and Encapsulants | Mar 31, 2026 | EXHIBIT | PETITIONER |
USP 8,379,403 | Mar 31, 2026 | EXHIBIT | PETITIONER |
IPC-4761 Design Guide | Mar 31, 2026 | EXHIBIT | PETITIONER |
Hall-Ellis Declaration | Mar 31, 2026 | EXHIBIT | PETITIONER |
USP Pub 2008_0155820 | Mar 31, 2026 | EXHIBIT | PETITIONER |
Osborn, All-Copper Chip-to-Substrate Interconnects | Mar 31, 2026 | EXHIBIT | PETITIONER |
Henderson, Copper Pillar Bumping Technology | Mar 31, 2026 | EXHIBIT | PETITIONER |
Kreidl, Steering Electronics | Mar 31, 2026 | EXHIBIT | PETITIONER |
IPC-T-50M Terms and Definitions | Mar 31, 2026 | EXHIBIT | PETITIONER |
Cohn, Electronic Packaging and Interconnection Handbook. | Mar 31, 2026 | EXHIBIT | PETITIONER |
Vintage Computer, IBM PCAT) | Mar 31, 2026 | EXHIBIT | PETITIONER |
Mangrum, Packaging Technologies for Mobile Platforms | Mar 31, 2026 | EXHIBIT | PETITIONER |
ICE, Roadmaps of Packaging Technology | Mar 31, 2026 | EXHIBIT | PETITIONER |
Kenny, From Thin Cores to Outer Layers Filling through Holes | Mar 31, 2026 | EXHIBIT | PETITIONER |
JESD47F Stress-Test-Driven Qualification of Integrated Circuits | Mar 31, 2026 | EXHIBIT | PETITIONER |
IPC-TM-650 Test Methods Manual | Mar 31, 2026 | EXHIBIT | PETITIONER |
Koide, High-performance Flip-Chip BGA Technology | Mar 31, 2026 | EXHIBIT | PETITIONER |
Graf, Modern Dictionary of Electronics | Mar 31, 2026 | EXHIBIT | PETITIONER |
Tummala, Microelectronics Packaging Handbook | Mar 31, 2026 | EXHIBIT | PETITIONER |
Baldwin, Fundamentals of Microsystem Packaging | Mar 31, 2026 | EXHIBIT | PETITIONER |
Wang, Studies on A Novel Flip-Chip Interconnect Structure | Mar 31, 2026 | EXHIBIT | PETITIONER |
Elenius CV | Mar 31, 2026 | EXHIBIT | PETITIONER |
Elenius Declaration | Mar 31, 2026 | EXHIBIT | PETITIONER |
Petition for Inter Partes Review of USP 9,859,202: as filed | Mar 31, 2026 | PAPER | PETITIONER |
Notice: Power of Attorney for SEA | Mar 31, 2026 | PAPER | PETITIONER |
Notice: Power of Attorney for SEC | Mar 31, 2026 | PAPER | PETITIONER |
Stipulation | Mar 31, 2026 | EXHIBIT | PETITIONER |