IP Verse

Samsung Electronics Co., Ltd. et al. - IPR2026-00324

Explore the PTAB proceeding IPR2026-00324 filed by Samsung Electronics Co., Ltd. et al. on Mar 31, 2026. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.

Case Details

Proceeding Number: IPR2026-00324
Filing Date: Mar 31, 2026
Petitioner: Samsung Electronics Co., Ltd. et al.
Status: Pending
Respondent Application Number: 15190695
Respondent Tech Center: 2800
Respondent Patent Number: 9859202

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Proceeding Documents

The table below shows documents filed in the case, listing each document name, filing date, document type, and filing party. Tracking these filings indicates the activity of the parties involved in the case, and the types of documents filed can provide insights into the legal strategies being employed.

Show Exhibit Documents

Document Name	Filing Date	Category	Filing Party
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Notice: NOTICE OF FILING DATE ACCORDED TO PETITION AND TIME FOR FILING PATENT OWNER PRELIMINARY RESPONSE	Apr 2, 2026	PAPER	BOARD
USP. 9,859,202	Mar 31, 2026	EXHIBIT	PETITIONER
202 FH	Mar 31, 2026	EXHIBIT	PETITIONER
225-cv-01183 Complaint	Mar 31, 2026	EXHIBIT	PETITIONER
USP Pub 2011_0147908	Mar 31, 2026	EXHIBIT	PETITIONER
USP Pub 2013_0182402	Mar 31, 2026	EXHIBIT	PETITIONER
USP 5,334,804	Mar 31, 2026	EXHIBIT	PETITIONER
USP Pub 2013_0249083	Mar 31, 2026	EXHIBIT	PETITIONER
Benson, Polymer Adhesives and Encapsulants	Mar 31, 2026	EXHIBIT	PETITIONER
USP 8,379,403	Mar 31, 2026	EXHIBIT	PETITIONER
IPC-4761 Design Guide	Mar 31, 2026	EXHIBIT	PETITIONER
Hall-Ellis Declaration	Mar 31, 2026	EXHIBIT	PETITIONER
USP Pub 2008_0155820	Mar 31, 2026	EXHIBIT	PETITIONER
Osborn, All-Copper Chip-to-Substrate Interconnects	Mar 31, 2026	EXHIBIT	PETITIONER
Henderson, Copper Pillar Bumping Technology	Mar 31, 2026	EXHIBIT	PETITIONER
Kreidl, Steering Electronics	Mar 31, 2026	EXHIBIT	PETITIONER
IPC-T-50M Terms and Definitions	Mar 31, 2026	EXHIBIT	PETITIONER
Cohn, Electronic Packaging and Interconnection Handbook.	Mar 31, 2026	EXHIBIT	PETITIONER
Vintage Computer, IBM PCAT)	Mar 31, 2026	EXHIBIT	PETITIONER
Mangrum, Packaging Technologies for Mobile Platforms	Mar 31, 2026	EXHIBIT	PETITIONER
ICE, Roadmaps of Packaging Technology	Mar 31, 2026	EXHIBIT	PETITIONER
Kenny, From Thin Cores to Outer Layers Filling through Holes	Mar 31, 2026	EXHIBIT	PETITIONER
JESD47F Stress-Test-Driven Qualification of Integrated Circuits	Mar 31, 2026	EXHIBIT	PETITIONER
IPC-TM-650 Test Methods Manual	Mar 31, 2026	EXHIBIT	PETITIONER
Koide, High-performance Flip-Chip BGA Technology	Mar 31, 2026	EXHIBIT	PETITIONER
Graf, Modern Dictionary of Electronics	Mar 31, 2026	EXHIBIT	PETITIONER
Tummala, Microelectronics Packaging Handbook	Mar 31, 2026	EXHIBIT	PETITIONER
Baldwin, Fundamentals of Microsystem Packaging	Mar 31, 2026	EXHIBIT	PETITIONER
Wang, Studies on A Novel Flip-Chip Interconnect Structure	Mar 31, 2026	EXHIBIT	PETITIONER
Elenius CV	Mar 31, 2026	EXHIBIT	PETITIONER
Elenius Declaration	Mar 31, 2026	EXHIBIT	PETITIONER
Petition for Inter Partes Review of USP 9,859,202: as filed	Mar 31, 2026	PAPER	PETITIONER
Notice: Power of Attorney for SEA	Mar 31, 2026	PAPER	PETITIONER
Notice: Power of Attorney for SEC	Mar 31, 2026	PAPER	PETITIONER
Stipulation	Mar 31, 2026	EXHIBIT	PETITIONER