Extrudable Hot-Melt Pressure-Sensitive Adhesives For Resealable Packaging Having Improved Organoleptic Properties - EP2966140

The patent EP2966140 was granted to Bostik on May 10, 2017. The application was originally filed on Jun 29, 2015 under application number EP15174317A. The patent is currently recorded with a legal status of "Opposition Rejected".

EP2966140

BOSTIK
Application Number
EP15174317A
Filing Date
Jun 29, 2015
Status
Opposition Rejected
May 19, 2023
Grant Date
May 10, 2017
External Links
Slate, Register, Google Patents

Patent Summary

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Patent Family

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LEHMANN&VOSS&Feb 12, 2018UEXKULL & STOLBERGADMISSIBLE

Patent Citations (21) New

Patent citations refer to prior patents cited during different phases such as opposition or international search.

Citation PhasePublication NumberPublication Link
DESCRIPTIONEP1053952
DESCRIPTIONUS2013029553
DESCRIPTIONUS4673601
DESCRIPTIONWO02064694
DESCRIPTIONWO2012045950
DESCRIPTIONWO2012045951
DESCRIPTIONWO2014020243
OPPOSITIONEP2946920
OPPOSITIONUS2004007322
OPPOSITIONUS2004077759
OPPOSITIONUS2011162782
OPPOSITIONUS2013233911
OPPOSITIONUS2014024513
OPPOSITIONWO2008042645
OPPOSITIONWO2011011729
OPPOSITIONWO2012045951
OPPOSITIONWO2014020243
OPPOSITIONWO9920709
SEARCHEP2687362
SEARCHFR2965213
SEARCHWO2010012906

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Dossier Documents

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