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Latest oppositions filed by Bostik

Explore patent oppositions filed by Bostik against competitors, revealing strategic technology disputes and market positioning. Monitor opposition details, timelines, and disputed innovations to understand competitive dynamics and IP enforcement strategy.

Patent NumberTitleApplicantOpposition Date
EP3689996High Strength And Elongation, Label Free, Silyl Modified Polymer Adhesive CompositionSTRONGBONDMay 7, 2024
EP3234057Hot Melt Adhesive Composition For Bonding Packs Of Plastic ContainersH B FULLERJul 20, 2021
EP3234058Hot Melt Adhesive Composition For Bonding Packs Of Metal ContainersH B FULLERJul 20, 2021
EP2931770Low-Modulus Silylated PolyurethanesHENKELMay 14, 2020
EP3003410An Elastic Attachment Adhesive And A Disposable Absorbent Article Made With The SameH B FULLERJul 23, 2019

Explore Bostik's recently opposed patents, revealing key competitive challenges and strategic patent disputes in the industry. Track oppositions filed by competitors to understand technology battlegrounds and assess potential risks.

Patent NumberGrant DateTitleTotal Oppositions
EP2949676Feb 22, 2023Non-Hot-Melt Mdi-Based Polyurethane Composition Bearing Nco End Groups And Having A Low Content Of Mdi Monomer, Comprising At Least One Isocyanate Compound Of Particular Molar Volume1
EP2999760Apr 13, 2022Hot Melt Adhesive Based On Low Melting Point Polypropylene Homopolymers1
EP3159388Jan 19, 2022Hot-Melt Adhesive Composition For Elastic Attachments1
EP3402857Jun 17, 2020Hot Melt Adhesive Composition Based On A Blend Of Propylene Copolymers Prepared Using Single-Site Catalysts And Methods1
EP3247758Dec 25, 2019Metallocene Polyolefin Based Low Activation Temperature Heat Seal Hot Melt Adhesive2
EP3024856Aug 29, 2018Hydrocarbon Polymers Having An Alkoxysilane End Group1
EP2934413Jul 5, 2017Fluid-Absorbent Article1
EP2966140May 10, 2017Extrudable Hot-Melt Pressure-Sensitive Adhesives For Resealable Packaging Having Improved Organoleptic Properties1