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Hot Melt Adhesive Based On Low Melting Point Polypropylene Homopolymers

Patent No. EP2999760 (titled "Hot Melt Adhesive Based On Low Melting Point Polypropylene Homopolymers") was filed by Bostik on May 21, 2014. The application was issued on Apr 13, 2022.

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HENKELJan 13, 2023-

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EP2999760

BOSTIK
Application Number
EP14734311A
Filing Date
May 21, 2014
Status
Revoked
May 16, 2025
Publication Date
Apr 13, 2022
External Links
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